• Bulletin of the Korean Chemical Society
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• 제34권12호
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• pp.3541-3542
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• 2013

• Journal of Industrial and Engineering Chemistry
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• 제68권
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• pp.42-47
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• 2018

This work reports a facile and effective antibacterial coating for oxide substrates. As a coating material, a random copolymer, abbreviated as poly(TMSMA-r-PEGMA), was synthesized by radical polymerization of 3-(trimethoxysilyl)propyl methacrylate (TMSMA) and poly(ethylene glycol) methyl ether methacrylate (PEGMA). Polymeric self-assembled monolayers of poly(TMSMA-r-PEGMA) were formed on various inorganic oxide substrates, including silicon oxide, titanium dioxide, aluminum oxide, and glass, via the simple dip-coating process. The polymer-coated substrates were characterized by ellipsometry, contact angle measurements, and X-ray photoelectron spectroscopy. The bacterial adhesion on the polymer-coated substrates was completely suppressed compared to that on the uncoated substrates.

• Macromolecular Research
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• 제14권2호
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• pp.205-208
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• 2006

A polymeric film of a biodegradable poly(1,5-dioxepan-2-one) (PDXO) was formed on a gold surface by a combination of the formation of self-assembled monolayers (SAMs) presenting hydroxyl groups and the surface-initiated, ring-opening polymerization (SI-ROP) of 1,5-dioxepan-2-one (DXO). The SI-ROP of DXO was achieved by heating a mixture of $Sn(Oct)_2$, DXO, and the SAM-coated substrate in anhydrous toluene at $55^{\circ}C$. The resulting PDXO film was quite uniform. The PDXO film was characterized by polarized infrared external reflectance spectroscopy, X-ray photoelectron spectroscopy, time-of-flight secondary ion mass spectrometry, atomic force microscopy, ellipsometry, and contact angle goniometry.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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• pp.1044-1045
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• 2004

In this work, the characteristics of organic thin film transistors (OTFTs) with self-assembled monolayers (SAMs) on polymeric gate insulator have been investigated. The SAMs were formed using atomic layer deposition (ALD) method onto gate insulator. Upon the investigations, it was observed that SAMs modify the wettability of polymeric insulator and influence the growth of subsequent organic semiconductor, and thereby, electric conductivity and roughness of the pentacene film are improved.

• 한국재료학회지
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• 제18권12호
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• pp.664-668
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• 2008

Vapor phase polymerization of a conductive polymer on a $SiO_2$ surface can offer an easy and convenient means to depositing pure and conductive polymer thin films. However, the vapor phase deposition is generally associated with very poor adhesion as well as difficulty when patterning the polymer thin film onto an oxide dielectric substrate. For a significant improvement of the patternability and adhesion of Poly(3-hexylthiophene) (P3HT) thin film to a $SiO_2$ surface, the substrate was pre-patterned with n-octadecyltrichlorosilane (OTS) molecules using a ${\mu}$-contact printing method. The negative patterns were then backfilled with each of three amino-functionalized silane self-assembled monolayers (SAMs) of (3-aminopropyl) trimethoxysilane (APS), N-(2-aminoethyl)-aminopropyltrimethoxysilane (EDA), and (3- trimethoxysilylpropyl)diethylenetriamine (DET). The quality and electrical properties of the patterned P3HT thin films were investigated with optical and atomic force microscopy and a four-point probe. The results exhibited excellent selective deposition and significantly improved adhesion of P3HT films to a $SiO_2$ surface. In addition, the conductivity of polymeric thin films was relatively high (${\sim}13.51\;S/cm$).

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.1021-1024
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• 2003

In this work, we fabricated various 2D metallic and polymeric nanopatterns with the feature resolution of sub-micrometer scale by using the method of microcontact printing ($\mu$ P) based on soft lithography. Silicon masters for the micromolding were made by e-beam lithography. Composite poly(dimethylsiloxane) (PDMS) molds were composed of a thin, hard layer supported by soft PDMS layer. Finally, monodisperse metal or polymer particles could be obtained in the prepared pattern for the application of electronic devices.

• 마이크로전자및패키징학회지
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• 제30권2호
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• pp.13-20
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• 2023

마이크로 전자기계 시스템 공정에서 표면 처리는 공정 방법의 일환이자 디바이스에 자체적인 기능을 부여하는 역할을 한다. 특히 자기 조립 단분자층은 마이크로 전자기계 시스템 공정에서 표면 개질 및 기능화를 수행하는 표면처리 방법으로 침지 시간과 용액 농도에 따라 강도를 정밀하게 조절할 수 있는 유기 단분자막이다. 고분자 기판이나 금속/세라믹 부품에 자발적으로 흡착되어 형성되는 자기 조립 단분자층은 표면 특성의 개질 뿐만 아니라 나노스케일 단위의 높은 정밀도로 하여금 양산용 리소그래피 기술 및 초민감 유기/생체분자 센서에도 응용되고 있다. 본 논문에서는 마찰 특성의 조절부터 생체 분자의 탐침 기능까지 자기 조립 단분자층 기술이 발전되어 응용되고 있는 다양한 분야들에 대해 소개한다.