• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1770-1773
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• 2005

The performance evaluation of AOV(air-operated valve) requires the processes to confirm the actuator system capability. It is necessary to evaluate the thrust of the air actuator for the margin evaluation. In this paper, to evaluate and analysis the air actuator, the performance test system and operating program are developed. This system is composed of several sensors such as pressure sensor, LVDT, and LoadCell which are used to get the data for evaluation. The LabVIEW was used for developing the operating program. The test system and operating program are proved through the actual test of the diaphragm actuator.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.2
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• pp.1-6
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• 2008

In recent years, developments in the semiconductor and electronic industries have brought a rapid increase in the use of large size silicon wafer. For further improvement of the ultra precision surface and flatness of Si wafer necessary to high density ULSI, it is known that polishing is very important. However, most of these investigation was experiment less than 300mm diameter. Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This study reports the machining variables that has major influence on the characteristic of wafer polishing. It was adapted to polishing pressure, machining speed, and the slurry mix ratio, the optimum condition is selected by ultra precision wafer polishing using load cell and infrared temperature sensor. The optimum machining condition is selected a result data that use a pressure and table speed data. By using optimum condition, it achieves a ultra precision mirror like surface.

• Applied Biological Chemistry
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• v.30 no.1
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• pp.65-70
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• 1987

In Girder to measure the pressure and weight decrease of drying sample during the vacuum drying process of food, sensing devices were designed and constructed with strain gauge. Microcomputer based vacuum drying system was made up of these devices interfaced to apple II microcomputer. The electrical output signal from vacuum sensor which constituted with Bourdon tube whereon strain gauge attached were digitalized and input to microcomputer through the MC 6821 interface I.C. chip. The relationship between read-out digital value (D) from microcomputer and readings of vacuum gauge (P, mmHg) was P=-146.136+3.620D'(r=0.9994) The pressure control of vacuum dryer was successfully conducted in the range of $400{\sim}600\;mmHg$ accuracy. The digitalized load cell output (D) could be correlated with the real weight (W, g) as W=-14,000+0.585D (r=0.9998) Drying curves of green red pepper under $64^{\circ}C$, $400{\sim}600\;mmHg$ was similar to those of red pepper and differently affected by the degree of vacuum pressure but was varied according to their shape (cut or whole). Moisture movement of green red pepper during the vacuum drying process was fitted to Page model. The empirical equations obtained were $M-M_e/M_o-M_e={\exp}\;(-0.0673{\theta}^{1.177})$ and $M-M_e/M_o-M_e={\exp}\;(-0.0655\;{\theta}^{1.477})$ for whole and cut green red pepper, respectively.