• Korean Journal of Metals and Materials
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• v.46 no.6
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• pp.351-356
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• 2008

Thermally sprayed tungsten carbide-based powder coatings are being widely used for a variety of wear resistance applications. The coating deposited by high velocity processes such as high velocity oxy-fuel (HVOF) thermal spraying is known to provide improved wear resistant property. In this study, optimal coating process (OCP) is obtained by the study of coating properties such as surface hardness, porosity, surface roughness and microstructure of 9 coatings prepared by Taguchi program for 3 levels of four spray parameters. The Friction and wear behaviors of HVOF WC-CoCr coating prepared by OCP, electrolytic hard chrome (EHC) plating and Inconel718 (In718) are investigated by reciprocating sliding wear test at $25^{\circ}C$, $450^{\circ}C$. Friction coefficients (FC) of all of the 3 samples are decreased as increasing sliding surface temperature from $25^{\circ}C$ to $450^{\circ}C$. FC of WC-CoCr decreases as increasing the surface temperature from $0.33{\pm}0.02$ at $25^{\circ}C$ to $0.26{\pm}0.02$ at $450^{\circ}C$, showing the lowest FC among the 3 samples. Wear trace (WT) and wear depth (WD) of WC-CoCr are smaller than those of EHC and In718 both at $25^{\circ}C$ and $450^{\circ}C$. These show that WC-CoCr is highly recommendable for protective coating on In718 and other metal components.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.450-455
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• 2002

Cu-cored Sn-Ag solder balls were fabricated by coating pure Sn and Ag on Cu balls. The melting behavior and the solderability of the BGA joint with the Ni/Au coated Cu pad were investigated and were compared with those of the commercial Sn-Ag and Sn-Ag-Cu balls. DSC analyses clarified the melting of Cu-cored solders to start at a rather low temperature, the eutectic temperature of Sn-Ag-Cu. It was ascribed to the diffusion of Cu and Ag into Sn plating during the heating process. After reflow soldering the microstructures of the solder and of the interfacial layer between the solder and the Cu pad were analyzed with SEM and EPMA. By EDX analysis, formation of a eutectic microstructure composing of $\beta$-Sn, Ag$_3$Sn, ad Cu$_{6}$Sn$_{5}$ phases was confirmed in the solder, and the η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer was found to form at the interface between the solder and the Cu pad. By conducting shear tests, it was found that the BGA joint using Cu-cored solder ball could prevent the degradation of joint strength during aging at 423K because of the slower growth me of η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer formed at the solder, pad interface. Furthermore, Cu-cored multi-component Sn-Ag-Bi balls were fabricated by sequentially coating the binary Sn-Ag and Sn-Bi solders on Cu balls. The reflow property of these solder balls was investigated. Melting of these solder balls was clarified to start at the almost same temperature as that of Sn-2Ag-0.75Cu-3Bi solder. A microstructure composing of (Sn), Ag$_3$Sn, Bi and Cu$_{6}$Sn$_{5}$ phases was found to form in the solder ball, and a reaction layer containing primarily η'-(Au, Co, Cu, Ni)$_{6}$Sn$_{5}$ was found at the interface with Ni/Au coated Cu pad after reflow soldering. By conducting shear test, it was found that the BGA joints using this Cu-core solder balls hardly degraded their joint shear strength during aging at 423K due to the slower growth rate of the η'-(Au, Cu, Ni)$_{6}$Sn$_{5}$ reaction layer at the solder/pad interface.he solder/pad interface.