• Journal of Plant Biotechnology
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• 제49권4호
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• pp.331-338
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• 2022

Sunflower (Helianthus annuus L.) protoplasts were isolated from seven-day-old etiolated hypocotyls of 10 A line and four-week-old fully expanded young leaves of PI 441983 line in vitro seedlings using an enzymatic method. Purified protoplasts were collected by filtration and floatation in sucrose solution. Semi-solid protoplast culture was performed using the L4 regeneration protocol with various culture media and plating densities to achieve the highest efficiencies for protoplast culture of hypocotyl and mesophyll protoplasts of 10 A and PI 441983 lines, respectively. The concentrations in liquid L'4M medium and different plating densities were evaluated in two types of cytokinins, the adenine-type 6-benzyladenine (BA) and the phenylurea-type thidiazuron (TDZ). The highest colony formation was achieved in both sunflower lines when 0.5 mgL^-1 BA and 0.5 mgL^-1 TDZ were applied with a high plating density (3 × 10⁵ protoplasts mL^-1). These conditions led to 38.45% and 39.40% colony formation for hypocotyl protoplasts of the 10 A line and mesophyll protoplasts of the PI 441983 line, respectively. Moreover, many hypocotyl protoplast-derived colonies developed into micro-calli. In addition, superior development of both sunflower protoplasts was observed with all plating densities when BA was used in combination with TDZ. This finding will be applicable to future sunflower hybrid production via somatic hybridization.

• Membrane and Water Treatment
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• 제11권3호
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• pp.201-206
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• 2020

Electrodialysis (ED) is used in wastewater treatment, during the processing and recovery of beneficial materials, to produce usable water. In this study, sulfate and chlorine ions, which are the anions majorly used for electroplating, were studied as factors affecting the recovery of copper, nickel and water from wastewater by electrodialysis. Although the removal rates of copper and nickel ions were slightly higher with the use of chlorine ions than of sulfate ions, the removal efficiencies were above 99.9% under all experimental conditions. The metal ions of the plating wastewater flowed through the ion exchange membrane of the diluate tank and the concentrate tank while all the water moved together due to electro-osmosis. The migration of water from the diluate tank to the concentrate tank was higher in the presence of a monovalent chloride ion compared to that of a divalent sulfate ion. When sulfate was the anion used, the recoveries of copper and nickel increased by about 25% and 30%, respectively, as compared to the chloride ion. Therefore, when divalent ions such as sulfate are present in the electrodialysis, it is possible to reduce the movement amount of water and highly concentrate the copper and nickel in the plating wastewater.

• 한국환경과학회지
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• 제30권1호
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• pp.69-76
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• 2021

The purposes of this study were to evaluate the removal characteristics of COD, Ni, and P and to derive appropriate operating conditions for the plating wastewater according to NaOCl reaction time and pH operating conditions in the BPC unit process during the plating wastewater treatment process. As a results of evaluating the removal characteristics for raw wastewater by each BPC unit process, the removal efficiencies of COD, Ni and P in BPC 1-1 unit process were 72.8%, 99.1%, and 100.0%. Therefore, the proper reaction time of NaOCl was derived as 21.1 minutes. In order to maintain the +800 mV ORP and the reaction time of 20 minutes, the temporary injection and continuous injection of NaOCl in the BPC unit process were 13.7 mL and 18.7 mL, respectively. It was found that the temporary injection method of NaOCl reduced the chemical cost by 36.5% compared to the continuous injection method. Also, Ni showed the highest removal efficiency of 97.8% at pH 10.5. On the other hand, P showed a removal efficiency of 57.4% at pH 10.0.

• 환경위생공학
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• 제13권2호
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• pp.121-127
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• 1998

This study was to understand leaching characteristics with pH controlling agents and Temp. control, and investigate leaching characteristics with pH control from opening a leaching test to an end for reassessing leaching test of heavy metals with environmental conditions in landfill. Because leaching of heavy metals was increased in low pH, pH must control for leaching in existing leaching test. Generally, regulation time(6hr) of leaching was confirmed reasonablely, except for Cu in plating sludge. In pH controlling solution, there was nearly not difference between Acetic acid and HCl and if considering Cu, the former was appropriate. In a part of heavy metal, leaching rate was increased in high Temp., and normal Temp. in existing leaching test would be revaluated.

• 한국표면공학회지
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• 제36권1호
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• pp.34-41
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• 2003

Effects of additives and plating conditions of high speed electroplating were investigated. The Sn content in electrodeposit was highly decreased with increasing current density from $10A/dm^2$ to $50A/dm^2$, and the current efficiency on the cathode was decreased. The carbon content in the electrodeposit was decreased with increasing current density from $10A/dm^2$ to $30A/dm^2$, however the carbon content was highly increased in the range of $40A/dm^2$$∼50A/dm^2$. The formation of tetravalent tin and stannic oxide sludge was prevented by the addition of gallic acid in the bath. The changing of Sn content in the electrodeposit is caused by the addition of gallic acid.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2000년도 춘계학술발표회 초록집
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• pp.36-36
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• 2000

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 1998년도 춘계학술발표회 초록집
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• pp.96-96
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• 1998

• 대한환경공학회지
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• 제37권4호
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• pp.204-209
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• 2015

2014년을 기준으로 도금폐수에 함유한 중금속중 니켈은 5 mg/L에서 3 mg/L로 방류수 기준이 강화되었다. 그러나 현재 적용되고 있는 도금폐수 중의 니켈 처리방법으로는 방류수 기준치 이하로 처리하기 어려워 대부분의 처리 업체에서 다른 폐수와 혼합하여 단순한 희석에 의해 농도를 낮추고 있는 실정이다. 이는 환경에 지대한 영향을 미칠 수 있으며 이에 따라 본 연구에서는 희생전극을 사용한 전기분해 방법을 적용하여 실질적이며 효율적인 니켈의 처리방법을 제시하였다. 실험은 인공폐수 및 실폐수로 수행하였으며 인공폐수 실험에서는 전기분해과정에서 니켈 제거 효율에 영향을 줄 수 있는 전류밀도와 pH를 변화시키며 최적의 효율을 나타내는 조건을 도출하였다. 실험결과 니켈 제거 효율은 94%를 상회하며 잔류니켈농도는 방류수 기준치 이하로 낮추고 철 슬러지 처리로 인한 경제성까지 고려한 조건으로 전류밀도 $1{\sim}2mA/cm^2$와 pH 9가 도출되었다. 이 처리 조건을 실폐수에 적용시켰을 때 니켈 제거 효율은 60~70%로 인공폐수 실험결과보다 제거효율이 낮게 조사되었다. 이는 실폐수에는 다른 중금속 및 음이온이 다량 함유되어 있어 처리 효율에 영향을 미친 것으로 판단된다. 실폐수의 경우 pH 9에서 전류밀도 $6{\sim}7mA/cm^2$ 조건으로 5분 동안 전기분해 처리를 하였을 때 니켈 제거효율 88% 이상, 처리수의 잔류 니켈 농도 3.0 mg/L 이하로 방류수 기준을 만족시킬 수 있었다.

• 대한금속재료학회지
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• 제49권5호
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• pp.411-418
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• 2011

The current study investigates the electroplating characteristics of Sn-Cu eutectic micro-bumps electroplated on a Si chip for flip chip application. Under bump metallization (UBM) layers consisting of Cr, Cu, Ni and Au sequentially from bottom to top with the aim of achieving Sn-Cu bumps $10\times10\times6$ ${\mu}m$ in size, with 20${\mu}m$ pitch. In order to determine optimal plating parameters, the polarization curve, current density and plating time were analyzed. Experimental results showed the equilibrium potential from the Sn-Cu polarization curve is -0.465 V, which is attained when Sn-Cu electro-deposition occurred. The thickness of the electroplated bumps increased with rising current density and plating time up to 20 mA/$cm^2$ and 30 min respectively. The near eutectic composition of the Sn-0.72wt%Cu bump was obtained by plating at 10 mA/$cm^2$ for 20 min, and the bump size at these conditions was $10\times10\times6$ ${\mu}m$. The shear strength of the eutectic Sn-Cu bump was 9.0 gf when the shearing tip height was 50% of the bump height.

• 마이크로전자및패키징학회지
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• 제11권3호
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• pp.1-7
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• 2004

주석 도금은 특정 환경하에서 위스커를 발생시키며, 이는 전자부품의 불량을 초래한다. 최근 세계곳곳에서는 환경보호를 위해 "무연"의 사용을 권고하고 있다. 본 논문에서는 두 종류 무연 도금 재료에서 도금 온도와 신뢰성시험 하에서 성장하는 위스커를 평가하였다. 도금 온도가 높아질수록 표면에 형성되는 도금 입자의 크기는 커지고, 위스커의 성장은 작아진다. 또한 온도 순환시험에서 성장한 위스커는 무광택 Sn 도금은 굽은 모양을, 무광택 Sn-Bi에서는 줄무의 모양이 관찰되었고, Sn 도금에 비해 Sn-Bi에서 위스커가 작게 성장하였다. 무광택 Sn 도금된 FeNi42 리드프레임은 TC 300 사이클에서 직경이 $7.0{\~}10.0{\mu}m$이고, 길이가 $25.0{\~}45.0{\mu}m$인 위스커가 성장하였다. 또한 Cu는 300 사이클에서는 표면에 노듈(핵 상태)만이 관찰되었고, 600 사이클에서 길이가 $3.0{\~}4.0{\mu}m$의 위스커로 성장하였다. TC 600 사이클 후 FeNi42는 계면에서 ${\~}0.34{\mu}m$의 얇은 $Ni_3Sn_4$가, Cu에서는 두께가 $0.76{\~}l.14{\mu}m$인 $Cu_6Sn_5$와 ${\~}0.27{\mu}m$의 $Cu_3Sn$ 화합물들이 두껍게 성장하였다. 따라서 FeNi42 리드프레임은 열팽창계수의 차이, Cu에서는 금속간 화합물의 형성이 위스커의 성장에 영향을 미치는 주요 인자이다.