• 제목/요약/키워드: Plated wire

검색결과 23건 처리시간 0.019초

Solenoid 형태의 소형.고성능 RF Chip 인덕터에 대한 연구 (A Study of Micro, High-Performance Solenoid-Type RF Chip Inductor)

  • 김재욱;윤의중;정영창;홍철호;서원창
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제49권5호
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    • pp.283-288
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    • 2000
  • In this work, small-size, high-performance simple solenoid-type RF chip inductors utilizing an Al2O3 core material were investigated. Copper (Cu) wire with $40\mum$ diameter was used as the coils and the size of the chip inductor fabricated in this work was $2.1mm\times1.5mm\times1.0mm$. The external current source was applied after bonding Cu coil leads to gold pads electro-plated on each end of backsides of a core material. High frequency characteristics of the inductance (L), quality factor (Q), and impedance (Z) of developed inductors were measured using an RF Impedance/Material Analyzer (HP4291B with HP16193A test fixture). This HP4291B was also used to obtain the equivalent circuit and its circuit parameters of the chip inductors. This HP4291B was also used to obtain the equivalent circuit and its circuit parameters of the chip inductors. The developed inductors have the self-resonant frequency (SRF) of 1.1 to 3.1 GHz and exhibit L of 22 to 150 nH. The L of the inductors decreases with increasing the SRF. The Z of the inductors has the maximum value at the SRF and the inductors have the quality factor of 70 to 97 in the frequency range of 500 MHz to 1.5 GHz.

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Stamped Leadframe의 표면 품질에 미치는 전해연마 효과 (Effect of Electropolishing on Surface Quality of Stamped Leadframe)

  • 남형곤;박진구
    • 마이크로전자및패키징학회지
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    • 제7권3호
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    • pp.45-54
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    • 2000
  • Stamped Leadframe에 전해연마를 적용하여 가공면에 존재하는 버어(burr)의 제거와 그에따른 잔류응력 완화효과를 보았다. 또한 표면 청정화에 따른 은(Ag)도금면 및 리드프레임 표면 품질의 향상이 있었다. 인산 60% 전해연마액에 고정 전류값 5A와 극간거리 3.0 cm의 조건하에 Alloy42 원소재 리드프레임은 $70^{\circ}C$에서 120초간, C194 원소재 리드프레임은 $50^{\circ}C$에서 90초간 전해연마 하였다. XRD 반가폭(FWHM)을 이용한 잔류응력 측정결과 전해 연마 처리후의 잔류응력값이 스탬핑 이전상태로 회복되었으며, AFM를 이용하여 표면 거칠기 측정결과 Alloy42원소재 리드프레임은 0.079 $\mu\textrm{m}$, C-194원소재 리드프레임은 0.014 $\mu\textrm{m}$의 R$_{근}$값으로 거칠기의 향상이 있었다. XRF를 이용한 도금두께 측정 결과 0.4~0.5 $\mu\textrm{m}$ 정도 두께편차 균일성의 향상이 있었으며, wire bonding온도에서의 bake test결과 금선(gold wire) 과의 접합강도를 높일수 있는 적절한 크기로의 결정립 성장이 관찰되었다 3차원 자동측정 및 표면 경도 측정 통하여 전해연마로 인한 리드프레임 중요부위 치수변화의 신뢰성을 확인할수 있었다.다.

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ZrN 및 TiN 코팅된 치과교정 용 미니나사의 표면특성과 전기화학적 거동 (Surface Characteristics and Electrochemical Behaviors of TiN and ZrN Coated Orthodontic Mini-screw)

  • 김신영;문영필;박근형;조호형;김원기;손미경;최한철
    • 한국표면공학회지
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    • 제41권5호
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    • pp.232-239
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    • 2008
  • The dental orthodontic mini-screw requires good mechanical properties and high corrosion resistance for implantation in the bone. The purpose of this study was to investigate the electrochemical characteristics of TiN and ZrN coated orthodontic mini-screws, mini-screws were used for experiment. Ion plating was carried out for mini-screw using Ti and Zr coating materials with nitrogen gas. Ion plated surface of each specimen w as o bserved with f ield emission scanning e lectron microscopy ( FE-SEM), e nergy dispersive x-ray spectroscopy (EDX), and electrochemical tester. The surface of TiN and ZrN coated mini-screw were more smooth than that of other kinds of non-coated mini-screw due to dercrease of machined defects. The corrosion current density of the TiN and ZrN coated mini-screw decreased compared to non-coated sample. The corrosion potential of TiN and ZrN coated mini-screw were higher than that of non-coated mini-screw in 0.9% NaCl solution. The pitting corrosion resistance increased in the order of ZrN coated, TiN coated and non-coated wire. Pitting potential of ZrN coated mini-screw was the highest in the other specimens.