• 한국전기전자재료학회논문지
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• 제20권4호
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• pp.303-307
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• 2007

This paper investigated the effect of the pad buffing process on the material removal characteristics and pad stabilization during silicon chemical mechanical polishing. The pads surface were controlled by the buffing process using a buffer made by the sandpaper. The buffing process is based on abrasive machining by using a high speed sandpaper. The controlled pad by the buffing process show less deformation deviation and stable material removal rate during the CMP process. In addition, the controlled pad ensure better uniformity of removal rate than comparative pads. As a result of monitoring, the controlled pad by the buffing process demonstrated constant and stable friction force signals from initial polishing stage. Therefore, the tufting process could control the pad surface to be uniform and improve the performance of the polishing pad.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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• pp.178-181
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• 2002

We studied the characteristics of polishing pad, which can apply W CMP process for global planarization of multilevel interconnection structure. Also we investigated the effects of different sets of polishing pad. The purpose of this experiment is the cost reduction by the increase of pad life time and decrease of cycle time and slurry usage with new pad. Especially we studied the effect of polishing pad for CMP process by this experiment of polishing pad that is consumables material during CMP process. We expecting the increase of process throughput and improvement of device manufacturing yield because we can choose optimum polishing pad through this result.

• Tribology and Lubricants
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• 제38권1호
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• pp.1-7
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• 2022

Chemical-mechanical polishing (CMP) process is a semiconductor process that planarizes a wafer surface using mechanical friction between a polishing pad and a substrate surface during a specific chemical reaction. During the CMP process, polishing pad conditioning is applied to prevent the rapid degradation of the polishing quality caused by polishing pad glazing through repeated material removal processes. However, during the conditioning process, uneven wear on the polishing pad is inevitable because the disk on which diamond particles are electrodeposited is used. Therefore, the abrasion of the polishing pad should be considered not only for the variables during the conditioning process but also when designing the CMP conditioning system. In this study, three design variables of the conditioning system were analyzed, and the effect on the pad wear profile during conditioning was investigated. The three design variables considered in this study were the length of the conditioner arm, diameter of the conditioner disk, and distance between centers. The Taguchi method was used for the experimental design. The effect of the three design variables on pad wear and uniformity was assessed, and new variables used in conditioning system design were proposed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.783-786
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• 2000

For the development of a ultra-precision CMC polishing system including on-machine measurement system, we study a corrective polishing algorithm. We calculated unit removal profiles for various polishing tools and polishing tool positions. Using these results we simulate the corrective polishing process based on dwell time control. We calculate dwell time distributions and residual error of the polishing simulation method and the FFT calculation method. We got good dwell time distributions and small residual when we used the FFT calculation method. This results will be used for the optimization of corrective polishing process.

• 소성∙가공
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• 제22권2호
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• pp.74-79
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• 2013

The ultra-precision polishing method using MR fluid has come into the spotlight for polishing metals and optical materials. The MR fluid jet polishing process can be controlled using a change of viscosity by an imposed magnetic field. The MR fluid used for polishing process is a mixture of CI particles, DI water, $Na_2CO_3$ and glycerin. The efficiency of polishing depends on parameters such as polishing time, magnetic field, stand-off distance, pressure, etc. In this paper, the MR fluid jet polishing was used to polish nickel and brass mold materials, which is used to fabricate backlight units for 3-D optical devices in mobile display industries. In MR jet polishing, ferromagnetic materials like nickel can decrease the polishing efficiency by interaction with the cohesiveness of the MR fluid more than non-ferromagnetic materials like copper. A series of tests with different polishing times showed that the surface roughness of brass (Ra=1.84 nm) was lower than that of nickel (Ra=2.31 nm) after polishing for 20 minutes.

• 한국생산제조학회지
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• 제19권2호
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• pp.184-190
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• 2010

Recently, the polishing process using magnetorheological fluids(MR fluids) has been focused as a new ultra-precision polishing technology for micro and optical parts such as aspheric lenses, etc. This method uses MR fluid as a polishing media which contains required micro abrasives. In the MR polishing process, the surface roughness and material removal rate of a workpiece are affected by the process parameters, such as the properties of used nonmagnetic abrasives(particle material, size, aspect ratio and density, etc.), rotating wheel speed, imposed magnetic flux density and feed rate, etc. The objective of this research is to predict MRR according to the polishing conditions based on the multiple regression analysis. Three polishing parameters such as wheel speed, feed rates and current value were optimized. For experimental works, an orthogonal array L27(313) was used based on DOE(Design of Experiments), and ANOVA(Analysis of Variance) was carried out. Finally, it was possible to recognize that the sequence of the factors affecting MRR correspond to feed rate, current and wheel speed, and to determine a combination of optimal polishing conditions.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1682-1687
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• 2003

Die polishing technology is very critical to determine quality and performance of the final products. Generally, the rotation-type tool is used most widely in the polishing process. However it is difficult to make the mirror surface, because the method using the rotation-type tool causes a lot of tiny scratch on the polished surface. This paper proposes a new method using the oscillation-type tool that reduces the scratch and improves the surface roughness. As result. the mirror surface was able to obtain by using the oscillation-type tool. AE is known to be closely related to material removal rate(MRR). As the surface is rougher, MRR gets larger and AE increase. The surface roughness can be indirectly estimated using the AE signal measured during automatic die polishing process. In this study. an AE sensor based monitoring system was developed to investigate the relation the level of AE RMS with the surface roughness during polishing process.

• 소성∙가공
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• 제21권2호
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• pp.138-143
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• 2012

A polishing method using magnetorheological (MR) fluid has been developed as a new precision technique to obtain a fine surface. The process uses a MR fluid that consists of magnetic carbonyl iron (CI) particles, nonmagnetic polishing abrasives, water and stabilizers. But the CI particles in MR fluids cause a severe corrosion problem. When coated with Xanthan gum, the CI particles showed long-term stability in corrosive aqueous environment. The surface roughness obtained from the MR polishing process was evaluated. A series of experiments were performed on fused silica glass using prepared slurries and various process conditions, including different polishing times. Outstanding surface roughness of Ra=2.27nm was obtained on the fused silica glass. The present polishing method could be used to produce ultra-precision micro parts.

• 한국정밀공학회지
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• 제12권9호
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• pp.30-39
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• 1995

Now a days, securing skilled workers is very difficult due to the hardworking environment. This situation will be getting worse in the future and also that makes the dies/molds industries difficult. In this research, the automatic fone polishing system which can be directly attached to the spindle of CNC machine is proposed and analyzed. The system is also controlled by the NC progra data created by CAD/CAM system. The usefulness and effectiveness of the developed system are verified more detail through some comparisons between automatic and manual polishing experiments. The experiments show that the automatic polishing is a more useful and effective process than manual one. For the application, this system can be easily used for the polishing process in the area of any fine surface.

• International Journal of Precision Engineering and Manufacturing
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• 제2권1호
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• pp.18-25
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• 2001

Electrolytic polishing is the anodic dissolution process in the transpassive state. It removes non-metallic inclusion and improves mechanical and corrosion resistance of stainless steel. If there is a Bailby layer, it will be removed and the true structure of the surface will be restored. Electrolytic polishing is normally used to remove a very thin layer of material from the surface of metal object. A new electrolyte composed of phosphoric, sulfuric and distilled water has been developed in this study. Two current density, high & low current density regions, have been applied in this study. In this study, In the region of high current density, there is no plateau region but excellent electrolytic polishing effect can be accomplished in short machining time because material removel process and leveling process occur simultaneously. In the low current density region, there can be found plateau region. The material removal process and leveling process occur successively. The aim of this work is to determine electrolytic polishing for stainless steel in terms of high & low current density and workpiece surface roughness.