• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.905-909
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• 1997

A geometric error of machine parts is one of the most important factors that affect the accuracy of positioning, generating and measuring for precision machinery. It is known that the thermal deformation of a workpiece during surface grinding is the most important in the geometric error of ground surface. This paper experimentally describes the grinding characteristics of creep-feed grinding. The wheels have 6 slotted pieces in order to compare the grinding temperature with the geometric.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.10
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• pp.26-33
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• 2004

Ultra precision grinding technology has been developed from the refinement of the abrasive, the development of high stiffness equipment and grinding skill. The conventional wafering process which consists of lapping, etching, 1 st, 2nd and 3rd polishing has been changed to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Furthermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focuses on the flatness of the ground wafer. Generally, the ground wafer has concave pronto because of the difference of wheel path density, grinding temperature and elastic deformation of the equipment. Wafer tilting is applied to avoid non-uniform material removal. Through the geometric analysis of wafer grinding process, the profile of the ground wafer is predicted by the development of profile simulator.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.98-101
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive. the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, 1st, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the flatness of the ground wafer. Generally, the ground wafer has concave profile because of the difference of wheel path density, grinding temperature and elastic deformation of the equiptment. Tilting mathod is applied to avoid such non-uniform material removes. So, in this paper, the geometric analysis on grinding process is carried out, and then, we can predict the profile of th ground wafer by using profile simulation.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.11a
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• pp.90-94
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• 1996

Thermal problems of creep-feed grinding are more serious than regular grinding. So grinding fluid supply in creep-feed grinding is very important. Grinding fluid supply quantity is not linear with effectiveness because grinding wheel is porosity material and the grinding area is solid contact area. In this paper, by using AE signal, optimal quantity of fluid supply was determined. And surface characteristics of wet creep-feed grinding were analized.

• International Journal of Precision Engineering and Manufacturing
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• v.1 no.1
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• pp.127-132
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• 2000

A highly efficient mirror surface grinding technology has been developed for hard and brittle materials various metal materials, by employing the ELID (electrolytic in-process dressing) grinding method using metal bonded grinding wheels. In this research, some typical applications of ELID-grinding for cylindrical grinding are introduced and the mirror grinding characteristics are investigated. Good results are obtained in the grinding of ceramics and tungsten carbide.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.1109-1112
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• 2001

In the grinding process, the edge of shape is very important to evaluate the surface roughness and the precision of dimension. To keep precision of product, parameters with respect to the amount of wheel wear have to limit by grinding condition. In this paper, we measured variation of grinding force to seek the grinding characteristics by the amount of wheel wear in surface grinding. Also, we find out that how these condition give influence to wheel life.

• Bulletin of the Korean Space Science Society
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• 2003.10a
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• pp.26-26
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• 2003

During fabrication process for the large space optical surfaces, the traditional bound abrasive grinding with bronze bond cupped diamond wheel tools leaves the machine marks and the subsurface damage to be removed by subsequent loose abrasive lapping. We explored a new grinding technique for efficient quantitative control of precision CNC grinding for space optics materials such as Zerodur. The facility used is a NANOFORM-600 diamond turning machine with a custom grinding module and a range of resin bond diamond tools. The machining parameters such as grit number, tool rotation speed, work-piece rotation speed, depth of cut and feed rate were altered while grinding the work-piece surfaces of 20-100 mm in diameter. The input grinding variables and the resulting surface quality data were used to build grinding prediction models using empirical and multi-variable regression analysis methods. The effectiveness of the grinding prediction model was then examined by running a series of precision CNC grinding operation with a set of controlled input variables and predicted output surface quality indicators. The experiment details, the results and implications are presented.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.90-95
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• 2005

To perform the finish outside-diameter grinding process of ferrules which are widely used as fiber optic connectors, a high-precision centerless grinding machine is necessary. In this study, the thermal characteristics of the high-precision centerless grinding machine such as the temperature distribution, temperature rise and thermal deformation, are estimated based on the virtual prototype of the grinding machine and the heat generation rates of heat sources related to the machine operation conditions. The reliability of the predicted results is demonstrated by the temperature characteristics measured from the physical prototype. Especially, the predicted and measured results show the fact that the high-precision centerless grinding machine consisted of the hydrostatic GW and RW spindle systems, hydrostatic RW feeding mechanism, RW swivel mechanism, on-machine GW and RW dressers, and concrete-filled steel bed, has very stable thermal characteristics.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.46-51
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• 2002

A grinding technology is very essential to finish the surface of IT and BT industrial application parts such as wafer, optical connection part and lenses etc. However the finding machine has bead depended on imports. Especially, it is completely imported for machining high precision part relevant to domestic electric and communicational industries. The amount to import grinding machine is about $110milions. It takes about 35% of total import amount of all the machine tools. A domestic finder manufacturer is a very small-scaled bussinessman and research facilities is poor. Recently, it is increasing to demand high speed and precision grinding technology because it brings cost down and value added up. Its further study will be something related to inteligent grinding system fur value added and high precision part. It will make domestic grinding technology to its advanced country level.

• International Journal of Precision Engineering and Manufacturing
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• v.6 no.1
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• pp.59-64
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• 2005

This paper describes an investigation about the fluid delivering method that minimizes the generation of hydrodynamic pressure and improves the grinding accuracy. Traditionally, grinding fluid is delivered for the purpose of cooling, chip flushing and lubrication. Hence, a number of conventional investigations are focused on the delivering method to maximize fluid flux into the contact arc between the grinding wheel and the work piece. It is already known that hydrodynamic pressure generates due to this fluid flux, and that it affects the overall grinding resistance and machining accuracy. Especially in the ultra-precision mirror grinding process that requires extremely small amount of cut per pass, its influence on the machining accuracy becomes more significant. Therefore, in this paper, a new delivering method of grinding fluid is proposed with focus on minimizing the hydrodynamic pressure effect. Experimental data indicates that the proposed method is effective not only to minimize the hydrodynamic pressure but also to improve the machining accuracy.