• Title/Summary/Keyword: Plate Fabrication

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Demonstration of Alternative Fabrication Techniques for Robust MEMS Device

  • Chang, Sung-Pil;Park, Je-Young;Cha, Doo-Yeol;Lee, Heung-Shik
    • Transactions on Electrical and Electronic Materials
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    • v.7 no.4
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    • pp.184-188
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    • 2006
  • This work describes efforts in the fabrication and testing of robust microelectromechanical systems (MEMS). Robustness is typically achieved by investigating non-silicon substrates and materials for MEMS fabrication. Some of the traditional MEMS fabrication techniques are applicable to robust MEMS, while other techniques are drawn from other technology areas, such as electronic packaging. The fabrication technologies appropriate for robust MEMS are illustrated through laminated polymer membrane based pressure sensor arrays. Each array uses a stainless steel substrate, a laminated polymer film as a suspended movable plate, and a fixed, surface micromachined back electrode of electroplated nickel. Over an applied pressure range from 0 to 34 kPa, the net capacitance change was approximately 0.14 pF. An important attribute of this design is that only the steel substrate and the pressure sensor inlet is exposed to the flow; i.e., the sensor is self-packaged.

A Study on the Secondary Buckling Behavior of Ship Plate (선체판부재의 2차좌굴거동에 관한 연구)

  • 고재용
    • Journal of the Korean Institute of Navigation
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    • v.20 no.1
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    • pp.47-58
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    • 1996
  • The use of high tensile steel plates is increasing in the fabrication of ship and offshore structures. The main portion of ship structure is usually composed of stiffened plates. In these structures, plate buckling is one of the most important design criteria and buckling load may usually be obtained as an eigenvalue solution of the governing equations for the plate. To use the high tensile steel plate effectively, its thickness may become thin so that the occurrence of buckling is inevitable and design allowing plate buckling may be necessary. When the panel elastic buckling is allowed, it is necessary to get precise understandings about the post-buckling behaviour of thin plates. It is well known that a thin flat plate undergoes secondary buckling after initial buckling took place and the deflection of the initial buckling mode was developed. From this point of view, this paper discusses the post-buckling behaviour of thin plates under thrust including the secondary buckling phenomenon. Series of elastic large deflection analyses were performed on rectangular plates with aspect ratio 3.6 using the analytical method and the FEM.

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Development of Fabrication Process of Light Guiding Plate with Nanometer-Sized-Cylindrical Pattern Using Nano Imprint Lithography Method (나노 임프린트 리소그래피법에 의한 나노미터급 원기둥 패턴을 갖는 도광판의 제작 공정 개발)

  • Lee, Byoung-Wook;Hong, Chin-Soo;Kim, Chang-Kyo
    • Journal of Institute of Control, Robotics and Systems
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    • v.14 no.4
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    • pp.332-335
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    • 2008
  • PMMA light guiding plate with nano pattern was fabricated by nano imprint lithography method. A silicon mold for electroplating of nickel was fabricated by conventional photolithography process. A nickel stamp for nano imprint lithography was fabricated by electroplating process using silicon mold. The nano imprint lithography was performed on PMMA plate at $140^{\circ}C$ under pressure of 20kN. The nano pattern on PMMA plate was investigated using FE-SEM. It is shown that the patterns were well transferred for several steps and the nano imprint lithography method could be applied for fabricating patterns of light guiding plate.

Operation of PCR chip by micropump (마이크로펌프를 이용한 PCR Chip의 구동)

  • 최종필;반준호;장인배;김헌영;김병희
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2004.10a
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    • pp.463-467
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    • 2004
  • This paper presents the fabrication possibility of the micro actuator which uses a micro-thermal bubble, generated b micro-heater under pulse heating. The valve-less micropump using the diffuser/nozzle is consists of the lower plate, he middle plate, the upper plate. The lower plate includes the channel and chamber are fabricated on high processability silicon wafer by the DRIE(Deep Reactive Ion Etching) process. The middle plate includes the chamber and diaphragm d the upper plate is the micro-heater. The Micropump is fabricated by bonding process of the three layer. This paper resented the possibility of the PCR chip operation by the fabricated micropump.

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Fabrication Process of Rheology Material Thin Plate Using Vacuum Low Pressure Die-casting Process with Electromagnetic Stirring (레오로지 박판의 전자교반을 응용한 진공 저압주조 제조공정)

  • Jang, Sin-Kyu;Bae, Jung-Woon;Jin, Chul-Kyu;Kang, Chung-Gil
    • Journal of Korea Foundry Society
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    • v.32 no.1
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    • pp.16-23
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    • 2012
  • In this study, we develop the lower pressure die casting with rheo-forming process of A356 aluminum alloy and vacuum system which can control the crystal size and obtain the high strengthened-light material. Using this process, we fabricate the thin plate for bipolar plate through the low pressure die casting with electromagnetic stirring and vacuum-evacuation which can control the crystal grain by electromagnetic stirring. Thin plate ($110mm{\times}130mm{\times}1mm$) is fabricated by this process. The average Vickers hardness of thin plate is about 77 HV.

Fabrication Assessment Method for Dimensional Quality Management of Curved Plates in Shipbuilding and Offshore Structures (선박 및 해양 구조물 곡부재 치수 품질 관리를 위한 가공완성도 평가)

  • Kwon, Ki-Youn;Lee, Jaeyong
    • Journal of Ocean Engineering and Technology
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    • v.32 no.2
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    • pp.106-115
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    • 2018
  • The forward and afterward parts of ships and offshore structures are designed to improve the fuel consumption performance. These are made of curved plates with a large thickness. If a fabricated curved plate has some dimensional errors, a lot of additional cost is incurred in the assembly process. Thus, an accurate dimensional assessment is very important for fabrication. In this paper, we propose an assessment method for the dimensional quality management of curved plates. This can be applied to data measured using a variety of three-dimensional instruments, with boundary measurement points automatically classified and sorted to create a measurement surface. The assessment is evaluated after matching the CAD surface and the measured surface considering constrained conditions. The fabrication assessment is evaluated as a probability of how much the tolerance is satisfied.

Micro-lens Patterned LGP Injection Mold Fabrication by LIGA-reflow Process (LIGA-reflow 응용 Micro-lens Pattern 도광판 금형 제작)

  • Hwang C.J.;Kim J.D.;Chung J.W.;Ha S.Y.;Lee K.H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2004.05a
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    • pp.241-244
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    • 2004
  • Microlens patterned micro-mold fabrication method for Light Guiding Plate(LGP), kernel part of LCD-BLU(Back Light Unit), was presented. Instead of erosion dot pattern for LCP optical design, microlens pattern, fabricated by LIGA-reflow process, was applied. Optical pattern design method was also developed not only for negative pattern LGP, but also positive pattern LGP. In order to achieve flow balance during the micro-injection molding process and dimensional accuracy, two LGP pattern was made in one micro-mold.

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Fabrication of 2-D Microwell Arrays for Micro ELISA System (초소형 면역 분석기용 이차원적 배열형 마이크로 우물 제작)

  • Lee, Kook-Nyung;Ahn, Si-Hong;Park, Jae-Hyung;Kim, Yong-Kweon
    • Proceedings of the KIEE Conference
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    • 1998.07g
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    • pp.2556-2558
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    • 1998
  • 2-D microwell arrays for micro ELISA (Enzyme-Linked Immuno Solvent Assay) system were fabricated using micromachining technology. The materials for the bottom plate, top plate and sidewall of the microwell were used a #7740 glass, gold and silicon respectively considering bio-compatibility and easy fabrication. Cylindrical or groove shape microwells, which have about $100{\mu}m$ depth and $50{\sim}500{\mu}m$ diameter or width, were arrayed. The fabricated microwell array can be applied to the essential part of a biochip when surface modification is made to immobilize cells or biomolecules on the microwell bottom.

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Fabrication of a Micro actuator with p+ Si cantilevers for Optical Devices (p+ Si 외팔보 구조를 이용한 광학 소자용 마이크로 구동기)

  • Park, Tae-Gyu;Yang, Sang-Sik
    • Proceedings of the KIEE Conference
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    • 2000.07c
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    • pp.2236-2238
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    • 2000
  • The paper represents the fabrication of an electrostatic micro actuator for optical devices. The micro actuator consists of a plate suspended four p+ silicon cantilevers and an electrode on a glass substrate. The cantilever curls down because of the residual stress gradient in p+ silicon. When input voltage is applied between the p+ cantilevers and the electrode. the cantilevers are pulled toward the electrode by the electrostatic force. The displacement of the plate is measured with a laser displacement meter for various input voltage and frequencies.

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Fabrication of a Au/Ni/Ti/3C-SiC Schottky Diode and its Characteristics for High-voltages (고내압용 Au/Ni/Ti/3C-SiC 쇼트키 다이오드의 제작과 그 특성)

  • Shim, Jae-Cheol;Chung, Gwiy-Sang
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.4
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    • pp.261-265
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    • 2011
  • This paper describes the fabrication and characteristics of a Au/Ni/Ti/3C-SiC Schottky diode with field plate (FP) edge termination. The Schottky contacts were annealed for 30 min at temperatures ranging from 0 to $800^{\circ}C$. At annealing temperature of $600^{\circ}C$, it showed an inhomogeneous Schottky barrier and had the best electrical characteristics. However, the annealing of $800^{\circ}C$ replaced it with ohmic behaviors because of the formation of many different types of nickel silicides. The fabricated Schottky diode had a breakdown voltage of 200 V, Schottky barrier height of 1.19 eV and worked normally even at $200^{\circ}C$.