• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2006.11a
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• pp.233-236
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• 2006

A dilatometer was used to investigate the effect of cure conditions and the presence of filler in an epoxy system. These studies showed shrinkage in the cured epoxy when heating it through the glass transition temperature region. The magnitude of the shrinkage, related to stress build up in the epoxy during curing, was influenced by the processing conditions, filler presence and the nature of the mold used to contain the resin. Cure and cyclic cure at a lower temperature, prior to a post cure, decreased the magnitude of observed shrinkage. Cure shrinkage decreased with number of cyclic cure. Post cured samples outside the mold led to less shrinkage compared with sample in the mold. And sample containing kaolin filler showed less shrinkage than unfilled sample.

• Journal of Ocean Engineering and Technology
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• v.23 no.4
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• pp.1-5
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• 2009

A dilatometer was used to investigate the effect of cure conditions, mold types and the presence of filler in an epoxy system. These studies showed shrinkage in the cured epoxy when heating it through the glass transition temperature region. The magnitude of the shrinkage, related to stress build up in the epoxy during curing, was influenced by the processing conditions, filler presence and the nature of the mold used to contain the resin. Cure and cyclic cure at a lower temperature, prior to a post cure, decreased the magnitude of observed shrinkage. Cure shrinkage decreased with the number of cyclic cures. Post cured samples outside the mold led to less shrinkage compared with samples in the mold. Sample cured in a silicon mold represented less shrinkage than sample cured in an aluminum mold. Sample containing kaolin filler showed less shrinkage than unfilled sample.

• Journal of Adhesion and Interface
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• v.3 no.1
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• pp.9-12
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• 2002

In this paper, N,N-m-phenyenedimaleimide (m-PDM), Polyamide Resin (PI) and Metallic dimethacrylate etc. influencing the heat resistance of anaerobic adhesive has been studied, an anaerobic adhesive composition capable of post-cure expansion and $230^{\circ}C$ temperature resistance comprising a multifunctional methacrylate and m-PDM capable of effectuating expansion upon post-cure has been developed. A homogeneous mixture of a monomer and m-PDM are subjected to a first cure heat stage (Room Temperature) wherein a rigid partially-cured plastic is formed and a post-cure heat stage ($150^{\circ}C$) to effectuate permanent expansion of cured adhesive composition.

• Restorative Dentistry and Endodontics
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• v.19 no.1
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• pp.135-147
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• 1994

This study was conducted to evaluate whether the fatigue toughness of visible light cured composite resins could be improved and how much percentage of polymerzation shrinkage could be affected by additional heat treatment. 7 materials were investigated for this study: P-50, Lite-fil CR inlay, Pekafil, Clearfil CR inlay, Clearfil photo posterior, Z -100 and Progress. Diametral tensile strengths and linear shrinkages of composite resins were taken under visible light cured and additional post-cure heated condition and compared each other. A fatigue toughness of above materials was evaluated by measuring diametral tensile strength after they were repeatedly loaded with 120kgf/$cm^2$ up to 3000 cycles. The results obtained were as follows : 1. When composite resins were cured just by visible light, Lite fil CR inlay, Z -100 and Progress showed respectively higher diametral tensile strength than the other materials. Clearfil CR inlay, Clearfil photo posterior and Progress exhibited strong fatigue toughness compared to P-50 and Pekafil. 2. Post-cure heat treated composite resins had higher diametral tensile strengths than visible light cured composite resins at fatigue toughness test as well as no fatigue toughness test. 3. When Composite resins were additionally polymerized by post-cure heat treatment, P-50 showed weak fatigue toughness, on the contrary, Clearfil CR inlay, Z-100, Progress showed strong one. 4. When composite resins were cured just by visible light, percentage of polymerization linear shrinkage was the lowerest in Clearfil CR inlay, followed by, in ascending order, Clearfil photo posterior, Lite-fil CR inlay, Progress, Pekafil, P-50, and Z-100. In the case of post- cure heat treated composite resins, percentage of linear shrinkage was the lowest in Clearfil photo posterior, followed by, in ascending order, Lite-til CR inlay, Clearfil CR inlay, Progress, P-50, Pekafil and Z-100. 5. Percentage of polymerization linear shrinkage was greater in the post-cure heat treated composite resins than in the visible light cured composite resins and linear shrinkage increased significantly in Pekafil, Clearfil CR inlay, and Clearfil photo posterior between at the visible light cured and at the post-cure heat treated condition. The above results is saying that additional post-cure heat treatment on the composite resins for posterior restoration is able to affect on improvement of strength and fatigue toughness and lead to increase polymerization of composite resins.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.7
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• pp.1661-1667
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• 2009

Post-cure characteristics of a silicone rubber material which is widely used for a LCD lamp holder were investigated using thermogravimetric analysis (TGA). Research was especially focussed on searching for the optimum post-cure conditions in relation to the practical operation environments. The results showed that incipient volatile temperature(Ti) during the process was considered as the most important factor and, thereby, post-curing for 2hrs at $250^{\circ}C$seemed to be a reasonable condition in the practical view-point. Arrhenius plot of shift factors which were empirically determined from the time-temperature-superposition-principle showed good linearity, exhibiting the post-cure mechanism might be proceeded through single mechanism with activation energy of 108.25kJ/mol.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.548-551
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• 1999

The cure characteristics of metal particle filled DGEBA/MDA/SN/ zeolite epoxy resin composite system for EMI shielding were investigated by dynamic DSC run method and FT-lR spectroscopy. As the heating rate increased, the peak temperature on dynamic DSC curve increased because of the rapid cure reaction. From the straight line of the Kissinger plot, the curing reaction activation energy and pre-exponential factor could be obtained. As the post-curing time at 15$0^{\circ}C$ increased, the glass increased the glass transition temperature or the thermal stability increased. When the post curing time is too long, the system filled with metallic Al particle can be thermally oxidized by the catalytic reaction of metal filler and the thermal stability of the composite for the EMI shielding application may be decreased.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.06a
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• pp.227-230
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• 1998

The effects of post curing conditions on thermal properties of alumina filled epoxy resin system DGEBA/MDA/SN were investigated. As the post curing time increased at 15$0^{\circ}C$, the glass transition temperature increased from 121 to 124, slightly. As the heating rate increased, high thermal decomposing temperature (T$_{d}$) and most decomposing temperature (T$_{p}$) increased. For the case of post-cured system at 15$0^{\circ}C$ for 4 days showed lower values than virgin system. At the post curing condition the system must have been thermally degraded.ded.

• Journal of Adhesion and Interface
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• v.5 no.2
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• pp.1-7
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• 2004

A novel carboxyl terminated butadiene-acrylonitrile (CTBN) modified, low temperature cure epoxy film adhesive was developed in this paper. It can be cured at as low as $75^{\circ}C$ for 4 hours with a pressure of 0.1MPa. After post cure at $120^{\circ}C$ for 2 hours, the bonding strengths of Phosphoric Acid Anodizing(PAA) surface treated aluminum adherend were similar to those of structural film adhesives curing at $120^{\circ}C$. It is suitable to bond both metal/composite laminate-to-laminate and laminate to honeycomb structure.

• The Journal of Advanced Prosthodontics
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• v.6 no.3
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• pp.194-199
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• 2014

PURPOSE. This study evaluated the depth of cure of resin composite cured by light through a translucent fiber post. MATERIALS AND METHODS. The opaque plastic tubes in various lengths of 2, 4, 6, 8, 10, 12, 14 mm. were filled with resin composite in which two different translucent fiber posts were inserted into the center and photo-polymerized for 40 seconds. The degree of conversion of the cured composite at bottom surface were examined using Fourier transform infrared attenuated total reflection spectrometer (FTIR/ATR) at 0.1, 0.5 and 1.0 mm apart from the post surface. RESULTS. The degree of conversion of the 0.1 mm, 0.5 mm, 1.0 mm apart from the post surface was highest at the 2 mm level and continuously decreased when the distance from the light source was increased and drastically decreased when the depth from the top of the post was greater than 4-6 mm. For each level, the highest degree of conversion was at 0.1 mm from the post surface and decreased continuously when the distance apart from the post surface was increased. CONCLUSION. The quantity of light transmission depends on the type of post and the light transmission capability of the post, especially after 4-6 mm depth and the area further apart from the post surface, are insufficient for clinical light activation of resin composite.

• International Journal of Oral Biology
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• v.46 no.4
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• pp.184-189
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• 2021

When luting indirect restorations with dual-cure resin cement (DCRC), excess cement can be easily removed by performing tack cure of DCRC for a few seconds. The purpose of this study was to evaluate whether different tack cure times affect polymerization shrinkage (PS) of the selected DCRC. One dual-cure resin cement (G-CEM LinkAce, GC) was used for measuring PS in light-cure (LC group), self-cure (SC group), and two tack-cure modes. In the first tack-cure subgroup, tack cure was performed for 1, 2, 3, and 5 seconds, followed by light cure after 2 minutes of remnant removal time in each case (TC-LC groups). In the other tack-cure subgroup, tack cure was performed for the same lengths of time, but followed by self-cure in each case (TC-SC groups). PS was measured by a modified bonded disc method for 1,800 seconds. One-way analysis of variance followed by Duncan's post hoc test was used to determine any statistically significant differences among the test groups (α = 0.05). When the DCRC was self-cured after tack cure, PS was significantly lower than when it was only self-cured (p < 0.05); however, tack cure time did not affect PS (p > 0.05). When the DCRC was light-cured, PS was not affected by tack cure or tack cure time (p > 0.05). Therefore, tack cure within 5 seconds did not negatively affect the final PS when the DCRC was light-cured after cement remnant removal.