• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.2
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• pp.276-281
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• 2014

In this research, we describe a force feedback control for industrial robots has been proposed as a system which is suitable to work utilizing pressure sensitive alternative to human. Conventionally, polished surface of the workpiece are recognized, chamfer ridge, machining processes such as deburring, and it is most difficult to automate because of its complexity, has been largely dependent on the human. To aim to build automatic vacuum system robotic force control was gripping the grinding tool, the present study we examined the adaptability to the polishing process to understand the characteristics of the control system feedback signal obtained from the force sensor mainly. Furthermore, as a field, which holds the key to the commercialization, I went ahead with the application to robotic sweeping machine. As a result, the final sweeping utilizing a robot machine to obtain a very good grinded surface was revealed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.972-975
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• 2002

An understanding of tribological behavior in CMP(Chemical Mechanical Polishing) is one of the most important things to reveal the mechanism of material removal. In CMP, the contact type is thought to be semi-direct, elastohydrodynamic contact type from the Stribeck diagram, which is a combination of solid-solid direct contact and hydrodynamic lubrication with thin liquid film. This study is focused on the decay of friction force during CMP from two points of view, one of which is change of the real contact area and the other is the decrease of the elastic modulus of the pad caused by the increase of the temperature during CMP Experiments are implemented with elastic modulus measuring system and tool dynamometer. Results show that the decay of friction force during CMP results from the decrease of the real contact pressure working on an abrasive, which is induced by the decrease of elastic modulus of pad caused by the increase of temperature. And, the phenomenon is thought to be happen specially in the case that the weight concentration of abrasive in slurry is small enough.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.11
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• pp.939-945
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• 2002

The rise throughput and the stability in the device fabrication can be obtained by applying chemical mechanical polishing (CMP) process in 0.18 $\mu\textrm{m}$ semiconductor device. However, it still has various problems due to the CMP equipment. Especially, among the CMP components, process variables are very important parameters in determining the removal rate and non-uniformity. In this paper, we studied the DOE (design of experiment) method in order to get the optimized CMP equipment variables. Various process parameters, such as table and head speed, slurry flow rate and down force, have investigated in the viewpoint of removal rate and non-uniformity. Through the above DOE results, we could set-up the optimal CMP process parameters.

• Tribology and Lubricants
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• v.33 no.5
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• pp.214-219
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• 2017

Abrasive fluidized bed machining (AFBM) is similar to general abrasive fluidized machining (AFM) in that it can perform polishing of the outer and inner surfaces of a 3-dimensional shape by the flow of particles. However, in the case of AFM, the shear force generated by the flow of the particles causes material removal, while in AFBM, the abrasive particles are suspended in the chamber to form a bed. AFBM can be used for deburring, polishing, edge contouring, shot peening, and cleaning of mechanical parts. Most studies on AFBM are limited to metals, and research on application of AFBM to plastic materials has not been performed yet. Therefore, in this study, we investigate the effect of rotating speed of the specimen and the air flow rate on the material removal characteristics during AFBM of polyacetal with a horizontal AFBM machine. The material removal rate (MRR) increases linearly with increase of the rotating speed of the main shaft because of the shear force between the particles of the fluidized bed and the rotation of the workpiece. The reduction in surface roughness tends to increase as the rotating speed of the main shaft increases. As the air flow rate increases, the MRR tends to decrease. At a flow rate of 70 L/min or more, the MRR remains almost constant. The reduction of the surface roughness of the specimen is found to decrease with increasing air flow rate.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.58-58
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• 2009

Uniformity related issues in chemical mechanical polishing (CMP) are within wafer non-uniformity (WIWNU), wafer to wafer non-uniformity (WTWNU), planarity and dishing/erosion. Here, the WIWNU that originates from spatial distribution of independent variables such as temperature, sliding distance, down force and material removal rate (MRR) during CMP, relies to spatial dependency. Among various sources of spatial irregularity, hardness and modulus of pad and surface roughness in sources for pad uniformity are great, especially. So, we investigated the spatial variation of pad surface characteristics using pad measuring system (PMS) and roughness measuring system. Reduced peak height ($R_{pk}$) of roughness parameter shows a strong correlation with the removal rate, and the distribution of relative sliding distance onwafer during polishing has an effect on the variation of $R_{pk}$ and WIWNU. Also, the results of pad wear profile thorough developed pad profiler well coincides with the kinematical simulation of conditioning, and it can contribute for the enhancement of WIWNU in CMP process.

• The korean journal of orthodontics
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• v.22 no.4 s.39
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• pp.823-836
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• 1992

Guiding a tooth along an arch wire results in a counteracting frictional force among arch wires, bracket and ligature. This frictional forces should be eliminated or minimized when orthodontic teeth movement is being planned. The purpose of this study was to evaluate the changes of width, cross-sectional forms and surface morphologies of stainless steel wire and $Elgiloy^{\circledR}$ wire after electropolising. Experimental variables included in this experiment were arch wire materials, current, electrolyte temperature and polishing time. Wire widths were measured by micrometer and cross-sectional forms and surface morphologies were examined with optical microscope and scanning electron microcope. The results were as follows: 1. The mean and standard deviation of widths of stainless steel wire and $Elgiloy^{\circledR}$ wire varying polishing time with condition of $249A/dm^2$ and $20^{\circ}C,\;249A/dm^2$ and, $332A/dm^2$ and $20^{\circ}C$ and $332A/dm^2$ and $250^{\circ}C$ were obtained. 2. With increasing polishing time, the widths of stainless steel wire and $Elgiloy^{\circledR}$ wire became decreased proportionally 3. The changes of widths of stainless steel wire and $Elgiloy^{\circledR}$ wire were statistically insignificant between $20^{\circ}C$ group and $25^{\circ}C$ group, but significant between $249A/dm^2$ group and $332A/dm^2$ group. 4 The cross-sectional forms of wire after electropolishing were not changed in stainless steel wire, and while it were changed to rounded corners in $Elgiloy^{\circledR}$ wire. 5. The surface morphologies of wire after electropolishing were scratch-absent and more smoothened both in stainless steel wire and $Elgiloy^{\circledR}$ wire.

• Tribology and Lubricants
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• v.32 no.2
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• pp.67-71
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• 2016

This study investigates the characteristics of the sapphire wafer chemical mechanical polishing (CMP) process. The material removal rate is one of the most important factors since it has a significant impact on the production efficiency of a sapphire wafer. Some of the factors affecting the material removal rate include the pressure, platen speed and slurry. Among the factors affecting the CMP process, we analyzed the trends in the material removal rate and surface roughness, which are mechanical factors corresponding to both the pressure and platen speed, were analyzed. We also analyzed the increase in the material removal rate, which is proportional to the pressure and platen speed, using the Preston equation. In the experiment, after polishing a 4-inch sapphire wafer with increasing pressure and platen speed, we confirmed the material removal rate via thickness measurements. Further, surface roughness measurements of the sapphire wafer were performed using atomic force microscopy (AFM) equipment. Using the measurement results, we analyzed the trends in the surface roughness with the increase in material removal rate. In addition, the experimental results, confirmed that the material removal rate increases in proportion to the pressure and platen speed. However, the results showed no association between the material removal rate and surface roughness. The surface roughness after the CMP process showed a largely consistent trend. This study demonstrates the possibility to improve the production efficiency of sapphire wafer while maintaining stable quality via mechanical factors associated with the CMP process.

• Transactions on Electrical and Electronic Materials
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• v.12 no.3
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• pp.115-118
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• 2011

Process characterization of the chemical mechanical polishing (CMP) process for undensified phosphosilicate glass (PSG) film is reported using design of experiments (DOE). DOE has been addressed to experimenters to understand the relationship between input variables and responses of interest in a simple and efficient way. It is typically beneficial for determining the adequate size of experiments with multiple process variables and making statistical inferences for the responses of interests. Equipment controllable parameters to operate the machine include the down force (DF) of the wafer carrier, pressure on the backside of the wafer, table and spindle speed (SS), slurry flow rate, and pad condition. None of them is independent; thus, the interaction between parameters also needs to be indicated to improve process characterization in CMP. In this paper, we have selected the five controllable equipment parameters, such as DF, back pressure (BP), table speed (TS), SS, and slurry flow (SF), most process engineers recommend to characterize the CMP process with respect to material removal rate (RR) and film uniformity as a percentage. The polished material is undensified PSG. PSG is widely used for the plananization in multi-layered metal interconnects. We identify the main effect of DF, BP, and TS on both RR and film uniformity, as expected, by the statistical modeling and analysis on the metrology data acquired from a series of $2^{5-1}$ fractional factorial design with two center points. This revealed the film uniformity of the polished PSG film contains two and three-way interactions. Therefore, one can easily infer that the process control based on better understanding of the process is the key to success in semiconductor manufacturing, typically when the wafer size reaches 300 mm and is continuously scheduled to expand up to 450 mm in or little after 2012.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.50-53
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• 2003

CMP (chemical mechanical polishing) process remained to solve several problems in deep sub-micron integrated circuit manufacturing process. especially consumables (polishing pad, backing film, slurry, pad conditioner), one of the most important components in the CMP system is the slurry. Among the composition of slurries (buffer solution, bulk solution, abrasive particle, oxidizer, inhibitor, suspension, antifoaming agent, dispersion agent), the abrasive particles are important in determining polish rate and planarization ability of a CMP process. However, the cost of abrasives is still very high. So, in order to reduce the high COO (cost of ownership) and COC (cost of consumables) in this paper, we have collected the silica abrasive powders by filtering after subsequent CMP process for the purpose of abrasive particle recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size and hardness. Also, we annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slurry. As our experimental results, we obtained the comparable removal rate and good planarity with commercial products. Consequently, we can expect the saving of high cost slurry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.145-148
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• 2003

Recently, the recycle of CMP (chemical mechanical polishing) slurries have been positively considered in order to reduce the high COO (cost of ownership) and COC (cost of consumables) in CMP process. Among the composition of slurries (buffer solution, bulk solution, abrasive particle, oxidizer, inhibitor, suspension, antifoaming agent, dispersion agent), the abrasive particles are one of the most important components. Especially, the abrasive particles of slurry are needed in order to achieve a good removal rate. However, the cost of abrasives, is still very high. In this paper, we have collected the silica abrasive powders by filtering after subsequent CMP process for the purpose of abrasive particle recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size and hardness. Also, we annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slury, As our experimental results, we obtained the comparable removal rate and good planarity with commercial products. Consequently, we can expect the saving of high cost slurry.