• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.7
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• pp.1159-1169
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• 2003

This paper investigates the effects of T-stress and plastic hardening mismatch on the interfacial crack-tip stress field via finite element analyses. Plane strain elastic-plastic crack-tip fields are modeled with both MBL formulation and a full SEC specimen under pure bending. Modified Prandtl slip line fields illustrate the effects of T-stress on crack-tip constraint in homogeneous material. Compressive T-stress substantially reduces the interfacial crack-tip constraint, but increases the J-contribution by lower hardening material, J$\_$L/. For bimaterials with two elastic-plastic materials, increasing plastic hardening mismatch increases both crack-tip stress constraint in the lower hardening material and J$\_$L/. The fracture toughness for bimaterial joints would consequently be much lower than that of lower hardening homogeneous material. The implication of unbalanced J-integral in bimaterials is also discussed.

• Journal of Mechanical Science and Technology
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• v.14 no.1
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• pp.30-38
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• 2000

This paper presents a framework how to estimate crack driving forces in terms of crack-tip opening displacement and J-integral for mismatched dissimilar joints with interface cracks. The mismatch in elastic, thermal, and plastic hardening properties is not considered, but the mismatch in plastic yield strengths is emphasized here. The main outcome of the present work is that the existing methods to estimate crack driving forces for homogeneous materials can be used with slight modification. Such modification includes (i) mismatch- corrected limit load solutions, and (ii) evaluating the contribution of each material in dissimilar joints to the total crack driving force, which depends on the strength mismatch of the dissimilar joints.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2004.05a
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• pp.70-73
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• 2004

The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics (Al$_2$O$_3$-SiO$_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a Cu/Al$_2$O$_3$-SiO$_2$ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.308-312
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• 2003

The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics ($Al_2O_3-SiO_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a $Cu/Al_2O_3-SiO_2$ ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.