• 제목/요약/키워드: Plasma sputtering

검색결과 611건 처리시간 0.028초

Al:ZnO의 펄스 스퍼터 증착에서 주파수에 따른 플라즈마의 특성과 기판 온도 변화 (Plasma Characteristics and Substrate Temperature Change in Al:ZnO Pulse Sputter Deposition: Effects of Frequency)

  • 양원균;주정훈
    • 한국표면공학회지
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    • 제40권5호
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    • pp.209-213
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    • 2007
  • Change of the plasma volume by pulse frequency in a bipolar pulsed DC unbalanced magnetron sputtering was investigated. As increasing the frequency at off duty 10% and at a constant power, the plasma volume was lengthened in vertical direction from the AZO target. When there is an electrically floated substrate, the vertical length of the plasma area was not affected by the pulse frequency. Instead, the diameter of the plasma volume was increased. We found that the temperature rise of a substrate was affected by the pulse frequency, too. As increasing it, the maximum temperature rise of a glass substrate was decreased from $132^{\circ}C\;to\;108^{\circ}C$.

투명 폴리카보네이트 보호코팅을 위한 산화알루미늄 박막 (Al2O3 Coating on Transparent Polycarbonate Substrates for the Hard-coating Application)

  • 김훈;남경희;장동수;이정중
    • 한국표면공학회지
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    • 제40권4호
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    • pp.159-164
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    • 2007
  • Transparent aluminum oxide films were deposited on polycarbonate (PC) substrates by inductively coupled plasma (ICP) assisted reactive sputtering. the oxygen flow rate was regulated by controlling the target voltage with a proportional integrate derivative controller. The PC substrate was treated with plasma prior to the deposition in order to the enhance the adhesive strength of the $Al_2O_3$ film. The characteristics of hardness, structure, density, transmittance, deposition rate, surface roughness and residual stress were investigated to estimate the possibility for the hard coating.

사각형 유도 결합 플라즈마 시스템의 수치 모델링 (Numerical Modeling of a Rectangular Type Inductively Coupled Plasma System)

  • 주정훈
    • 한국표면공학회지
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    • 제45권4호
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    • pp.174-180
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    • 2012
  • Low pressure inductively coupled plasma characteristics of argon and oxygen are numerically simulated for a 400 mm rectangular type system with a plasma fluid model. The results showed lower power absorption profile at the corner than a circular one in a 13.56 MHz driven 1.5 turn antenna system with a drift-diffusion and quasi-neutrality assumption. Ions controlled by electric field are more non-uniform than metastables and the power absorption profile of oxygen plasma is affected by horizontal gas flow pattern to show 25% lower power absorption at the pumping flange side. Oxygen negative ions which are generated in electron collisional dissociation of oxygen molecules was calculated as 0.1% of oxygen atoms with similar spatial profile.

X-선 노광용 마스크 제작공정에 관한 연구 (A Study on the Mask Fabrication Process for X-ray Lithography)

  • 박창모;우상균;이승윤;안진호
    • 마이크로전자및패키징학회지
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    • 제7권2호
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    • pp.1-6
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    • 2000
  • X-선 노광용 마스크의 재료로서 SiC와 Ta박막을 각각 ECR플라즈마 CVD, 스퍼터링 장비를 이용하여 증착한 뒤 잔류응력, 미세구조, 표면상태, 그리고 화학적 결합상태 등을 조사하였고, ECR etching system을 이용하여 Ta박막 미세 식각 특성을 연구하였다. SiC박막은 $N_2$분위기에서 RTA를 통하여 X-선 투과막 물질로서 필요한 적절한 인장응력을 변화 시킬 수 있었고, 공정 압력을 조절하여 증착한 Ta박막은 높은 밀도와 우수한 표면 평활도를 가지고 시간과 온도에 따른 응력의 안정성이 좋은 X-선 흡수체를 증착할 수 있었다. 또한 Cl 플라즈마는 흡수체 물질 Ta에 대해 좋은 식각특성을 보였고, two-step 식각을 통해 microloading effect를 억제함으로써 0.2 $\mu\textrm{m}$이하의 미세패턴을 식각해 낼 수 있었다.

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DC 스퍼터법과 유도결합 플라즈마 마그네트론 스퍼터법으로 증착된 CrN 코팅막의 물성 비교연구 (A Comparative Study of CrN Coatings Deposited by DC and Inductively Coupled Plasma Magnetron Sputtering)

  • 서대한;전성용
    • 한국표면공학회지
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    • 제45권3호
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    • pp.123-129
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    • 2012
  • Nanocrystalline CrN coatings were fabricated by DC and ICP (inductively coupled plasma) assisted magnetron sputtering techniques. The effect of ICP power, ranging from 0 to 500 W, on coating microstructure, preferred orientation mechanical properties were systematically investigated with HR-XRD, SEM, AFM and nanoindentation. The results show that ICP power has an significant influence on coating microstructure and mechanical properties of CrN coatings. With the increasing of ICP power, coating microstructure evolves from the columnar structure of DC process to a highly dense one. Grain size of CrN coatings were decreased from 11.7 nm to 6.6 nm with increase of ICP power. The maximum nanohardness of 23.0 GPa was obtained for the coatings deposited at ICP power of 500 W. Preferred orientation in CrN coatings also vary with ICP power, exerting an effective influence on film nanohardness.

Microstructural evolution of tantalum nitride thin films synthesized by inductively coupled plasma sputtering

  • Sung-Il Baik;Young-Woon Kim
    • Applied Microscopy
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    • 제50권
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    • pp.7.1-7.10
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    • 2020
  • Tantalum nitride (TaNx) thin films were grown utilizing an inductively coupled plasma (ICP) assisted direct current (DC) sputtering, and 20-100% improved microhardness values were obtained. The detailed microstructural changes of the TaNx films were characterized utilizing transmission electron microscopy (TEM), as a function of nitrogen gas fraction and ICP power. As nitrogen gas fraction increases from 0.05 to 0.15, the TaNx phase evolves from body-centered-cubic (b.c.c.) TaN0.1, to face-centered-cubic (f.c.c.) δ-TaN, to hexagonal-close-packing (h.c.p.) ε-TaN phase. By increasing ICP power from 100 W to 400 W, the f.c.c. δ- TaN phase becomes the main phase in all nitrogen fractions investigated. The higher ICP power enhances the mobility of Ta and N ions, which stabilizes the δ-TaN phase like a high-temperature regime and removes the micro-voids between the columnar grains in the TaNx film. The dense δ-TaN structure with reduced columnar grains and micro-voids increases the strength of the TaNx film.

반도체 Ash 공정용 PWM 제어 Plasma 발생방법 (Plasma Generation Method using PWM Control for Ash Process)

  • 이정호;최대규;최상돈;이병국;원충연;김수석
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 2006년도 전력전자학술대회 논문집
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    • pp.470-474
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    • 2006
  • This dissertation discuses about a ferrite core plasma source using low operating frequency without sputtering problem by the stored electric field. Compared with the conventional RF power system with 13.56MHz switching frequency, the proposed plasma power system is only separated at 400kHz, so that it makes possible to use of low cost switching elements, PWM control and soft switching. Moreover, it could improve the coupling efficiency for plasma and antenna by using the ferrite core in order to transfer the energy of the load This dissertation tried to analyze new plasma generation method for the plasma generation system by modeling the plasma load and grafting the concept of impedance matching in order to interpret it with the formula This dissertation verified the ferrite core inductive coupling plasma source authorized for 400kHz of low frequency power by applying to the semi-conductor ash process thru the measurement of ash capacity and uniformed plasma distribution on the actual wafer.

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$TiO_2$ 및 Ag 스퍼터링-$TiO_2$ 플라즈마 용사피막의 광전류 및 광분해 특성 (Photoelectrical Conductivity and Photodegradation Properties of $TiO_2$ and Ag Sputtered $TiO_2$ Plasma Spraying Coatings)

  • 강태구;장용호;박경채
    • Journal of Welding and Joining
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    • 제27권2호
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    • pp.38-43
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    • 2009
  • In this study, we investigated photocatalytic ability of plasma sprayed $TiO_2$ and Ag sputtering $TiO_2$(Ag-$TiO_2$) coatings. A sputtering processes were adopted to coat the surface of $TiO_2$ with Ag(99.99%). Ag was sputtered at 10mA, 450V for $1{\sim}11$ seconds. $TiO_2$ and Ag-$TiO_2$ coatings were heat-treated at 250, 300, 350, $400^{\circ}C$ for $0{\sim}240$seconds. Photoelectrical conductivity was measured by four-point probe, and photodegradation was calculated by UV-V is spectrometer. Microstructure observation of $TiO_2$ and Ag-$TiO_2$ coatings were investigated by SEM. Crystal structure of $TiO_2$ and Ag-$TiO_2$ coatings were investigated by XRD. Qualitative analyses of $TiO_2$ and Ag-$TiO_2$ coatings were conducted by EDX. When $TiO_2$ coatings were heat-treated at $350^{\circ}C$ for 30 sec, photoelectrical conductivity and photodegradation were best. And in XRD analysis result, (101)/(110) relative intensity ratio of $TiO_2$(rutile) was comparably changed with photoelectrical conductivity. When Ag-$TiO_2$ coatings were heat-treated at $350^{\circ}C$ for 30 [sec] after sputtering Ag for 7 sec, Photoelectrical conductivity and photodegradation are best. Surface of coatings in such condition has very small and uniform Ag particles.