• Title/Summary/Keyword: Plasma Sensor

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Sensing Properties of $\alpha$-Fe$_2$O$_3$ Thin Film Gas Sensor to Reducing Gases ($\alpha$-Fe$_2$O$_3$ 박막 센서의 환원성 가스감지특성)

  • 이은태;장건익;이덕동
    • Journal of the Korean Ceramic Society
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    • v.36 no.5
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    • pp.465-470
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    • 1999
  • Sensing properties of $\alpha$-Fe2O3 thin film to reducing gases such as CHx and CO were systematically examined after deposition on Al2O3 substrate by PECVD(Plasma Enhanced Chemical Vapor Deposition)technique. Microstructure of deposited $\alpha$-Fe2O3 thin film showed the porous island structure. This specimen was annealed at 450, 550, $650^{\circ}C$ to enhance the gas sensing properties and investigated in terms of CO and C4H10 concentration from 500ppm to 3,000 ppm at operating temperature of 35$0^{\circ}C$ The gas sensitivity(%) to C4H10 measured at the operating temperature of 35$0^{\circ}C$ was 98.24 (highest sensitivity) 69.51 to CO and 2% to CH4 respectviely.

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THIN FILM SENSORS FOR AUTOMOBILE

  • Taga, Yasunori
    • Journal of the Korean institute of surface engineering
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    • v.29 no.5
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    • pp.459-466
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    • 1996
  • A great amount of effort has been devoted to the constant improvement of such basic performance as dirvability, safety and enviromental protection. As a result, the total combination of various technologies has made it possible to produce safer and more comfortable automobiles. Among these technologies, plasma and thin film techniques are mainly cocerned with sensors, optics, electronics and surface modification. This paper first describes a concept of thin film processing in materials synthesis for sensors based on particle-surface interaction during deposition to provide a long life sensor applicable to sutomobiles. Some examples of parctical application of thin films to sensors are then given. These include(1) a thin films strain gauge for gravity sensors, (2) a giant magneto resistance film for speen sensors, and (3) a Magneto-impedance sensors fordetection of low magnetic field. Further progress of sophisticated thin film technology must be considered in detail to explore advanced thin film materials science and to ensure the field reliability of future sensor devices for automobile.

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Design of the Fuzzy-based Mobile Model for Energy Efficiency within a Wireless Sensor Network

  • Yun, Dai Yeol;Lee, Daesung
    • Journal of information and communication convergence engineering
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    • v.19 no.3
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    • pp.136-141
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    • 2021
  • Research on wireless sensor networks has focused on the monitoring and characterization of large-scale physical environments and the tracking of various environmental or physical conditions, such as temperature, pressure, and wind speed. We propose a stochastic mobility model that can be applied to a MANET (Mobile Ad-hoc NETwork). environment, and apply this mobility model to a newly proposed clustering-based routing protocol. To verify its stability and durability, we compared the proposed stochastic mobility model with a random model in terms of energy efficiency. The FND (First Node Dead) was measured and compared to verify the performance of the newly designed protocol. In this paper, we describe the proposed mobility model, quantify the changes to the mobile environment, and detail the selection of cluster heads and clusters formed using a fuzzy inference system. After the clusters are configured, the collected data are sent to a base station. Studies on clustering-based routing protocols and stochastic mobility models for MANET applications have shown that these strategies improve the energy efficiency of a network.

Display Technologies for Immersive Devices and Electronic Skin (디스플레이 현황과 발전방향 -실감 및 스킨 기기로의 확대)

  • Park, Y.J.
    • Electronics and Telecommunications Trends
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    • v.34 no.2
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    • pp.10-18
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    • 2019
  • Since the introduction of CRT(Cathode Ray Tube) in the 1950s, display technologies have been developed continuously. Flat panel displays such as PDP(Plasma Display Panel) and LCD(Liquid Crystal Display) were commercialized in the late 1990s, and OLED(Organic Light Emitting Diodes) and Micro-LED(Micro-Light Emitting Diodes) are now being developed and are becoming widespread. In the future, we expect to develop ultra-realistic, flexible, embedded sensor displays. Ultra-realistic display can be applied to AR/VR(Augmented Reality/Virtual Reality) devices and spatial light modulators for holography. The sensor-embedded display can be applied to robots; electronic skin; and security devices, including iris recognition sensors, fingerprint recognition sensors, and tactile sensors. AR/VR technology must be developed to meet technical requirements such as viewing angle, resolution, and refresh rate. Holography requires optical modulation technology that can significantly improve resolution, viewing angle, and modulation method to enable wide-view and high-quality hologram stereoscopic images. For electronic skin, stable mass production technology, large-area arrays, and system integration technologies should be developed.

Impedance Matching Characteristic Research Utilizing L-type Matching Network

  • Jun Gyu Ha;Bo Keun Kim;Dae Sik Junn
    • Journal of the Semiconductor & Display Technology
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    • v.22 no.2
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    • pp.64-71
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    • 2023
  • If an impedance mismatch occurs between the source and load in a Radio Frequency transmission system, reflected power is generated. This results in incomplete power transmission and the generation of Reflected Power, which returns to the Radio Frequency generator. To minimize this Reflected Power, Impedance matching is performed. Fast and efficient Impedance matching, along with converging reflected power towards zero, is advantageous for achieving desired plasma characteristics in semiconductor processes. This paper explores Impedance matching by adjusting the Vacuum Variable Capacitor of an L-type Matching Module based on the trends observed in the voltage of the Phase Sensor and Electromotive Force voltage. After assessing the impedance matching characteristics, the findings are described.

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A study of weld monitoring using light emission in Aluminum 6K31 laser welding (알루미늄 6K31의 레이저 용접에서 Light Emission을 이용한 용접부 모니터링에 관한 연구)

  • 박영환;이세헌;박현성;신현일
    • Proceedings of the KWS Conference
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    • 2003.11a
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    • pp.52-54
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    • 2003
  • In automotive industry, light weight vehicle is one of issues because of air pollution. Therefore, automotive manufacturers have tried to apply light materials such as aluminum to car body. Welding aluminum using laser has some advantages good weld quality and high productivity. In this study, light emission which is generated in aluminum 6k21 welding with laser is measured using photodiodes. Analysis of relationship between sensor signals of welding variables and formation of keyhole and plasma is performed.

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Development and Characterization of Finger-type PIN Photodiode for Fluorescence Detection of RNA (RNA 형광 검출을 위한 Finger형 PIN 광다이오드의 제작 및 평가)

  • Kim, Ju-Hwan;Oh, Myung-Hwan;Ju, Byeong-Kwon
    • Journal of Sensor Science and Technology
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    • v.13 no.2
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    • pp.85-89
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    • 2004
  • This paper represents the development of high sensitivity photo-sensor for the fluorescence detection in the integrated biological analysis system. The finger-type PIN photodiodes were fabricated as the photo-sensor, and had a high sensitivity ($I_{light}/I_{dark}$ = 8720). The interference filter consisted of $TiO_{2}$ and $SiO_{2}$ was directly deposited on the photodiodes. Deposited filter with 95.5% reflection under 532 nm and 98% transmission over 580 nm exceedingly decreased the magnitude of background signal in the detection. The PDMS micro-fluidic channels are bonded on the photodiode by $O_{2}$ plasma treatment. The detection current was proportional to two primary parameters (light intensity, concentration), and the on-chip detection system could detect fluorescence signals down to 100 nM concentration (LOD = Limit of detection of rhodamine).

Ultrasonic Bonding of Au Flip Chip Bump for CMOS Image Sensor (CMOS 이미지 센서용 Au 플립칩 범프의 초음파 접합)

  • Koo, Ja-Myeong;Moon, Jung-Hoon;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.14 no.1
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    • pp.19-26
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    • 2007
  • This study was focused on the feasibility of ultrasonic bonding of Au flip chip bumps for a practical complementary metal oxide semiconductor (CMOS) image sensor with electroplated Au substrate. The ultrasonic bonding was carried out with different bonding pressures and times after the atmospheric pressure plasma cleaning, and then the die shear test was performed to optimize the ultrasonic bonding parameters. The bonding pressure and time strongly affected the bonding strength of the bumps. The Au flip chip bumps were successfully bonded with the electroplated Au substrate at room temperature, and the bonding strength reached approximate 73 MPa under the optimum conditions.

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Imprinted Graphene-Starch Nanocomposite Matrix-Anchored EQCM Platform for Highly Selective Sensing of Epinephrine

  • Srivastava, Juhi;Kushwaha, Archana;Singh, Meenakshi
    • Nano
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    • v.13 no.11
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    • pp.1850131.1-1850131.19
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    • 2018
  • In this paper, an electrochemical sensor for epinephrine (EP), a neurotransmitter was developed by anchoring molecularly imprinted polymeric matrix (MIP) on the surface of gold-coated quartz crystal electrode of electrochemical quartz crystal microbalance (EQCM) using starch nanoparticles (Starch NP) - reduced graphene oxide (RGO) nanocomposite as polymeric format for the first time. Use of EP in therapeutic treatment requires proper dose and route of administration. Proper follow-up of neurological disorders and timely diagnosis of them has been found to depend on EP level. The MIP sensor was developed by electrodeposition of starch NP-RGO composite on EQCM electrode in presence of template EP. As the imprinted sites are located on the surface, high specific surface area enables good accessibility and high binding affinity to template molecule. Differential pulse voltammetry (DPV) and piezoelectrogravimmetry were used for monitoring binding/release, rebinding of template to imprinted cavities. MIP-coated EQCM electrode were characterized by contact angle measurements, AFM images, piezoelectric responses including viscoelasticity of imprinted films, and other voltammetric measurements including direct (DPV) and indirect (using a redox probe) measurements. Selectivity was assessed by imprinting factor (IF) as high as 3.26 (DPV) and 3.88 (EQCM). Sensor was rigorously checked for selectivity in presence of other structurally close analogues, real matrix (blood plasma), reproducibility, repeatability, etc. Under optimized conditions, the EQCM-MIP sensor showed linear dynamic ranges ($1-10{\mu}M$). The limit of detection 40 ppb (DPV) and 290 ppb (EQCM) was achieved without any cross reactivity and matrix effect indicating high sensitivity and selectivity for EP. Hence, an eco-friendly MIP-sensor with high sensitivity and good selectivity was fabricated which could be applied in "real" matrices in a facile manner.

Fabrication and Vibration Characterization of a Partially Etched-type Artificial Basilar Membrane

  • Kang, Hanmi;Jung, Youngdo;Kwak, Jun-Hyuk;Song, Kyungjun;Kong, Seong Ho;Hur, Shin
    • Journal of Sensor Science and Technology
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    • v.24 no.6
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    • pp.373-378
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    • 2015
  • The structure of the human ear is divided into the outer ear, the middle ear, and the inner ear. The inner ear includes the cochlea that plays a very important role in hearing. Recently, the development of an artificial cochlear device for the hearing impaired with cochlear damage has been actively researched. Research has been carried out on the biomimetic piezoelectric thin film ABM (Artificial Basilar Membrane) in particular. In an effort to improve the frequency separation performance of the existing piezoelectric thin film ABM, this paper presents the design, fabrication, and characterization of the production and performance of a partially etched-type ABM material. $O_2$ plasma etching equipment was used to partially etch a piezoelectric thin film ABM to make it more flexible. The mechanical-behavior characterization of the manufactured partially etched-type ABM showed that the overall separation frequency range shifted to a lower frequency range more suitable for audible frequency bandwidths and it displayed an improved frequency separation performance. In addition, the maximum magnitude of the vibration displacement at the first local resonant frequency was enhanced by three times from 38 nm to 112 nm. It is expected that the newly designed, partially etched-type ABM will improve the issue of cross-talk between nearby electrodes and that the manufactured partially etched-type ABM will be utilized for next-generation ABM research.