• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2006년도 춘계학술대회 논문집
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• pp.308-313
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• 2006

The effect of coating time on surface properties of the TiN-coated high speed steel(SKH51) by arc ion plating is and presented in this paper. Surface roughness, micro-hardness, coated thickness, atomic distribution of TiN and adhesion strength are measured for various coating times. It has been shown that the coating time has a deep influence more than 60 minites on the micro-hardness, coated thickness, atomic distribution of Ti and adhesion strength of the SKH51 steels, but that the coating time has little influence on the surface roughness.

• 한국기계가공학회지
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• 제10권5호
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• pp.44-50
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• 2011

The effect of deposition time in arc ion plating on surface properties of the TiN-coated SM45C steel is presented in this paper. The surface roughness, micro-particle, micro-hardness, coated thickness, atomic distribution of TiN, and adhesion strength are measured for various deposition times. It has been shown that the deposition time has a considerable effect on the micro-hardness, the coated thickness, and the atomic distribution of TiN of the SM45C steels but that it has little influence on the surface roughness and adhesion strength.

• 한국정밀공학회지
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• 제25권7호
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• pp.124-130
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• 2008

The effect of nitrogen gas pressure in arc ion plating on surface properties of the TiN-coated high speed steel(SKH51) is presented in this paper. The surface roughness, micro-particle, micro-hardness, coated thickness, atomic distribution of TiN, and adhesion strength are measured fur various nitrogen gas pressures. It has been shown that the nitrogen gas pressure has a considerable effect on the surface roughness, adhesion strength, atomic distribution of TiN, and surface deposition of TiN of the high speed steels but that it has little influence on the micro-hardness and coated thickness.

• 한국표면공학회지
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• 제32권4호
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• pp.487-495
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• 1999

In order to form metallic electrodes on PZT (Pb (Zr, Ti)O$_3$) ceramics, plating conditions for optimal electroless Ni deposition were investigated. Pb in PZT is the major component to inhibit the electroless deposition, because it plays a active role of catalytic poison in plating solution. Adhesion of the electroless Ni deposits is measured by push-pull scale test and peel test. Results such as deposition ability, deposition rate, and thickness of deposits showed in terms of concentration of etchant, composition of catalyzing solution, and composition and pH of electroless bath solution.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2003년도 춘계학술발표회 초록집
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• pp.80-81
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• 2003

• 한국표면공학회지
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• 제40권1호
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• pp.32-38
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• 2007

Ni coating layers were formed using a newly developed electroless Ni plating solution. The properties of Ni coating layer such as internal stress, hardness, surface roughness, crystallinity, solderability and surface morphology were investigated using various tools. Results revealed that internal stress decreased with plating time and reached $40N/mm^2$ at 20 minutes of the plating time. Hardness increased with increasing P content and thickness. Surface roughness of the pad decreased with Ni and Ni/Au plating. Crystallinity decreased with increasing P content. Solderability based on wettability decreased with Ni and Ni/Au plating. Based on surface morphology, it is expected that Ni coating layer formed using a newly developed electroless Ni plating solution is lower than that formed using a commercial electroless Ni plating solution in possibility of black pad occurrence.

• 한국염색가공학회지
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• 제22권1호
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• pp.77-82
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• 2010

Highly conductive yarn was successfully obtained using electroless nickel plating method with palladium activation. In the presence of palladium seed on surface of fibers as a catalyst, continuos nickel layer produced on surface of fibers by reducing $Ni${2+}$ ion in the electroless plating bath to $Ni^0$. It was found that the Pd-activation using $SnCl_2$ and $PdCl_2$ to deposit palladium seeds on the surface of fibers plays a key role in the subsequent electroless plating of nickel. It also found that electroless nickel plating on the fibers can induce the nickel-plated $ELEX^{(R)}$ fibers to improve the electrical conductivity of the fibers. The thickness of nickel coating layer on the Pd-activated $ELEX^{(R)}$ fibers and specific conductivity of the fiber were increased through electroless plating time. The temperature of nickel plating bath was very effective to enhance the nickel deposition rate.

• 한국분말재료학회지
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• 제25권5호
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• pp.375-378
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• 2018

Conductive and dielectric SiC are fabricated using electroless plating of Ni-Fe films on SiC chopped fibers to obtain lightweight and high-strength microwave absorbers. The electroless plating of Ni-Fe films is achieved using a two-step process of surface sensitizing and metal plating. The complex permeability and permittivity are measured for the composite specimens with the metalized SiC chopped fibers dispersed in a silicone rubber matrix. The original non-coated SiC fibers exhibit considerable dielectric losses. The complex permeability spectrum does not change significantly with the Ni-Fe coating. Moreover, dielectric constant is sensitively increased with Ni-Fe coating, owing to the increase of the space charge polarization. The improvements in absorption capability (lower reflection loss and small matching thickness) are evident with Ni-Fe coating on SiC fibers. For the composite SiC fibers coated with Ni-Fe thin films, a -35 dB reflection loss is predicted at 7.6 GHz with a matching thickness of 4 mm.

• 대한조선학회지
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• 제17권1호
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• pp.1-10
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• 1980

The nonlinear analysis of ship plating with flat bar stiffners has been carried out by the finite element method based on the load incremental approach. The large deflection analysis has been done by using the Lagrangian description. The elastoplastic analysis has been performed by adopting the flow theory of plasticity and the von Mises yield condition. The layered elements are used to show the process of yielding through the plate thickness in the elasto-plastic analysis. The following results are obtained; 1) According to the large deflection analysis, it is shown that the small deflection theory to the plate is applicable in the range of the lateral deflection-the thickness ratio $w/h{\leqq}0.3$ and ship plating in the range of $w/h{\leqq}0.5$. 2) By means of the elasto-plastic analysis, it is found that the maximum load-carrying capacity of the plate increases as much as 1.8 times of the initial yield load in the case of the simply supported condition and 2.2 times in the clamped condition. It is also shown that the maximum load-carrying capacity of ship plating increase as much as 4.3 times in the simply supported condition and 4.2 times in the clamped condition. This method would be applied and extended to solve combined nonlinear problems which involve both material nonlinearity and geometric nonlinearity.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.125-126
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• 2005

Recently semiconductor devices are required more smaller scale and more powerful performance. For smaller scale of device, multilayer structure is proposed. And, for the higher performance, interconnection material is change to copper, because copper has high EM(Electro-migration)and low resistivity. Then copper CMP process is a great role in a multilayer formation of semiconductor. Copper process is different from aluminum process. ECP process is one of the copper processes. In this paper, we focused on the defects tendency by copper thickness which filled using ECP process. we observed hump high and dishing. Conclusively, hump hight reduced at copper thickness increased Also dishing reduced.