• Proceedings of the Korean Vacuum Society Conference
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• 2001.02a
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• pp.65-66
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• 2001

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2003.05a
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• pp.95-95
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• 2003

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.273-273
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• 2012

최근 스마트 윈도우, 자가세정(Self-Cleaning), 김서림방지(Anti-Fogging), 디스플레이 표시장치, 대전방지 코팅 등 다각적으로 활용이 가능한 PTFE (Ploytetrafluoroethylene)를 Sol-gel, Sputtering, Spin-Coating, CVD (Chemical vapor deposition)방법을 이용하여 낮은 표면에너지와 나노사이즈의 표면 거칠기를 가지는 $150^{\circ}$ 이상의 초-발수성 표면에 대한 많은 연구가 진행되고 있다. 본 실험에서는 영구자석을 이용한 고밀도 플라즈마로 높은 점착성과, 균일한 박막 및 대 면적 공정이 가능한 RF-magnetron sputtering방법을 이용하여 Plasma etching으로 표면적의 거칠기와 낮은 표면에너지를 만든 뒤, 발수특성을 가진 PTFE를 증착하여 접촉각 변화와 구조적 및 광학적 특성을 측정하였다. AFM (Atomic Force Microscope)측정결과 100 w에서 가장 높은 1.7 nm의 RMS(Root mean square)값이 측정되었고, 접촉각 측정결과 Plasma etched glass는 25 w에서 125 w로 증가함에 따라 친수성을 나타내었으며, 100 w에서 가장 낮은 $15^{\circ}$의 접촉각을 나타내었다. PTFE박막을 증착하였을 때는 100 w에서 $150^{\circ}$의 초발수 특성을 나타내었고, 투과율 측정 결과 85%이상의 높은 투과율을 나타내었다. Plasma etching을 이용한 PTFE 발수 특성은 비가 오면 자동으로 이물질이 씻겨 내리는 자동차 유리등의 개발이 가능하고, 높은 투과율이 요구되는 액정표시장치(LCD)같은 차세대 대형 디스플레이의 표면 코팅에 사용이 가능 할 것이라 사료된다. 본 연구는 중소기업청에서 지원하는 2011년도 산학연 공동기술개발 지원사업의 연구수행으로 인한 결과물임을 밝힙니다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.11a
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• pp.35-35
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• 2001

agnesium Oxide (MgO) with a NaCI structure is well known to exhibit high secondary electron emission, excellent high temperature chemical stability, high thermal conductance and electrical insulating properties. For these reason MgO films have been widely used for a buffer layer of high $T_c$ superconducting and a protective layer for AC-plasma display panels to improve discharge characteristics and panel lifetime. Up to now MgO films have been synthesized by lE-beam evaporation, Molecular Beam Epitaxy (MBE) and Metalorganic Chemical Vapor Deposition (MOCVD), however there have been some limitations such as low film density and micro-cracks in films. Therefore magnetron sputtering process were emerged as predominant method to synthesis high density MgO films. In previous works, we designed and manufactured unbalanced magnetron source with high power density for the deposition of high quality MgO films. The magnetron discharges were sustained at the pressure of O.lmtorr with power density of $110W/\textrm{cm}^2$ and the maximum deposition rate was measured at $2.8\mu\textrm{m}/min$ for Cu films. In this study, the syntheses of MgO films were carried out by unbalanced magnetron sputtering with various $O_2$ partial pressure and specially target power densities, duty cycles and frequency using pulsed DC power supply. And also we investigated the plasma states with various $O_2$ partial pressure and pulsed DC conditions by Optical Emission Spectroscopy (OES). In order to confirm the relationships between plasma states and film properties such as microstructure and secondary electron emission coefficient were analyzed by X-Ray Diffraction(XRD), Transmission Electron Microscopy(TEM) and ${\gamma}-Focused$ Ion Beam (${\gamma}-FIB$).

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.543-544
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• 2008

In the fabrication of inverted top emission organic light emitting diodes (ITOLEDs), the organic layers are damaged by high-energy plasma sputtering process for transparent top anode. In this study, the plasma process induced damages on metal oxide hole injection layers (HILs) including $WO_3$, $MoO_3$, and $V_2O_5$ as buffer layer are examined. With the result of IV characteristic of hole-only devices, we propose that $MoO_3$ and $V_2O_5$ are stable materials against plasma sputtering process.

• Journal of the Korean institute of surface engineering
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• v.45 no.4
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• pp.168-173
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• 2012

A real-time monitoring of an immersed antenna type inductively coupled plasma (ICP) was done with optical emission spectroscopy (OES) to check the reports that sputtered atom density is decreasing as the ICP power is increased. At 10 mTorr pressure of Ar, Mg was sputtered by a bipolar pulsed power supply into 2 MHz ICP which has an insulator covered 2.5 turn antenna. Emitted light was collected in two different positions: above the target and inside the ICP region. With 100 W of Mg sputtering power, the intensities of Mg I (285.06 nm), Mg II (279.48 nm), Ar I (420.1 nm) were increased constantly with ICP power from 100 W to 600 W. At 500 W, the intensity of $Mg^+$ exceeded that of Mg under PID controlled discharge voltage of 180 V. The ratio of Mg II/Mg I was increased from 0.45 to 2.71 approximately 6 times.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.3
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• pp.588-593
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• 2010

Sputter deposition on a Pt counter electrode was studied using radio frequency (RF) plasma as the improvement of incident photon to current conversion efficiency (IPCE) for dye-sensitized solar cells (DSCs). Effects of the sputtering thickness and the incident angle on a Pt counter electrode for DSCs were investigated. Experiments to get the optimal sputtering time for the performance of the DSCs were carried out. And it is found that the optimized sputtering time was 120 seconds, in addition, the incident angles of the substrate was adjusted from $0^{\circ}$ to $60^{\circ}$. The maximum efficiency of 5.37% was obtained at the incident angle of $40^{\circ}$ with an active cell area of $1cm^2$.

• Journal of the Korean institute of surface engineering
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• v.29 no.6
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• pp.824-828
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• 1996

Co-based alloy thin films ddeposited by fcing targets sputtering(FTS) were investigated for use in high-density magnetic recording media to determine how their magnetic properties are dependent on the sputtering conditions, and thus to find appropriate parameters that allow the sputtering and thin films to meet the specificiations for magnetic properties. FTS can discharge at lower working gas pressure than other sputtering methods such as dcmagnetron sputteing because the plasma is sufficiently confined by a magnetic field applied perpendicular to both of the target planes, which results in plasma-free substrates. Co-Cr-Ta films were deposited by FTS on glass and silicon substrates at substrate temperature between room temperature and $350^{\circ}C$, and at argon gas pressure between 0.1 and 10mTorr. The films were also deposited on polyimide tapes at substrate temperature of $130^{\circ}C$ and argon gas pressure of 1 mTorr. The effective advantages of Ta as an additional element were investigated, using the same films on the tapes. As a result of the experiment, it was found that better magnetic properties were obtained in the ranges of higher temperature and lower argon gas pressure with background pressure in thr range of $1.5 \times 10^{-6}$ Torr. Ta addition at 2 to 4 atomic percent almost havled the Co-Cr grain sizes, indicating that Ta addition at an appropriate atomic percent is effective for improving the microstructure and characteristics of Co-Cr films.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.488-488
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• 2013

일반적으로 sputtering 방식을 이용한 박막 증착 방법은 장치가 간단하고 고품질의 박막이나 균일한 박막을 만들 수 있는 장점이 있어 널리 사용된다. 본 연구에서는 기존의 sputtering 방식에 Modulation technology를 적용하고자 한다. Modulation technology를 이용하여 전원의 pulse on 시에는 일반적인 sputter 방식으로 기판에 박막을 증착하고 pulse off 시에는 양의 전압을 인가하여 이온빔을 발생시킨 후 기판에 입사시키는 방식을 적용하여 박막 형성의 특성을 향상시키고자한다. 이는 고온의 heater 및 이온빔이나 레이저, 플라즈마 소스 등의 추가적인 에너지원의 장치가 필요 없이 고품질의 박막의 특성을 향상시키는 기대 효과가 있다. Modulated Sputtering System (MSS)에 인가되는 전압과 전류의 특성을 관찰하였으며 MSS에 인가하는 전압과 frequency, 그리고 duty cycle 변화에 따른 이온 에너지 분포를 에너지 분석기를 통해 측정하였다. 또한 Langmuir probe를 이용한 afterglow plasma 상태에서의 이온전류를 측정하였다. 그리고, MSS 이용하여 Ti 박막을 증착하였으며 박막의 특성을 분석하기 위하여 a-step, SEM, XRD, AFM을 이용하여 두께, 결정성장면, 표면 거칠기를 측정하였다. 측정 결과 기판에 입사되는 양이온의 에너지가 증가함에 따라 (002) 결정면 방향에서 (100) 결정면 방향으로 증착되고 표면 거칠기가 낮아짐을 측정하였다. 또한 Graphite 타겟을 이용한 carbon 박막을 증착하였으며 박막의 특성을 분석하기 위하여 Raman을 이용한 분석 결과 양이온의 에너지가 증가함에 따라 박막내의 sp3 함유량이 변화함을 측정하였다.

• Korean Journal of Materials Research
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• v.20 no.4
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• pp.175-180
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• 2010

Transparent conducting oxide (TCO) films are widely used for optoelectronic applications. Among TCO materials, zinc oxide (ZnO) has been studied extensively for its high optical transmission and electrical conduction. In this study, the effects of $O_2$ plasma pretreatment on the properties of Ga-doped ZnO films (GZO) on polyethylene naphthalate (PEN) substrate were studied. The $O_2$ plasma pretreatment process was used instead of conventional oxide buffer layers. The $O_2$ plasma treatment process has several merits compared with the oxide buffer layer treatment, especially on a mass production scale. In this process, an additional sputtering system for oxide composition is not needed and the plasma treatment process is easily adopted as an in-line process. GZO films were fabricated by RF magnetron sputtering process. To improve surface energy and adhesion between the PEN substrate and the GZO film, the $O_2$ plasma pre-treatment process was used prior to GZO sputtering. As the RF power and the treatment time increased, the contact angle decreased and the RMS surface roughness increased significantly. It is believed that the surface energy and adhesive force of the polymer surfaces increased with the $O_2$ plasma treatment and that the crystallinity and grain size of the GZO films increased. When the RF power was 100W and the treatment time was 120 sec in the $O_2$ plasma pretreatment process, the resistivity of the GZO films on the PEN substrate was $1.05\;{\times}\;10^{-3}{\Omega}-cm$, which is an appropriate range for most optoelectronic applications.