• Title/Summary/Keyword: Polyaramide-imide

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Polyaramide-Imide from N-Phenylphthalimide-Containing Diamine and Dicarboxylic Acid I. Synthesis and Thermal Properties (N-Phenylphthalimide를 포함하는 디아민과 디카르복시산으로 제조된 폴리아라미드-이미드 I. 제조와 열적 성질)

  • Kil, Deog-Soo;Bae, Jang-Soon;Choi, Sung-Jae;Gong, Myoung-Seon
    • Applied Chemistry for Engineering
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    • v.10 no.1
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    • pp.138-142
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    • 1999
  • Imide-containing diamine and dicarboxylic acid monomers, N-(4-aminophenyl)-4-aminophthalimide(APAP), N-(4-carboxyphenyl)-4-carboxyphthalimide(CPCP), N,N'-oxydiphenylenebis(4-aminophthalimide)(ODPAP) and N,N'-oxydiphenylenebis(4-carboxyphthalimide)(ODPCP) were prepared. Poly(amide-imide)s were prepared by condensation reaction of the diamine and the dicarboxylic acid monomers. Poly(amide-imide)s were also prepared from the diamine monomers and aromatic acid chlorodes such as terephthaloyl chloride and isophthaloyl chloride. The polymers possess inherent viscosity of 0.18~0.67 dL/g and brittle films were cast from NMP/LiCl solution. The poly(amide-imide)s are easily soluble in NMP/LiCl and also partially soluble in polar aprotic solvents such as DMF, DMSO, NMP and DMAc even at $80^{\circ}C$. DSC traces of polymers showed no glass transition temperature and melting temperature, and TGA traces showed a 10% weight loss at $500^{\circ}C$.

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