• Journal of Adhesion and Interface
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• v.5 no.2
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• pp.1-7
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• 2004

A novel carboxyl terminated butadiene-acrylonitrile (CTBN) modified, low temperature cure epoxy film adhesive was developed in this paper. It can be cured at as low as $75^{\circ}C$ for 4 hours with a pressure of 0.1MPa. After post cure at $120^{\circ}C$ for 2 hours, the bonding strengths of Phosphoric Acid Anodizing(PAA) surface treated aluminum adherend were similar to those of structural film adhesives curing at $120^{\circ}C$. It is suitable to bond both metal/composite laminate-to-laminate and laminate to honeycomb structure.

• The Journal of Advanced Prosthodontics
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• v.13 no.4
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• pp.268-268
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• 2021

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2006.11a
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• pp.233-236
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• 2006

A dilatometer was used to investigate the effect of cure conditions and the presence of filler in an epoxy system. These studies showed shrinkage in the cured epoxy when heating it through the glass transition temperature region. The magnitude of the shrinkage, related to stress build up in the epoxy during curing, was influenced by the processing conditions, filler presence and the nature of the mold used to contain the resin. Cure and cyclic cure at a lower temperature, prior to a post cure, decreased the magnitude of observed shrinkage. Cure shrinkage decreased with number of cyclic cure. Post cured samples outside the mold led to less shrinkage compared with sample in the mold. And sample containing kaolin filler showed less shrinkage than unfilled sample.

• Journal of Ocean Engineering and Technology
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• v.23 no.4
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• pp.1-5
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• 2009

A dilatometer was used to investigate the effect of cure conditions, mold types and the presence of filler in an epoxy system. These studies showed shrinkage in the cured epoxy when heating it through the glass transition temperature region. The magnitude of the shrinkage, related to stress build up in the epoxy during curing, was influenced by the processing conditions, filler presence and the nature of the mold used to contain the resin. Cure and cyclic cure at a lower temperature, prior to a post cure, decreased the magnitude of observed shrinkage. Cure shrinkage decreased with the number of cyclic cures. Post cured samples outside the mold led to less shrinkage compared with samples in the mold. Sample cured in a silicon mold represented less shrinkage than sample cured in an aluminum mold. Sample containing kaolin filler showed less shrinkage than unfilled sample.

• Journal of the korean academy of Pediatric Dentistry
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• v.34 no.1
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• pp.62-72
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• 2007

The purpose of present study was to determine whether different kinds of curing lights can alter microtensile bond strength(MTBS) of class I cavity pulpal and axial wall specimens in primary molar. Thirty clean mandibular 2nd primary molar's occlusal enamel were removed and class I cavity, size of $2{\times}4{\times}2mm$ was prepared. Dentin bonding agent was applied according to manufacturer's manual. Each group was cured with Halogen Curing Unit, Plasma Curing Unit and LED Curing Unit. Composite resin was bulk filled and photo cured with same curing unit. MTBS specimens which size is $0.7{\times}0.7{\times}4mm$ were prepared with low speed saw. Specimens were coded by their curing lights and wall positions (Halogen - Axial wall group, Halogen - Pulpal wall group, Plasma - Axial wall group, Plasma - Pulpal wall group, LED - Axial wall group, LED - Pulpal walt group). MTBS were tested at 1 mm/min cross Head speed by Universal Testing Machine. Fractured surface and bonding surface was observed with SEM. T-test between axial and pulpal specimens in each curing lights, one-way ANOVA among different curing light specimens in each wall positions were done. Weibull distribution analysis was done. The results were as follows : Mean MTBS of pulpal wall specimens were significantly greater than that of axial wall specimens at each curing units(p<.05). There was no significant difference in the MTBS among three curing units at axial wall and pulpal wall. In Weibull distribution, pulpal wall specimens were more homogeneous than axial wall specimens.

• Journal of the Korean Society for Nondestructive Testing
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• v.35 no.2
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• pp.150-156
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• 2015

In this study, the effects of different mix proportions and fire scenarios (exposure temperatures and post-fire-curing periods) on fire-damaged concrete were analyzed using a nonlinear resonance vibration method based on nonlinear acoustics. The hysteretic nonlinearity parameter was obtained, which can sensitively reflect the damage level of fire-damaged concrete. In addition, a splitting tensile strength test was performed on each fire-damaged specimen to evaluate the residual property. Using the results, a prediction model for estimating the residual strength of fire-damaged concrete was proposed on the basis of the correlation between the hysteretic nonlinearity parameter and the ratio of splitting tensile strength.

• Journal of Institute of Control, Robotics and Systems
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• v.15 no.9
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• pp.877-880
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• 2009

A curing process in post-printing section of R2R process is required for an electrical property of the printed pattern when devices such as RFID, Solar cell are printed. PEN as well as heat-stabilized PET which is used as a plastic substrate would be deformed at high temperature due to change of its elastic modulus. And crack in the printed pattern, which is on the plastic substrate is occurred due to the deformation of the substrate. The occurrence of crack causes electrical resistance to increase and the quality of the device to deteriorate. In case of RFID antenna, the range of reading distance is shortened as the electrical resistance of the antenna is increased. Therefore, the deformation of the plastic substrate, which causes the occurrence of crack, should be minimized by setting up low operating tension in R2R process. In low tension, slippage between a moving substrate and a roller would be generated when the operating speed is increased. And scratch would be occurred when slippage is generated due to an air entrainment, which is related to the thickness of the air film. The thickness of the air film is increased when operating speed is increased as shown by simulation based on mathematical model. The occurrence of scratch in conductive pattern printed by roll to roll process is a critical damage because it causes degradation or failure of electrical property of it.

• Composites Research
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• v.37 no.5
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• pp.402-408
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• 2024

This study evaluates the mechanical performance and thermal analysis characteristics of adhesives exposed to harsh environments, including high temperatures, tap water, and salt water. Pull-out specimens were prepared to investigate changes in adhesive properties under varying temperature, moisture, and salinity conditions. Dynamic mechanical analysis (DMA) was used to measure the glass transition temperature, while field-emission scanning electron microscopy (FE-SEM) and energy dispersive X-ray spectroscopy (EDS) were employed to assess microstructural and compositional changes. The results indicate that exposure to different environments induced post-curing, raising the glass transition temperature and enhancing the thermal stability and mechanical performance of the adhesives. Chemical analysis revealed Na and Cl ion penetration in specimens exposed to salt water, suggesting potential long-term degradation. Despite this, pull-out test results showed minimal variation in failure load across different environmental conditions, although microstructural deformation was observed on the adhesive surface after saltwater exposure. These findings provide valuable insights for selecting and applying adhesives in automotive and aerospace components exposed to harsh conditions.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.7
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• pp.1661-1667
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• 2009

Post-cure characteristics of a silicone rubber material which is widely used for a LCD lamp holder were investigated using thermogravimetric analysis (TGA). Research was especially focussed on searching for the optimum post-cure conditions in relation to the practical operation environments. The results showed that incipient volatile temperature(Ti) during the process was considered as the most important factor and, thereby, post-curing for 2hrs at $250^{\circ}C$seemed to be a reasonable condition in the practical view-point. Arrhenius plot of shift factors which were empirically determined from the time-temperature-superposition-principle showed good linearity, exhibiting the post-cure mechanism might be proceeded through single mechanism with activation energy of 108.25kJ/mol.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.2
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• pp.219-225
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• 2011

Silicone resin is recently used as encapsulant for high-power LED module due to its excellent thermal and optical properties. In the present investigation, finite element analysis of cure process was attempted to examine residual stress evolution behavior during silicone resin cure process which is composed of chemical curing and post-cooling. To model chemical curing of silicone, a cure kinetics equation was evaluated based on the measurement by differential scanning calorimeter. The evolutions of elastic modulus and chemical shrinkage during cure process were assumed as a function of the degree of cure to examine their effect on residual stress evolution. Finite element predictions showed how residual stress in cured silicone resin can be affected by elastic modulus and chemical shrinkage behavior. Finite element analysis is supposed to be utilized to select appropriate silicone resin or to design optimum cure process which brings about a minimum residual stress in encapsulant silicone resin.