• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2022년도 가을 학술논문 발표대회
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• pp.35-36
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• 2022

In order to supplement the flame-retardant performance of oil stain, which can prevent wooden buildings from contamination, (NH4)2HPO4, a phosphorus flame-retardant, was added to oil stain and applied for each type of plywood, and an experiment was conducted. The addition rate was set to 0-60%, but white powder appeared on the surface of plywood from 40% and thus it was impossible to experiment, so the maximum addition rate was selected as 30%. As a result of the experiment, acacia plywood had the best performance. As the rate of addition of the flame retardant increased, the remaining time and carbonization length of all plywood decreased, but the carbonization length of the MDF plywood was not met with the standards.

• Journal of the Korean Wood Science and Technology
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• 제26권1호
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• pp.14-18
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• 1998

A low density polyethylene(LDPE) was examined as an additive in phenol-formaldehyde(PF) resin adhesive for bonding radiata pine plywood. The LDPE was supplied by the commercial manufacturer. The LDPE was compared to a commercial filler commonly used in structural plywood adhesives in the United States. The adhesive mixes were made by following the recommended procedure of Georgia-Pacific Resins Inc.. using plywood-type PF resin. A total of 48 three-ply plywoods. 6.3 mm nominal thickness and 30 by 30 em in size, were made at two press times (4 and 5 min). two press temperatures (150 and $160^{\circ}C$) and 30 minute assembly times for four adhesive mixing types. Evaluations of the LDPE addition were carried out by performance tension shear tests after two cycle boil aging tests on plywood per the U.S. Product Standard PS I-83. After accelerated-aging tests. plywoods were exhibited no delamination. The test results included tension shear strength and estimated wood failure values. The plywood test results support the use of polyethylene as an additive in plywood adhesives.

• Journal of the Korean Wood Science and Technology
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• 제37권5호
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• pp.440-450
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• 2009

In case of wood flooring, the high emissivity would be one of the most important properties especially as the cover material of underfloor heating system. The FIR (Far Infrared) materials such as wood emit FIR energy by heating, which has been used as the medical therapy such as dry sauna. This research investigated the emissivity and the emission power of wood composites by comparing the amount of the three heat transfer modes transferred by infrared radiation which came from the increased temperature of the bottom board of the plywood box by the heater. The results showed the value of radiation mode was the highest mode for the plywood box, and the convection mode was the main mode for the aluminum box. The rate of convection was 81.8% in the aluminum box and 48.2% in the plywood box, respectively. In case of the rate of radiation, the aluminum box showed only 15.4% and the plywood box showed 51%. The emissivity and the emission power of birch plywood showed the same values as those of wood. The amount of energy required for the temperature rising of water within vial in the aluminum box and in the plywood box were 3.32 kJ and 6.70 kJ respectively, which showed that the vial temperature of the plywood box was two times higher than that of the aluminum box.

• Journal of the Korean Wood Science and Technology
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• 제45권2호
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• pp.223-231
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• 2017

This work was conducted to investigate on the effect of urea-formaldehyde (UF) resin viscosity on plywood adhesion. The viscosity of UF resin was controlled either by adjusting the condensation reaction during its synthesis to obtain different target viscosities (100, 200 and 300 mPa.s) at two levels of formaldehyde/urea (F/U) mole ratios (1.0 and 1.2) or by adding different amounts (10, 20 and 30%) of wheat flour into the resins for the manufacture of plywood. When the viscosity of UF resin increased by the condensation reaction, the adhesion strength of plywood bonded with UF resin of 1.2 F/U mole ratio consistently increased, while those bonded with the 1.0 F/U mole ratio resin slightly decreased, suggesting a difference in the adhesion in plywood. However, the adhesion strength of plywood decreased as the viscosity increased by adding wheat flour, regardless of F/U mole ratio. The manipulation of UF resin viscosity by adjusting the condensation reaction was much more efficient than by adding wheat flour in improving the adhesion performance of plywood. These results indicated that a way of controlling the viscosity of UF resin adhesives has a great influence to their adhesion in plywood.

• Journal of the Korean Wood Science and Technology
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• 제18권2호
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• pp.67-78
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• 1990

This study was performed to determine the characteristics of physical and mechanical properties of domestic wood based materials; plywood, particleboard, medium density fiberboard. Main items of tested properties were panel size, moisture content, water absorption, linear expansion and thickness swelling, glue bond shear strength, bending properties(stress at proportional limit, modulus of rupture. modulus of elasticity), tensile strength, screw holding strength, and internal bond as neccessary. the results were discussed mainly with Korean Standards. The obtained conclusions are as follows; 1. Length and width of 3mm thin plywood(3-ply) and 12mm thick plywood(7-ply) were satished with KS-standard, but thicknesses of these panels were not- passed tolerance limit except one of eight makers. 2. Length and width of particleboard and medium density fiberboard were greater than the tolerance limit value of KS standard, but the thicknesses of these panels were passed this value. 3. Moisture contents of 12mm thick and 3mm thin plywood were satisfied with KS-standard except one mill made 3mm thin plywood. 4. Moisture absortion of plywood was not passed tolerance limit of KS-standard but particleboard was satisfied with this standard value. 5. Dry and wet shear strengths in glue bond of 3mm thin plywood were not reached to KS-standard, but those of 12mm thick plywood were sufficiently satisfied with KS standrad. 6. Modulus of ruptures, parallel to grain and perpendicular to grain of plywood, and particleboard and medium density fiberboard were satisfied with KS-standard. 7. Tensile strengths, parallel to grain and perpendicular to grain of plywood were satisfied with allowance stress of US product standard PS 1-74. 8. Screw holding strength of particleboard was not reached to KS standard, but internal bond was satisfied with KS standard.

• 한국산림과학회지
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• 제97권2호
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• pp.140-143
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• 2008

This study compared the plywood demand prediction accuracy of econometric and vector autoregressive models using Korean data. The econometric model of plywood demand was specified with three explanatory variables; own price, construction permit area, dummy. The vector autoregressive model was specified with lagged endogenous variable, own price, construction permit area and dummy. The dummy variable reflected the abrupt decrease in plywood consumption in the late 1990's. The prediction accuracy was estimated on the basis of Residual Mean Squared Error, Mean Absolute Percentage Error and Theil's Inequality Coefficient. The results showed that the plywood demand prediction can be performed more accurately by econometric model than by vector autoregressive model.

• 한국해양공학회지
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• 제31권3호
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• pp.241-247
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• 2017

Plywood, which is created by bonding an odd number of thin veneers perpendicular to the grain orientation of an adjacent layer, was developed to supplement the weak points such as contraction and expansion of conventional wood materials. With structural merits such as strength, durability, and good absorption against impact loads, plywood has been adopted as a structural material in the insulation system of a membrane type liquefied natural gas (LNG) carrier. In the present study, as an attempt to resolve recent failure problems with plywood in an LNG insulation system, conventional PF (phenolic-formaldehyde) resin plywood and its alternative MUF (melamine-urea-formaldehyde) resin bonded plywood were investigated by performing material bending tests at ambient ($20^{\circ}C$) and cryogenic ($-163^{\circ}C$) temperatures to understand the resin and grain effects on the mechanical behavior of the plywood. In addition, the failure characteristics of the plywood were investigated with regard to the grain orientation and testing temperature.

• Journal of the Korean Wood Science and Technology
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• 제18권4호
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• pp.86-101
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• 1990

The primary objective of this research was to investigate the strength properties of Comply, a composite panel. fabricated with particle board as core material and veneer or plywood as face and back. 20types of comply composites were manufactured according to the four specific gravity levels(0.5, 0.6, 0.7 or 0.8) of particleboard core and three veneer or two plywood thicknesses for face and back. They were tested and compared with matching particleboard (control) on moisture content. specific gravity, bending properties(MOE, MOR SPL). nail resistance and internal bond strength. The obtained results were summarized as follows: The increasing effect of modulus of elasticity was shown by the increase of face and back veneer or plywood thickness. The modulus of rupture and stress at proportional limit of the comply composites bonded with 3mm thick veneers or 3mm thick plywood face and back were higher than 2mm thick veneer or 2mm thick plywood as face and back. Both of modulus of rupture and stress at proportional limit on bending of Comply were higher than those of control board. Also the modulus of elasticity of Comply showed much higher than that of control board. The nail resistance of Comply, composed of plywood as face and back was higher than that of veneer. The nail resistance of control board was higher than that of Comply at Sp.Gr 0.7 and 0.8 core boards. Internal bond of Comply, composed of 1mm and 2mm thick veneer as face and back was higher than that of 3mm thick veneer. The increasing effect of modulus of elasticity was shown by the increase of shelling ratio in Comply composed of veneer and plywood as face and back. The modulus of rupture was increased by the increment of shellmg ratio in Compiy, composed of plywood as face and back. The modulus of elasticity and modulus of. rupture of comply were higher than those of particleboard(control) in effect of shelling ratio. Therefore it was concluded that the mechanical property values of Comply were clearly greater than those of particleboard(control).

• 한국산림과학회지
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• 제22권1호
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• pp.1-6
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• 1974

본(本) 연구(硏究)는 합판(合板)의 부후(부후)하는 성질(性質)를 개선(改善)하기 위하여 방부처리(防腐處理)를 실시(實施)하였을 때 그 접착강도(接着强度)와 방부력(防腐力)에 미치는 영향을 알아내기 위하여 실시(實施)하였다. 그 실험결과(實驗結果)를 종합(綜合)하면 다음과 같다. 1. 합판(合板)을 제작(製作)하여 그 합판(合板)을 직접(直接) 방부처리(防腐處理)하였을 때나 또는 단판(單板)을 미리 방부처리(防腐處理)하여 합판(合板)을 제작(製作)하였을 때나 모두 합판(合板)의 접착강도(接着强度)는 감소(減少)하지 않았다. 2. 합판(合板)을 마레니트(Malenit)로 처리(處理)하였을 때의 내부효력(耐腐効力)은 명확(明確)히 나타났으며 방부처리(防腐處理)를 하지 않은 합판(合板)이나 소나무 변재부(邊材部)와 비교(比較)하였을때 내부효력(耐腐効力)이 큰것으로 나타났다. 3. 방부효력(防腐効力) 실험결과(實驗結果) 동일(同一) 공시재(供試材)라 하여도 접종(接種)한 균종(菌腫)에 따라 중량감소(重量減少)에 차이(差異)가 있었으며 반대(反對)로 동일균(同一菌)을 접종(接種)하였을 때라도 공시재(供試材)의 종류(種類)에 따라 균(菌)의 호혐(好嫌)에 차이(差異)가 나타났다.

• 한국가구학회지
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• 제10권2호
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• pp.1-8
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• 1999

The use of structural wood based panels like plywood, OSB in many applications involves the use of nails, and data on the performance of panel-nail connection are needed for design and comparative purpose. This study was carried out to develop basic information on nail performance(withdrawal, embedding, nailhead push through) with water absorption in plywood and OSB. In withdrawal resistance test, initial stiffness of plywood performed better than OSB in 24hr soaked condition. The soaked condition reduced average nail withdrawal resistance value about 46% (12d mail), 53%(8d nail) in OSB, 17%(12d mail), 24%(8d mail) in plywood. The nail embedding strength of plywood also performed better than that of OSB and retention value(wet strength/dry strength) yielded similar in each nail types. The nail head push through capacity of OSB was higher than that of plywood in dry condition, but equal or lower in soaked condition. Therefore, critical consideration about structural panels is required in moist applications. The average values of nail withdrawal, nail embedding strength and nail head push through resistance of tested materials meet the minimum requirement of various specification and standards.