• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.10
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• pp.1041-1048
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• 2004

Chemical mechanical polishing (CMP) process was studied in terms of tribology in this paper. CMP performed by the down force and the relative motion of pad and wafer with slurry is typically tribological system composed of friction, wear and lubrication. The piezoelectric quartz sensor for friction force measurement was installed and the friction force was detected during CMP process. Various friction signals were attained and analyzed with the kind of pad, abrasive and abrasive concentration. As a result of experiment, the lubrication regime is classified with ηv/p(η, v and p; the viscosity, relative velocity and pressure). The characteristics of friction and material removal mechanism is also different as a function of the kind of abrasive and the abrasive concentration in slurry. Especially, the material removal per unit distance is directly proportional to the friction force and the non~uniformity has relation to the coefficient of friction.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.231-234
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• 2004

Chemical mechanical polishing(CMP) process was studied in terms of tribology in this paper. CMP performed by the down force and the relative motion of pad and wafer with the slurry is typically tribological system composed of friction, wear and lubrication. The piezoelectric quartz sensor for friction force measurement was installed and the friction force was detected during CMP process. Various coefficient of friction was attained and analyzed with the kind of pad, abrasive and the abrasive concentration. The lubrication regime is also classified with ${\eta}v/p(\eta,\;v\;and\;p;$ the viscosity, relative velocity and pressure). Especially, the co-relation not only between the friction force and the removal per unit distance but also between the coefficient of friction and within-wafer-nonuniformity was estimated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.653-654
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• 2005

Stick-slip friction is one of the material removal mechanisms in tribology. This stick-slip friction occurs when the static friction force is larger than the dynamic friction force, and make the friction curve fluctuated. In the friction force monitoring system for chemical mechanical polishing(CMP), the friction force also vibrates just as stick-slip friction. It seems that the stick-slip friction causes scratches on the surface of moving parts. In this paper, A study on the scratches which occur during copper CMP was conducted in a view of stick-slip friction.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.10a
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• pp.76-76
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• 2003

• The Journal of Korean Academy of Prosthodontics
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• v.35 no.2
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• pp.277-295
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• 1997

After clinical adjustment of dental casting restoration, re-polishing procedure is recommanded because the smooth gold sureface is lost. But there is the possibility to get more loose contact than that intended by loss of gold alloy according to the kinds of polishing materials and polishing time. Therefore in this study I polished type II gold alloy with 390gm force, 20,000rpm speed, and 8 kinds of gold alloy polishing materials, fabricated by 4 companies and then measured the amount of loss of gold alloy with Surfcorder SEF-30D and observed alloy surfaces polished by 3 brown rubber points with SEM. The amount of loss of gold alloys polished with 8 kinds of polishing materials and the degree of smoothness of gold alloys according to polishing time and polishing materials were compared. The following results were obtained : 1. When the amount of loss of gold alloys polished with 3 kinds of brown rubber point was compared, Alphalex brown point had the most amount of alloy loss, followed in decreasing order by Shofu brown point and Eveflex brown point. There was statistically significant difference in the amount of alloy loss according to polishing materials. 2. When the amount of loss of gold alloys polished with 5 kinds of green rubber point was compared, Shofu green point had the most amount of alloy loss, followed in decreasing order by Alphaflex green point, Dedeco green clasp polisher, and Eveflex green point. There was statistically significant difference in the amount of alloy loss according to polishing materials except Alphaflex green point and Dedeco green clasp polisher. 3. When the amount of loss of gold alloys polished with all kinds of rubber point was compared, there was no significant difference in Eveflex brown point, Alphaflex green point, and Dedeco green clasp polisher. 4. When average amount of alloy loss per 1 revolution by polishing materials was compared, Alphalex brown point had the greatest value as $0.329{\mu}m$ and Shofu supergreen point had the lowest value as $0.022{\mu}m$. 5. When the degree of sureface smoothness of gold alloy polished with 3 kinds of brown rubber point was compared, In Alphalex brown point surface roughness was completely lost after 20 seconds polishing time, in Shofu brown point 30 seconds, in Eveflex brown point 40 seconds. But in every gold alloys fine scratch formed by rubber points was observed. Based on the results of this study, as rubber polishing materials used in polishing of dental casting restoration after clinical adjustment influenced on the tightness of occlusal or proximal contact, we should make dental casting restoration with minimum error through careful laboratory procedure and form very smooth surface of restoration with tripoli and rouge after use of silicone polishing materials.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.3
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• pp.41-49
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• 2010

Two promising control candidates have been selected to test the sinusoidal reference tracking performance for a brush-type polishing machine having strong nonlinearities and disturbances. The controlled target system is an oscillating mechanism consisting of a common positioning stage of one degree-of-freedom with a screw and a ball nut driven by a servo motor those can be obtained commercially. Beside the strong nonlinearity such as stick-slip friction, the periodic contact of the polishing brush and the work piece adds an external disturbance. Selected control candidates are a Sliding Mode Control (SMC) and a variant of a feedback linearization control called Smooth Robust Nonlinear Control (SRNC). A SMC and SRNC are selected since they have good theoretical backgrounds, are suitable to be implemented in a digital environment and show good disturbance and modeling uncertainty rejection performance. It should be also noted that SRNC has a nobel approach in that it uses the position information to compensate the stickslip friction. For both controllers analytical and experimental studies have been conducted to show control design approaches and to compare the performance against the strong nonlinearity and the disturbances.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.5 s.98
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• pp.151-159
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• 1999

A self-propulsive polishing robot is proposed as a method which automates a floor polisher. The proposed robot with two rotary brushes does not require any mechanism such as wheels to obtain driving forces. When the robot polishes a floor with its two brushes rotating, friction forces occur between the two brushes and the floor. These friction forces are used to move the robot. Thus, the robot can move in any direction by controlling the two rotary brushes properly. In this paper, firstly a dynamics model of a brush is presented. It computes the friction force between the brush and the floor. Secondly, the dynamics of the proposed robot is presented by using the bush dynamics. Finally, the inverse dynamics is solved for the basic motions, such as the forward, backward, leftward, rightward motions and the pure rotaion. This paper will contribute to realize a self-propulsive polishing robot as proposed above, In addition, this paper will give basic ideas to automate the concrete floor finishing trowel, because its basic idea for motion is similar to that of the proposed robot.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.37.2-37.2
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• 2011

반도체공정에서 Photo-lithography는 특정 광원을 사용하여 구현하고자 하는 패턴을 기판상에 형성하는 기술이다. 이러한 Photo-lithography 공정에서는 패턴이 형성되어 있는 마스크가 핵심적인 역할을 하며 반도체소자의 전체적인 성능을 결정한다. 이에 따라 Photo-lithography용 마스크에 사용되는 Blank 마스크는 Defect의 최소화 및 우수한 평탄도 등의 조건들이 요구되고 있다. 이러한 Blank 마스크 재료로 광원을 효율적으로 투과시키는 성질이 우수하고 다른 재료에 비해 열팽창계수가 작은 석영기판이 사용되고 있다. 석영 기반의 마스크는 UV Lithography에서 주로 사용되고 있으며 그 밖에 UV-NIL (Nano Imrpint Lithography), EUVL (Extreme Ultra Violet Lithography) 등에도 이용되고 있다. 석영기판을 가공하여 Blank 마스크로 제작하기 위해 석영기판의 Lapping/Polishing 등이 핵심기술이며 현재 일본에서 전량 수입에 의존하고 있어, 이에 대한 연구의 필요성이 절실한 상황이다. 본 연구에서는 Blank 마스크제작을 위한 석영기판의 Polishing 공정에 사용되는 Ceria Slurry의 특성 연구 및 이에 따른 연마평가를 실시하였으며 첨가제의 조건에 따른 pH/Viscosity/Stability 등의 물리적인 특성을 관찰하여 석영기판 Polishing에 효율적인 Ceria slurry의 최적조건을 도출했다. 또한, 조건에 따른 Slurry의 정확한 분석을 위해 Zeta Potential Analyzer를 이용하여 연마입자의 크기 및 Zeta Potential에 대한 평가를 실시한 후 연마제와 석영기판의 Interaction force를 측정하였다. 상기 실험에 의해 얻어진 최적화된 연마 공정 조건하에서 Ceria slurry를 사용하여 연마평가를 실시함으로써 Removal Rate/Roughness 등의 결과를 관찰하였다. 본 연구를 통해 반도체 photo mask 제작을 위한 Ceria slurry의 주요특성을 파악하고 석영기판의 Polishing에 효율적인 조건을 도출함으로써 Lithography 마스크를 효율적으로 제작할 수 있을 것으로 예상된다.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.4 no.3
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• pp.25-30
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• 1995

A new finishing process, magnetic-electrolytic-abrasive polishing(MEAP), combining Lorentz' force effect in the traditional electrolytic finishing process was developed to realize the high efficiency as well as high surface quality of finishing . The paper describes the theoretical basis about the modification of electrolytic ions motion by the magnetic field. The effect of magnetic field on the electrolytic process was discussed was and analyzed from the result of model test.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1816-1821
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• 2003

The sapphire wafer for blue light emitting device was manufactured by the implementation of the chemical and mechanical polishing process. The surface polishing of crystalline sapphire wafer was characterized by zeta potential measurement. The reduction process with the alkali slurry provides the surface chemical reaction with sapphire atoms. The poly-urethane pad also provides the frictional force to take out the chemically-reacted surface layers. The surface roughness was measured by the atomic force microscope and the crystalline quality was characterized by the double crystal X -ray diffraction analysis.