• Journal of the Korean Society of Safety
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• v.16 no.4
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• pp.14-21
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• 2001

SG-365 steel is an important material End used for manufacturing a pressure vessel and gas piping. In this investigation, the elastic plastic fracture toughness of this material is evaluated by the unloading compliance method according to the ASTM E8l3-97 and E1152-97 method on the smooth and side groove In specimens. The effect of smooth and side groove is studied on the elastic plastic fracture toughness. The side grooved specimen is very useful in estimation of the $J_{IC}$. Because it is much easier than the smooth specimen to the onset of the ductile tearing by the R curve method. Besides. it improves the accuracy of toughness values, decreases the scattering of them and crack tunneling effect and shear lip by the side groove.

• Journal of Ocean Engineering and Technology
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• v.8 no.2
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• pp.157-165
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• 1994

Effect of an accelerated iso-thermal aging (375 degree C x 66days, 375 degree C x 200days) on elastic-plastic fracture resistance curve were examined in SA533B low alloy steel. Fracture toughness test are conducted by unloading compliance method at room temperature. But the apparent negative crack growth phenomenon, usually arise in partial unloading compliance test. The phenomenon of negative crack growth may be eliminated by the offset technique. There is no effect of aging on J sub(IC) and dJ/da in iso-thermal aged (375 degree C x 66 days) specimen, but there is very little effect in iso-thermal aged (375 degree C x 200 days) specimen.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.11
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• pp.9-14
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• 2007

In this article, the organic integrated circuits such as inverter, ring oscillator, NAND and NOR gates, and rectifier have been fabricated on PEN substrate by using pentacene TFTs, The OTFTs used bottom contact structure and produced the average mobility of 0.26 $cm^2/V.sec$ and on/off current ratio of $10^5$. All circuits successfully worked as the simulation results. Especially, the rectifier was able to operate up to 1 MHz input AC signals, and ring oscillator exhibited oscillation frequency of 1MHz at 40 V. Based on the results of organic integrated circuits we could confirm the possibility of the low cost RFID tags and flexible display with OTFTs.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.32-35
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• 2002

The work focuses on the development of a Cu lead-frame with a single-sided adhesive tape for cost reduction and reliability improvement of LOC (lead on chip) package products, which are widely used for the plastic-encapsulation of memory chips. Most of memory chips are assembled by the LOC packaging process where the top surface of the chip is directly attached to the area of the lead-frame with a double-sided adhesive tape. However, since the lower adhesive layer of the double-sided adhesive tape reveals the disparity in the coefficient of thermal expansion from the silicon chip by more than 20 times, it often causes thermal displacement-induced damage of the IC pattern on the active chip surface during the reliability test. So, in order to solve these problems, in the resent work, the double-sided adhesive tape is replaced by a single-sided adhesive tape. The single-sided adhesive tape does net include the lower adhesive layer but instead, uses adhesive materials, which are filled in clear holes of the base film, just for the attachment of the lead-frame to the top surface of the memory chip. Since thermal expansion of the adhesive materials can be accommodated by the base film, memory product packaged using the lead-flame with the single-sided adhesive tape is shown to have much improved reliability. Author allied this invention to the Korea Patent Office for a patent (4-2000-00097-9).

• Journal of the Korean institute of surface engineering
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• v.32 no.6
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• pp.647-657
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• 1999

Due to the inherently poor adhesion strength of Cu-based leadframe/EMC (Epoxy Molding Compound) interface, popcorn cracking of thin plastic packages frequently occurs during the solder reflow process. In the present work, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, black-oxide layer was formed on the leadframe surface by chemical oxidation of leadframe, and then oxidized leadframe sheets were molded with EMC and machined to form SDCB (Sandwiched Double-Cantilever Beam) and SBN (Sandwiched Brazil-Nut) specimens. SDCB and SBN specimens were designed to measure the adhesion strength between leadframe and EMC in terms of critical energy-release rate under quasi-Mode I ($G_{IC}$ ) and mixed Mode loading ($G_{C}$ /) conditions, respectively. Results showed that black-oxide treatment of Cu-based leadframe initially introduced pebble-like X$C_2$O crystals with smooth facets on its surface, and after the full growth of $Cu_2$O layer, acicular CuO crystals were formed atop of the $Cu_2$O layer. According to the result of SDCB test, $Cu_2$O crystals on the leadframe surface did not increase ($G_{IC}$), however, acicular CuO crystals on the $Cu_2$O layer enhanced $G_{IC}$ considerably. The main reason for the adhesion improvement seems to be associated with the adhesion of CuO to EMC by mechanical interlocking mechanism. On the other hand, as the Mode II component increased, $G_{C}$ was increased, and when the phase angle was -34$^{\circ}$, crack Kinking into EMC was occured.d.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.10 s.253
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• pp.1173-1178
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• 2006

In a primary reactor cooling system(RCS), a dissimilar weld zone exists between cast stainless steel(CF8M) in a pipe and low-alloy steel(SA508 cl.3) in a nozzle. Thermal aging is observed in CF8M as the RCS is exposed for a long period of time to a reactor operating temperature between 290 and $330^{\circ}C$, while no effect is observed in SA508 cl.3. The specimens are prepared by an artificially accelerated aging technique maintained for 300, 1800 and 3600 hrs at $430^{\circ}C$, respectively. The specimens for elastic-plastic fracture toughness tests are according to the process in the thermal notch is created in the heat affected zone(HAZ) of CF8M and deposited zone. From the experiments, the $J_{IC}$ value notched in HAZ of CF8M presented a rapid decrease up to 300 hours at $430^{\circ}C$ and slowly decreased according to the process in the thermal aging time. Also, the $J_{IC}$ value presented a lower value than that of the CF8M base metal. And, the $J_{IC}$ of the deposited zone presented the lowest value of all other cases.

• Journal of the Korean Society of Safety
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• v.14 no.3
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• pp.18-24
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• 1999

This paper were performed to evaluate the elastic-plastic fracture toughness $J_IC$ by the unloading compliance method for 1/2 CT specimen of A5083-H112 aluminum alloy. A modified offset method for negative crack growth effect is presented and compared with Voss offset method. We found that the modified offset method presented can be used efficiently for a determination of the stable crack onset. The $J_IC$ by Voss offset method can be overestimated, but the suggested offset method showed a high reliability within 5% of tolerence from the results by the multi-specimen method.

• Proceedings of the IEEK Conference
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• 2002.06b
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• pp.73-76
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• 2002

In this paper we present an integrated Hail sensor It for fan motors, fabricated in industrial bipolar process. As a discrete Hall sensor and signal processing circuitry In the fan motor system were Integrated into single chip a temperature dependence of Hall sensitivity and Hall offset voltage can be compensated and cancelled by on-chip circuitry. We Propose a novel temperature compensation of Hall sensitivity with negative temperature coefficient (TC) using the differential amplifier gain with Positive TC. After a package of the chip was sealed using a plastic Package 20 Pins, the thermal and magnetic characteristics were investigated. The obtained experimental results are in agreement with analytical predictions and have more excellent performance than\ulcorner conventional the fan motor system using discrete Hall sensor.

• Journal of the Microelectronics and Packaging Society
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• v.5 no.2
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• pp.37-48
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• 1998

The popcorn cracking phenomena in plastic IC packages during reflow soldering are investigated by considering the heat transfer and moisture diffusion through the epoxy molding compound(EMC) along with the mechanics of interface delamination. Heat transfer and moisture diffusion through EMC under die pad are analyzed by finite difference method (FDM)during the pre-conditioning and subsequent reflow soldiering pro-cess and the amounts of moisture mass and vapor pressure at delaminated die pad/ EMC interface are calculated as a function of the reflow soldering time. The energy release rate stress intensity factor and phase angle were obtained under various loading conditions which are thermal crack face vapor pressure and mixed loadings. It was shown that thermal loading was the main driving force for the crack propagation for small crack lengths but vapor pressure loading played more significant role as crack grew.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.2
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• pp.21-26
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• 1997

The dielectric effects on the parasitics of bondwires buried in slightly-lossy dielectric materials hav been investigated over a wide frequency range using the method of moments with incorporation of ohmic and dielectric losses. The FR-4 composite is widely used as a basis material for PCB and plastic packages, because of it sinherent electricl and chemical stbility and low cost. The cole-cole model, which is representative complex permittivity model of epoxy polymers, has been applied to consider the dielectric effects in the MoM calculation. The prasitic impedance of a grounded bondwire in FR-4 composite is greatly increased due to the dielectric loading effect enhanced by the radiation at high frequencies. These calculation results will be helpful for designing and packaging of high-frequency low-cost IC's.