• Fashion & Textile Research Journal
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• v.20 no.4
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• pp.422-428
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• 2018

In this study, we developed honeycomb pads using foam and polymer gel and verified the impact protection performance of pads for the development of a fall protection pants for elderly women aged 65 and over who have a high risk of fracture due to falls. The results are as follows; In the first experiment, the impact protection performance was evaluated for four honeycomb pad samples (CR foam, EPDM foam, hardness 15 polymer gel, and hardness 30 polymer gel) manufactured to a thickness of 5 mm using a single material. When the force of about 10757N was applied to the specimens, all four pads reduced the impact force to 3100N or less. Polymer gels showed better protection than foam materials. In the second experiment, the thickness of the protective pad was set to 8 mm in order to improve the shock absorbing performance of the protective pad. As a result of evaluating the impact protection performance of the foam single pad and foam gel composite pad, the impact absorbing performance of the foam single pad was better. Finally, four kinds of protection pads were made by assigning the foam single pad and the foam gel composite pad to pants type and underwear type respectively. The pad thickness of the main protection area was set to 8 mm to enhance the protection, and gradually decreased to 5mm and 3mm toward the edge to improve the appearance and fit.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.374-375
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• 2006

The purpose of this paper is to investigate the propriety of biodegradable polymer pad in spite of exchanging from existing polyurethane pad used in CMP(Chemical Mechanical Planarization). Poli 400 of G&P Technology for CMP and Ellipsometer of Rudolph AutoEL-III for measurement were used in this experiment. From this experiment, it is proven that the biodegradable polymer pad is sufficiently suitable in CMP process. Therefore, it is expected that, by using the biodegrable pad CMP manufacturing process, and will be decreased. Especially, wafer scratch can be decreased.

• Macromolecular Research
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• v.12 no.3
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• pp.263-268
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• 2004

We have synthesized a water-soluble polyimide precursor, poly(amic acid) amine salt (PAD), from pyromellitic dianhydride (PMDA), 4,4'-oxydianiline, and N,N -dimethylethanolamine (DMEA) and have investigated in detail its properties with respect to the degree of salt formation (D$\_$sf/). The maximum value of D$\_$sf/ we obtained upon precipitation of the precursor solution into acetone was 79%. We synthesized a PAD having a D$\_$sf/ of 100% (PAD100) by the solid state drying of an organic solution. The precursors showed different solubility depending on the D$\_$sf/ to make up to 4 wt% solutions in water containing a small amount of DMEA. PAD100 is completely soluble in pure water. We investigated the imidization behavior of PAD in aqueous solution using various spectroscopic methods, which revealed that PAD 100 has faster imidization kinetics relative to that of the poly(amic acid)-type precursors. The resulting polyimide films prepared from an aqueous precursor solution possess almost similar physical and thermal properties as those prepared from N-methyl-2-pyrrolidone(NMP) solution. Therefore, we have demonstrated that PAD can be used as a water-based precursor of polyimide; this procedure avoids the use of toxic organic solvents, such as NMP.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.7
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• pp.22-29
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• 2004

As a result of high integration of semiconductor device, the global planarization of multi-layer structures is necessary. So the chemical mechanical polishing(CMP) is widely applied to manufacturing the dielectric layer and metal line in the semiconductor device. CMP process is under influence of polisher, pad, slurry, and process itself, etc. In comparison with the general CMP which uses the slurry including abrasives, fixed abrasive pad takes advantage of planarity, resulting from decreasing pattern selectivity and defects such as dishing & erosion due to the reduction of abrasive concentration especially. This paper introduces the manufacturing technique of fixed abrasive pad using hydrophilic polymers with swelling characteristic in water and explains the self-conditioning phenomenon. And the tungsten CMP using fixed abrasive pad achieved the good conclusion in terms of the removal rate, non-uniformity, surface roughness, material selectivity, micro-scratch free contemporary with the pad life-time.

• Proceedings of the SAREK Conference
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• 2006.06a
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• pp.976-981
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• 2006

In case of attaching thermoelectric module and heat source, the polymer pad is attached on the $Al_2O_3$ plate, which is cooling side of thermoelectric module, in order to enhance mechanical safety of the system. It is impossible to calculate the exact distribution of temperature and flow pattern of inner gap of thermoelectric module. Therefore CFD(Computational Fluid Dynamics) analysis was executed to determine the thermo-fluid phenomena and distribution by Fluent. As the result of these analysis, heat transfer was dominated by conduction and the difference of temperature was linear distribution according to the thickness of polymer sheet.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1296-1301
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• 2003

The chemical mechanical polishing(CMP) is necessarily applied to manufacturing the dielectric layer and metal line in the semiconductor device. The conditioning of polishing pad in CMP process additionally operates for maintaining the removal rate, within wafer non-uniformity, and wafer to wafer non-uniformity. But the fixed abrasive pad(FAP) using the hydrophilic polymer with abrasive that has the swelling characteristic by water owns the self-conditioning advantage as compared with the general CMP. FAP also takes advantage of planarity, resulting from decreasing pattern selectivity and defects such as dishing due to the reduction of abrasive concentration. This paper introduces the manufacturing technique of FAP. And the tungsten CMP using FAP achieved the good conclusion in point of the removal rate, non-uniformity, surface roughness, material selectivity, micro-scratch free contemporary with the pad life-time.

• Proceedings of the SAREK Conference
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• 2006.06a
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• pp.1144-1149
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• 2006

Electric power is generated by Seeback Effect if there is thermal difference in pettier module. Peltier module is composed by alumina, Bi-Te semiconductor and insulation (or air). If load is increased in pettier module, the alumina of module will be destroyed. One of the preventing method of module destruction is using damper between module and heat source. But the electric Power is dropped because of decrease of thermal difference, if thermal conductivity of damper was tourer than other thermoelectric materials. We design, Polymer Pad for enhancing thermoelectric porter. As the result of these experiment, Polymer Pad is more superior than the Rubber in the stability and thermal conduction.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.3
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• pp.184-191
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• 2000

Properties of pad are investigated to find the relationship between the chemical mechanical polishing(CMP) results, such as material removal rate and within wafer non-uniformity(WIWNU), and its properties. Polishing pressure is considered as important factors to affect the results, so behavior of ordinary polymer is studied to define the polishing result affecting properties of pad. Experimental setup is devised to identify the behavior of pad and several different pads are used in chemical mechanical polishing experiments to verify the correlations between pad properties and polishing results. The results indicate that the viscoelastic properties of pad had relationships with the polishing results, and shows correlation between suggested properties of pad and polishing result.

• Journal of the Korean Society of Clothing and Textiles
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• v.40 no.3
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• pp.495-505
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• 2016

This study explores and selects an appropriate material that considers light and soft physical properties as well as activity for impact absorption pads that can be used to develop practical impact protective clothes worn during daily life by the elderly to reduce the impact of falls. Physical properties, impact absorption performance, and compression characteristics were evaluated on 5 types of foam, 2 types of 3D spacer fabric, and 3 types of polymer gel to select a material appropriate for the pad to be inserted into impact protective clothes. The evaluation of the physical properties showed that 3D spacer fabrics had lower density compared to other materials and polymer gels had the highest density. The elongation percentage was higher in foams than 3D spacer fabrics and EPDM foam had the highest elongation percentage. The impact absorption performance of honeycomb polymer gel was better than foams and 3D spacer fabrics. As a result of looking into compression energy and compression characteristics of materials, 'CR foam A' was found to absorb the largest amount of compression energy, 24.1%, among foams and polymer gels. A high energy absorption rate of 50.0% (or above) was indicated by 3D spacer fabrics; however, foams and polymer gels showed a progressive deformation of energy compression / recovery curve with 3D spacer fabrics that showed drastic deformation. Based on characteristics of materials, 'CR foam C' and EPDM with relatively high absorption performance can be used as protective pad materials among foams. Among polymer gels, 2 open-type polymer gels that have relatively low impact protective performance but a relatively lighter weight on human body (compared to closed-type) are considered appropriate protective pad materials.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.78-81
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• 2003

Polishing Processes are widely used in the glass, optical, die and semiconductor industry and are conventionally carried out using abrasive slurry and a polishing pad. But abrasive slurry process has a weak point that is high cost of handling of used slurry and hard controllability of slurry. Recently, some researches have attempted to solve these problems and one method is the development of a fixed abrasive pad. FAP has a couple of advantages including clean environment, lower CoC, easy controllability and higher form accuracy. But FAP also has a weak point that is need of dressing because of glazing and loading. The paper introduces the basic concept and fabrication technique of FAP using hydrophilic polymers with swelling characteristics in water and explains the self-conditioning phenomenon. Experimental results demonstrate to achieve nano surface roughness of soda lime glass for optical application