• 한국레이저가공학회지
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• 제12권2호
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• pp.7-10
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• 2009

In this paper, we study experimentally the local polishing of $SiO_2$ surface using the $CO_2$ laser. For laser local polishing, we polished to remove the grooves or to be reformed the surface of grooves after forming the grooves on the material surface. We measured the reflectance, transmittance, and beam profile in order to measure the roughness of polished surface. The Atom Force Microscope (AFM) is used to measure roughness of local polishing surface. We can predict that the laser polishing contribute to the removal of generated debris and surface roughness on the micro processing.

• 동굴
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• 제78호
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• pp.23-27
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• 2007

In this paper, we have investigated the characteristics of the magnetic abrasive using sludge on polishing of internal finishing of seamless stainless steel tube applying magnetic abrasive polishing. Either white alumina grain was used to resin sludge at a low temperature, and the sludge of magnetic abrasive powder was synthesized and crushed into 200 meshes. Surface roughness was measured before and after polishing, and more than 40% of improvement of surface roughness was achieved when grain was used under a specific condition. Even though some degree of surface roughness due to deeper scratches still exist, but the result showed a prospective magnetic abrasive polishing using sludge with white alumina grains.

• 한국산업융합학회 논문집
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• 제26권6_1호
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• pp.993-999
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• 2023

In this paper, a novel polishing tool mechanism with 3-axis compliance is presented, which consists of 2-axis rotational and 1-axis linear compliances in series. The 2-axis rotational compliance mechanism is made up of four cantilever beams for adjusting rotational stiffness and one flexure universal joint at the center for constraining the z-axis deflection. The 2-axis rotational compliance can mechanically adjust the polishing tool to machined surfaces. The polishing press force can be simply controlled by using a linear spring along the z-axis. The 2-axis rotational and 1-axis linear compliance design is decoupled. The stiffness analysis of the 2-axis compliance mechanism was performed based on link compliance matrix and rigid body transformation. A 3-axis polishing tool was designed by configuring the 2-axis compliance mechanism and one linear spring.

• Restorative Dentistry and Endodontics
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• 제19권2호
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• pp.513-533
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• 1994

The smooth surface after polishing of composite resin contributes to the patient's comfort, and appearance and longevity of the restoration. This study was performed for the quantitative analysis of the effects of the various finishing and polishing instruments on the surface roughness and reflectivity of the microfill, and hybrid composite resins. Cylindrical specimens 2mm thick and 10mm in diameter of Silux Plus, Durafill VS ; Z100, Prisma TPH, Brilliant, and Herculite XR composite resin were polymerized under the matrix strip. 18 specimens for each composite resin materials were divided into 6 groups ; 5 experimental groups were abraded with # 600 sand paper to remove resin-rich layer, except control. Thereafter, using diamond bur(Mani Dia-Burs), carbide bur(E. T. carbide set 4159), rubber point(Composite polishing kit), aluminum-oxide disk(Sof-Lex disk), polishing paste(Enhance system) ; each specimen was polished to its best achievable surface according to manufacturer's directions. Final polished surfaces were evaluated for the surface roughness with profilometer(${\alpha}$-step 200, Tencor instruments, USA) and for the reflectivity with image analyser(Omniment Image Analyser, Buehler, USA). The results were as follows. 1. Polishing paste or aluminum-oxide disk finish in the microfill, and hybrid composite resins was as smooth as matrix strip finish on the surface roughness test. 2. Polishing paste or aluminum-oxide disk finish in the microfill ; polishing paste finish in the hybrid composite resins was as reflective as matrix strip finish on the refectivity test. 3. For the polishing paste, there were no significant differences between the composite resin materials on the surface roughness and refectivity tests. 4. For the aluminum-oxide disk, the best result was obtained with the microfill composite resin on the surface roughness and reflectivity test. 5. Diamond bur, carbide bur, and rubber point were inappropriate for the final polishing instruments.

• 대한안전경영과학회지
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• 제11권4호
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• pp.311-317
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• 2009

In this paper deals with behavior of the magnetic abrasive using Ba-Ferrite on polishing characteristics in a new internal finishing of STS304 pipe applying magnetic abrasive polishing. The magnetic abrasive using Ba-Ferrite grain WA used to resin bond fabricated low temperature. And Ba-Ferrite of magnetic abrasive powder fabricated that Ba-Ferrite was crused into 200 mesh. The previous research have made an experiment in the static state the movement of magnetic abrasive grain is nevertheless in the dynamic state. In this paper, We could have investigated into the changes of the movement of magnetic abrasive grain. In reference to this result, we could have made the experiment which is set under the condition of the magnetic flux density, polishing velocity according to the form of magnetic brush.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.565-568
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• 2003

In this paper we deal with behavior of the magnetic abrasive using Ba-Ferrite on polishing characteristics in a new internal finishing of STS304 pipe applying magnetic abrasive polishing. The magnetic abrasive using Ba-Ferrite grain WA was used to resin bond fabricated at low temperature. And Ba-Ferrite of magnetic abrasive powder was crused into 200 mesh. The previous research made an experiment in the static and the dynamic state on the movement of magnetic abrasive grain. In this paper. We investigated into the changes of the movement of magnetic abrasive grain. In reference to this result. we have made the experiment which is set under the condition of the magnetic flux density. polishing velocity according to the form of magnetic brush.

• 디지털콘텐츠학회 논문지
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• 제3권1호
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• pp.113-122
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• 2002

반도체와 관련한 실리콘웨이퍼의 평탄도는 양질의 웨이퍼를 보증하는 가장 중요한 요소이다. 따라서 평탄도(flatness)를 측정하고 제어하는 Polishing이라는 공정은 웨이퍼 생산의 여러 라인중 특별히 중요시 되는 과정이며 현재 이 공정에서는 담당 엔지니어가 웨이퍼의 모형을 모니터에서 육안으로 관찰하여 판단하고 평탄도를 높이기 위한 제어를 하고 있다. 그러나 사람에 의한 것이므로 많은 경험이 필요하고 일일이 체크해야하는 번거로움이 있다. 본 연구는 이러한 비효율적인 작업의 효율화를 위해 이루어 졌으며 Polishing 공정에 있어 평탄도를 사람이 아닌 시스템에 의해 자동으로 측정하여 제어하는 알고리즘을 제안한다. 여기서 제안한 시스템은 보간 다항식을 이용하여 웨이퍼 전역의 두께를 추정하고 Polishing공정에서 평탄도를 높이기 위해 제어 가능한 모형별로 분류할 수 있도록 하였다.

• 한국기계가공학회지
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• 제11권2호
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• pp.144-151
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• 2012

Polishing is not only one of the most frequently adopted processes in modern industries, but also the most critical one to the surface quality of the products such as semi conductor wafers and LED sapphire wafers. With the required specifications for the wafer surface quality getting more and more strengthened, the manufacturers are spending huge amount of cost to renew the machine to meet the enhanced surface specifications. Surface qualities of the wafers are mostly damaged by the structural vibrations of the polishing machines. In this paper, the dynamic characteristics of a wafer polishing machine have been analyzed through the frequency response test and the computer simulation. And the supporting structure of a polishing machine has been investigated to minimize the vibration transmissions, to improve the stability of the machine and further to reduce the defects of the polished products. The result of the study shows that simple design modifications of the supporting structure without altering the main structure of the machine can substantially suppress the vibrations of the machine with negligible expenses.

• 한국기계가공학회지
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• 제19권3호
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• pp.22-28
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• 2020

This paper investigates the effects of retaining ring materials, particularly PPS and PEEK, used in the CMP process, on wafer polishing and ring wear. CMP can be performed using bonded type retaining rings made with PPS or injection molding type retaining rings made with PEEK. In this study, after polishing a wafer with a PPS retaining ring, the average profile height of the wafer was 0.098 ㎛ less than that of the wafer polished with a PEEK retaining ring, implying that PPS retaining rings achieve a higher polishing rate. In addition, the center area of the wafer profile had less deviation and improved flatness after polishing with the PPS ring. These results indicate that a higher polishing rate and smaller profile height deviation can be achieved using retaining rings made with PPS compared to retaining rings made with PEEK. Therefore, with semiconductor circuit patterns becoming finer and wafer sizes becoming larger, the use of PPS in CMP retaining rings can obtain more stable wafer polishing results compared to that of PEEK.

• 한국정밀공학회지
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• 제13권6호
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• pp.59-65
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• 1996

There are many difficulties in automatic polishing for die & mold surfaces. Even though the process has been studied in the past 15 years, it has not been achieved yet, but by the process of actual hand work of well-skilled workers. A new magentic assisted polishing process, which is one of the potential methods for automation of surface finishing has been studied in the past 10 years by colleagues. The process has many merits, but on the other hand also has demerits, one being low efficiency of grindability by comparision with wheel polish. Therefore, some attempts were tried to improve the grindability by adopting electropolishing, ultra-high speed milling, 5-axis controlled machine etc... most recently by colleagues. This paper also aims to improve the efficiency of polishing by introducing the easily-polished shape surface cutting method equalizing the tool feed per revolution to the pick feed. This cutting method was experimentally confirmed to have sufficient grindability to polish milled surface (with $10{{\mu}m}$Rmax surface roughness) into mirror surface (with $0.4{{\mu}m}$Rmax surface roughness).