• Title/Summary/Keyword: Position angle of bent line

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Conditions for No Soil -Push By Outside of Front Cutting Surface on Bent Blade

  • Chen, Cuiying;Mao, Hanping
    • Proceedings of the Korean Society for Agricultural Machinery Conference
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    • 1993.10a
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    • pp.1088-1094
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    • 1993
  • One of the important restraint conditions for determination of rotary tiller parameters is whether the outside of front cutting surface on blade in rotary tiller pushes untilled soil in operation. By theoretical analysis and graphic verification on computer, no sil-push conditions is put forward and formula for calculating the position angle of its bent line derived, as is convenient for selection of rotary tiller parameters and design and drawing of its blade.

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A study on the inspection algorithm of FIC device in chip mounter (칩 마운터에의 FIC 부품 인식에 관한 연구)

  • Lyou, Kyoung;Moon, Yun-Shik;Kim, Kyoung-Min;Park, Gwi-Tae
    • Journal of Institute of Control, Robotics and Systems
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    • v.4 no.3
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    • pp.384-391
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    • 1998
  • When a device is mounted on the PCB, it is impossible to have zero defects due to many unpredictable problems. Among these problems, devices with bent corner leads due to mis-handling and which are not placed at a given point measured along the axis are principal problem in SMT(Surface Mounting Technology). It is obvious that given the complexity of the inspection task, the efficiency of a human inspection is questionable. Thus, new technologies for inspection of SMD(Surface Mounting Device) should be explored. An example of such technologies is the Automated Visual Inspection(AVI), wherein the vision system plays a key role to correct this problem. In implementing vision system, high-speed and high-precision are indispensable for practical purposes. In this paper, a new algorithm based on the Radon transform which uses a projection technique to inspect the FIC(Flat Integrated Circuit) device is proposed. The proposed algorithm is compared with other algorithms by measuring the position error(center and angle) and the processing time for the device image, characterized by line scan camera.

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