• 한국기계가공학회지
• /
• 제12권2호
• /
• pp.100-106
• /
• 2013

Stainless steel has some excellent properties as the material for the mechanical component. Purpose of this study is carried out to obtain mirror surface on the surperfinishing of stainless steel with high efficiency. To achieve this, we have conducted a series of polishing experiment for stainless steel using abrasive film from the perspective of oscillation speed, the rotational speed of workpiece, contact roller hardness, contact pressure and feed rate. Abrasive film used this study is a micro-finishing film and a lapping film. Furthermore, the polishing characteristics and efficiency of stainless steel is discussed through measuring optimal polishing time and surface roughness. From the obtained results, it was confirmed that efficient superfinishing conditions and polishing characteristic of Stainless steel can be determined.

• Transactions on Electrical and Electronic Materials
• /
• 제3권4호
• /
• pp.5-9
• /
• 2002

Chemical mechanical polishing (CMP) has become the preferred planarization method for multilevel interconnect technology due to its ability to achieve a high degree of feature level planarity. Especially, to achieve the higher density and greater performance, shallow trench isolation (STI)-CMP process has been attracted attention for multilevel interconnection as an essential isolation technology. Also, it was possible to apply the direct STI-CMP process without reverse moat etch step using high selectivity slurry (HSS). In this work, we determined the process margin with optimized process conditions to apply HSS STI-CMP process. Then, we evaluated the reliability and reproducibility of STI-CMP process through the optimal process conditions. The wafer-to-wafer thickness variation and day-by-day reproducibility of STI-CMP process after repeatable tests were investigated. Our experimental results show, quite acceptable and reproducible CMP results with a wafer-to-wafer thickness variation within 400$\AA$.

• 대한기계학회논문집A
• /
• 제38권9호
• /
• pp.1013-1018
• /
• 2014

자기연마가공은 연마입자와 자성입자를 혼합한 공구의 유연성을 이용하여, 공작물 표면을 폴리싱하는 특수가공법이다. 기존 연구의 대부분은 가공 정밀도를 향상시키기 위해서 연마입자의 크기를 달리 하는 것에 관한 내용들이다. 그러나 자기연마 가공에서는 연마입자의 크기뿐만 아니라, 자성입자의 크기도 가공에 많은 영향을 미칠 것으로 판단되며 이에 대한 연구가 반드시 필요하다. 따라서 본 연구에서는 크기가 다른 자성입자들을 사용하여 자기연마가공의 효과를 평가하였다. 자성입자는 철분말을 사용하였으며, 직경이 평균 8, 78, $250{\mu}m$의 크기이다. 공작물의 표면거칠기 향상 정도를 비교하여 자성입자의 크기가 자기연마가공의 정밀도에 미치는 효과를 평가하였다. 자성입자의 크기는 표면거칠기의 향상에 많은 영향을 미치며, 직경이 $78{\mu}m$일 때 가장 좋은 표면거칠기의 향상을 나타내었다.

• 한국윤활학회:학술대회논문집
• /
• 한국윤활학회 1998년도 제28회 추계학술대회
• /
• pp.272-277
• /
• 1998

Chemical-Mechanical Polishing (CMP) refers to a material removal process done by rubbing a work piece against a polishing pad under load in the presence of chemically active, abrasive containing slurry. CMP process is a combination of chemical dissolution and mechanical action. The mechanical action of CMP involves tribology. The liquid slurry is trapped between the wafer(work piece) and pad(tooling) forming a lubricating film. For the first step to understand material removal rate of the CMP process, the lubricational analyses were done with commercial 100mm diameter silicon wafers to get nominal clearance of the slurry film, roll and pitch angle at the steady state. For this purpose, we calculate slurry pressure, resultant forces and moments at the steady state in the range of typical industrial polishing conditions.

• 한국공작기계학회논문집
• /
• 제17권4호
• /
• pp.35-41
• /
• 2008

R/In order to satisfy the customer's variant needs for a product quality in recent years, a demand for developing higher precision machining technologies in a lot of application areas such as automobile, cellular phone and semiconductor has been increased more and more. Magnetic abrasive polishing(MAP) process is one of these precision technologies. In this study, to verify the parameters' effect of the MAP process on the surface roughness improvement of the plane and the inclined workpiece, well planned experiments which was called the design of experiments were carried out. Considered polishing factors were spindle speed, supplied current, abrasive type and working gap between the workpiece and the solid tool. As a result, it was seen that the supplied current and the working gap greatly affected the surface roughness improvement.

• 한국정밀공학회지
• /
• 제17권1호
• /
• pp.179-184
• /
• 2000

Chemical Mechanical Polishing (CMP) refers to a material removal process done by rubbing a work piece against a polishing pad under load in the presence of chemically active and abrasive containing slurry. CMP process is a combination of chemical dissolution and mechanical action. The mechanical action of CMP involves hydrodynamic behavior. The liquid slurry is trapped between the work piece and pad forming a hydrodynamic film. For the first step to understand material removal mechanism of the CMP process, the hydrodynamic analysis is done with semiconductor wafer. Three-dimensional Reynolds equation is applied to get pressure distribution of the slurry film. Shear stress distributions on the wafer surface are also analyzed

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 1995년도 추계학술대회 논문집
• /
• pp.43-47
• /
• 1995

The ball screw is one of the important mechanical parts for the linear motion feeding systems. The usage of the ball screw has been growing in various industrial fields such as CNC machine tool, industrial robot and automated systems. Because of ever increasing demand for ball screws, increased accuracy and quality of the ball screw is needed,especially the surface roughness of the ball contact area in order to diminish noise and vibration. Therefore to improve the surface roughness of the area,we introduced magnetic assisted polishing which is one of the new potential polishing methods. In this study, diamond slurry and iron powder was used for magnetic assisted polishing of the ball bearing surface. This polishing process was experimentally confirmed to improve the surface roughness of the ball bearing.

• 한국공작기계학회논문집
• /
• 제11권1호
• /
• pp.45-51
• /
• 2002

To reduce the cost and increase reliability of die and mold products, automation of the finishing (polishing) process is essential. A major element of automation is a reliable database and a knowledge base for polishing status. This paper presents a polishing expert system which can determine optimal polishing sequences and conditions by using an empirical formula and an experimental database. The simplex method was used for the curve fittings of the experimental results. Also a graphical user interface, which visualizes the optimized results, was developed.

• 한국공작기계학회:학술대회논문집
• /
• 한국공작기계학회 1996년도 춘계학술대회 논문집
• /
• pp.124-131
• /
• 1996

The use of small hemispherical high-speed precision bearing has increased drastically these days in the field of computer disk driver, highteech devices as well as communication and electronic device drivers. It was suggested that the new polishing process adopting the diamond grinding wheel and polishing tool instead of multi stage lapping processes, which enables the mass production of the bearing by reduction of polishing time. Polishing mechanism was analysed and the results were applied to the design and manufacturing of the polishing system. Experiments for selection of optimal polishing conditions were carried out using the polishing system.

• 한국공작기계학회논문집
• /
• 제16권6호
• /
• pp.133-139
• /
• 2007

In this paper, optics polishing technology using adaptive tool and eccentric motion mechanism was suggested. Optics polishing can make high reflective and accurate surface. The optics polishing process based on the eccentric motion mechanism has been used to manufacture the ophthalmic lens mold. Also ophthalmic lens mold factory hold conventionally a lot of the curved polishing tools for the versatile mold curves of eye diopters and want to reduce tool numbers. Therefore, a polishing machine with adaptive airbag tool was developed and experimentally verified in view of surface roughness and form accuracy.