• Title/Summary/Keyword: Plasticity Flow Bonding

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A Bonding Surface Behavior of Bi-metal Bar through Hydrostatic Extrusion (이중복합봉 정수압 압출시 접합면 거동에 관한 연구)

  • 박훈재;나경환;조남선;이용신
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 1997.03a
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    • pp.140-143
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    • 1997
  • The present study is concerned with the hydrostatic extrusion process of copper-clad aluminium bar to investigate the basic flow characteristics. Considering the bonding mechanism of bi-metal contact surface as cold pressure welding, the normal pressure and the contact surface expansion are selected as process parameters governing the bonding condition. The critical pressure required for the bonding at the interface is obtained by solving a "local extrusion" using a slip line meyhod. A viscoplastic finite element method is used to analyze the steady state extrusion process. The boundary profile of bi-metal rod is predicted by tracking a particle path adjacent to interface surface. The variations of contact surface area and the normal pressure along the interface profile are predicted and compared to those by experiments.

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A Study of the Weld Strength of Extru-Rivet Spot Welding Using Electrodes Heated by Electric Resistance (전기저항가열 압출점접합공정에 있어서 접합강도에 관한 연구)

  • Lee, S.J.;Jin, I.T.
    • Transactions of Materials Processing
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    • v.22 no.4
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    • pp.189-195
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    • 2013
  • In this study, the weld strength of extru-rivet spot welding was investigated by simulation and experiment. In order to obtain hot plasticity flow bonding of the two plates by a single rivet, electrodes are used for heating of the two plates and the rivet by electric resistance. Because weld strength is influenced by the temperature in the weld zone, the diameter of the electrodes and the amount of current supplied to the electrodes are important variables. For the simulation, heat distribution and weld strength were calculated using DEFORM-3D. The weld strength in the weld zone was calculated for various values of the experimental parameters. The simulation results showed that the weld strength was the highest when the weld current was 37kA, the electrode diameter was 12mm, and the welding frequency was 90cycle. Aluminum 5052 was used for the experimental study. A total of three aluminum plates, two welding plates with 1mm thickness and one plate with 2mm thickness for the inserting rivet, were used for the experimental extru-rivet spot welding.

A Bonding Surface Behavior of Bi-metal Bar through Hydrostatic Extrusion (이중복합봉 정수압 압출시 접합면 거동에 관한 연구)

  • Park, Hun-Jae;Na, Gyeong-Hwan;Jo, Nam-Seon;Lee, Yong-Sin
    • Transactions of Materials Processing
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    • v.7 no.1
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    • pp.66-71
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    • 1998
  • The present study is concerned with the hydrostatic extrusion process of copper-clad aluminium bar to investigate the bonding conditions as well as the basic flow characteristics. Considering the bonding mechanism of bi-metal contact surface as cold pressure welding the normal pressure and the contact surface expansion are selected as process parameters governing the bonding conditions, in this study the critical normal pressure required for the local extrusion-the protrusion of virgin surfaces by the surface expansion at the interface-is obtained using a slip line method and is then used as a criteron for the bonding. A rigid plastic finite element method is used to analyze the steady state extrusion process. The interface profile of bi-metal rod is predicted by tracking the paths of two particles adja-process. The interface profile of bi-metal rod is predicted by tracking the paths of two particles adja-cent to interface surface. The contact surface area ration and the normal pressure along the interface are calculated and compared to the critical normal pressure to check bonding. It is found that the model predictions are generally in good agreement with the experimental observations. The compar-isons of the extrusion pressure and interface profile by the finite element with those by experi-ments are also given.

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The Use of Finite Element Method to Predict the Hot Shear-Welding Process of Two Aluminum Plates

  • Shang, Li-Dong;Lee, Kyeng-Kook;Jin, In-Tai
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2008.10a
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    • pp.426-430
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    • 2008
  • Hot shear-welding is a process of bonding two plates together by using shearing stress in a controlled manner. This study dealt with the hot shear-welding process of two aluminum plates. These two plates were piles up in the shear-welding mold. Due to the shearing stress, these two plates were cut off longitudinally, and meantime they were welded together. During this process the control of the surplus material flow is very important, and it can be realized by designing the overlapping length and the shape of the cavity. The commercial software Deform-3D was employed to predict the effect of these two factors. The overlapping length and the shape of the cavity that presents the optimum design was then developed to get a good shear-welding process.

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Microstructure and Formability of Semi-solid A390 Alloys made by uniform heating (균일가열법으로 제조한 반용융 A390합금의 미세조직 및 성형성)

  • 엄정필;장동훈;김득규;윤병은;임수근
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 1997.06a
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    • pp.160-173
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    • 1997
  • Microstructure of hypereutectic Al-17wt.% Si alloy, fabricated by mechanical stirring and by reheating at semi-solid state, was investigated by optical microscope. Flow behavior semi-solid metal also was investigated at diffentent mould temperatures 280$^{\circ}C$, 290$^{\circ}C$ and 300$^{\circ}C$. Size of silicon particles were increased over 100$\mu\textrm{m}$ during solidification as a result of stirring. It is considered as microstructural coarsening by bonding between neighbouring primary silion particles during stirring of slurry. In case of reheating at semi-solid state, however, primary silicon particle was not increased at size of 40$\mu\textrm{m}$ and nearly spherical aluminum solde particle also could be obtained uniformly in distribution. The fludity of Al-17wt.% Si alloys at semi-solid state was improved when solid fraction was 0.7 at mould temperature of 300$^{\circ}C$ than other conditions.

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Synthesis of Ni-based Bulk Metallic Glass Composites (Ni계 벌크 비정질 복합재의 제조)

  • Lee, Jin-Kyu
    • Journal of Powder Materials
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    • v.15 no.4
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    • pp.297-301
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    • 2008
  • The Ni-based bulk metallic glass matrix composites were fabricated by spark plasma sintering of mixture of gas-atomized metallic glass powders and ductile brass powders. The successful consolidation of metallic glass matrix composite was achieved by strong bonding between metallic glass powders due to viscous flow deformation and lower stress of ductile brass powders in the supercooled liquid state during spark plasma sintering. The composite shows some macroscopic plasticity after yielding, which was obtained by introducing a ductile second brass phase in the Ni-based metallic glass matrix.

Design and Fabrication of Mold Insert for Injection Molding of Microfluidic tab-on-a-chip for Detection of Agglutination (응집반응 검출을 위한 미세 유체 Lab on a chip의 사출성형 금형 인서트의 디자인 및 제작)

  • Choi, Sung-Hwan;Kim, Dong-Sung;Kwon, Tai-Hun
    • Transactions of Materials Processing
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    • v.15 no.9 s.90
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    • pp.667-672
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    • 2006
  • Agglutination is one of the most commonly employed reactions in clinical diagnosis. In this paper, we have designed and fabricated nickel mold insert for injection molding of a microfluidic lab-on-a-chip for the purpose of the efficient detection of agglutination. In the presented microfluidic lab-on-a-chip, two inlets for sample blood and reagent, flow guiding microchannels, improved serpentine laminating micromixer(ISLM) and reaction microwells are fully integrated. The ISLM, recently developed by our group, can highly improve mixing of the sample blood and reagent in the microchannel, thereby enhancing reaction of agglutinogens and agglutinins. The reaction microwell was designed to contain large volume of about $25{\mu}l$ of the mixture of sample blood and reagent. The result of agglutination in the reaction microwell could be determined by means of the level of the light transmission. To achieve the cost-effectiveness, the microfluidic lab-on-a-chip was realized by the injection molding of COC(cyclic olefin copolymer) and thermal bonding of two injection molded COC substrates. To define microfeatures in the microfluidic lab-on-a-chip precisely, the nickel mold inserts of lab-on-a-chip for the injection molding were fabricated by combining the UV photolithography with a negative photoresist SU-8 and the nickel electroplating process. The microfluidic lab-on-a-chip developed in this study could be applied to various clinical diagnosis based on agglutination.