• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.59-61
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• 2002

In this study we attempted to diagnose the distribution of nitrogen plasma density generated using PECVD(plasma enhanced chemical vapor deposition). The distribution of plasma density formed in a PECVD chamber were measured by DLP2000. The experiment results showed that the plasma density is related to RF power and gas flow rate. As RF power gets higher, the plasma density linearly increased. And the experimental results revealed that a pressure in chamber affects plasma density.

• Proceedings of the IEEK Conference
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• 1998.06a
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• pp.339-342
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• 1998

Plasma etching of photoresist needs high etch rate, good uniformity and rae, good uniformity and low damage in low cost. ICP asher is expected to satisfy these requriement for next eneration semiconductor devices. ICPsimulator has been used to design the ashing chamber to redcue the development time and cost, and its results have been verified by QMS, OES and langmuir probe measurments. Plasma characteristics are monitored in terms of RF power and chamber pressure.

• Journal of Astronomy and Space Sciences
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• v.34 no.4
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• pp.343-352
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• 2017

A space plasma facility has been operated with a back-diffusion-type plasma source installed in a mid-sized vacuum chamber with a diameter of ~1.5 m located in Satellite Technology Research Center (SaTReC), Korea Advanced Institute of Science and Technology (KAIST). To generate plasma with a temperature and density similar to the ionospheric plasma, nickel wires coated with carbonate solution were used as filaments that emit thermal electrons, and the accelerated thermal electrons emitted from the heated wires collide with the neutral gas to form plasma inside the chamber. By using a disk-type Langmuir probe installed inside the vacuum chamber, the generation of plasma similar to the space environment was validated. The characteristics of the plasma according to the grid and plate anode voltages were investigated. The grid voltage of the plasma source is realized as a suitable parameter for manipulating the electron density, while the plate voltage is suitable for adjusting the electron temperature. A simple physical model based on the collision cross-section of electron impact on nitrogen molecule was established to explain the plasma generation mechanism.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.38-44
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• 2022

Plasma density in semiconductor fabrication equipment becomes higher to achieve the improved the throughput of the process, but the increase of surface corrosion of the ceramic coated chamber wall has been observed by the increased plasma density. Plasma chamber wall coating with aerosol deposition prefer to be firm and uniform to prevent the potential creation of particle inside the chamber from the deformation of the coating materials, and the aerosol discharge nozzle is a good control factor for the deposited coating condition. In this paper, we investigated the design of the nozzle of the aerosol deposition to form a high-quality coating film. Computational fluid dynamics (CFD) study was employed to minimize boundary layer effect and shock wave. The degree of expansion, and design of simulation approach was applied to found out the relationship between the divergence angle and nozzle length as the key parameter for the nozzle design. We found that the trade-off tendency between divergence angle and nozzle length through simulation and quantitative analysis, and present the direction of nozzle design that can improve the uniformity of chamber wall coating.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.324-325
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• 2008

In this Study, We fabricated a plasma discharge cluster with external electrodes which can be applied to flexible backlight in a polymer substrate and investigated the discharge characteristics. The Sealing process was progressed in vacuum chamber, which enable to fabricate plasma discharge cluster. The results of discharge characteristics show that the static memory margin of plasma discharge cluster was increased, as Ne/Xe(5%) gas pressure was increased. also, When gas pressure was 100torr at 600um of electrode gap, we have obtained high luminance of a plasma discharge cluster.

• Journal of the Korean institute of surface engineering
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• v.32 no.4
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• pp.513-520
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• 1999

In this study, we investigated the effects of variously configured magnets on the characteristics of the plasmas to enhance plasma uniformity and density of an inductively coupled plasma source. As the magnets, Helmholtz type axial electromagnets and various multi-dipole magnets types around the chamber wall were used. To characterize the plasma as a function of the combination of the magnets and magnetic field strengths, ion density, electron temperature, and plasma potential were measured using an electrostatic probe along the chamber diameter for Ar plasmas. The measured maximum ion densities were $8$\times$10^{ 11}$$cm^{-3}$ with 600W inductive power and at 5mTorr of operational pressure and the uniformity of ion density was less than 5.9% at 2mTorr of operational pressure. The combination of an optimized multi-dipole magnet type and an axial electromagnet showed the lowest electron temperature (3eV) and plasma potential ($34V{p}$ )

• International Journal of Automotive Technology
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• v.3 no.1
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• pp.9-16
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• 2002

In plasma jet ignition, combustion enhancement effects occur toward the plasma jet issuing direction. Therefore, when the igniter is attached at the center of a cylindrically shaped combustion chamber, plasma jet should issue toward the round combustion chamber wall. The plasma jet igniter that had an annular circular orifice has been developed. The purpose of this study is to elucidate the relationship between the newly developed plasma Jet igniter configuration and combustion enhancement effects. In this newly developed plasma Jet igniter, flame front wrinkle appears on the flame front and flame propagates rapidly. Plasma Jet influences on the flame propagation far long period when the plasma jet igniter has issuing angle 90 degrees and large cavity volume, because the plasma jet only lasts several ms. However, in the early stage of combustion, flame front area of issuing angle 45 degrees is larger than that of 90 degrees, because the initial flame kernel is formed by the plasma jet.

• Journal of the Korean institute of surface engineering
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• v.36 no.1
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• pp.69-73
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• 2003

The atmospheric pressure plasma is regarded as an effective method for surface treatments because it can reduce the period of process and doesn't need expensive vacuum apparatus. The performance of non-transferred plasma torches is significantly depended on jet flow characteristics out of the nozzle. In order to produce the high performance of a torch, the maximum discharge velocity near an annular gap in the torch should be maintained. Also, the compulsory swirl is being produced to gain the shape that can concentrate the plasma at the center of gas flow. In this work, the distribution of gas flow that goes out to atmosphere through a plenum chamber and nozzle is analyzed to evaluate the performance of atmospheric pressure plasma torch which can present the optimum design of the torch. Numerical analysis is carried out with various angles of an inlet flow velocity. Especially, three-dimensional model of the torch is investigated to estimate swirl effect. We also investigate the stabilization of plasma distribution. For analyzing the swirl in the plenum chamber and the flow distribution, FVM (finite volume method) and SIMPLE algorithm are used for solving the governing equations. The standard k-model is used for simulating the turbulence.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.196.1-196.1
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• 2013

반도체의 device design rule이 shrink 됨에 따라 공정이 난이도가 높아지고 이에 따른 관리가 어려워지고 있다. 특히 미세 particle에 대한 제어의 필요성은 보다 커졌다. 진공 chamber 발생하는 미세 particle의 주요 원인으로는 공정 중 발생한 polymer, chamber 내 부품의 식각 및 스퍼터링에 의한 부산물 등이 있다. Plasma 공정 도중 발생한 particle은 plasma 내 전자에 의해 대전되어 음의 전하량을 가지게 된다. 음의 전하량을 가진 particle은 plasma와 wafer의 경계면에서 형성되는 sheath 때문에 wafer에 도달하지 못하고 plasma 내에 부유하게 된다. 이러한 particle은 plasma가 꺼지게 되면 sheath가 사라지면서 wafer에 도달하게 되고 wafer의 오염을 유발하게 되고 생산 수율을 저하시키는 요인이 된다. 이러한 이유로 최근 plasma 공정에서는 공정 중 발생하는 부유성 particle에 대한 관리가 중요해졌다. 이를 관리하기 위해 plasma를 끄기 전 부유성 particle을 제거하는 방안을 고안하고 평가를 진행하였다. 공정이 끝나고 plasma가 꺼지기 전 plasma를 유지하여 부유성 particle이 wafer에 도달하지 못하는 상태에서 gas purge를 실시한다. 이러한 과정 후 plasma를 끄게 되면 부유성 particle이 wafer에 도달하는 것을 감소시키게 된다. 이번 평가를 통해 부유성 particle에 대해서 대략 20%의 감소 효과를 볼 수 있었다. 이를 토대로 향후 조건 최적화 후 적용 시 particle 감소뿐 만 아니라 수율 향상에도 기여할 수 있을 것이라 기대된다.

• Journal of the Korean Vacuum Society
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• v.19 no.3
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• pp.190-198
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• 2010

Asymmetric model for plasma uniformity by Ar and $CF_4$ was modeled by the antenna structure, the diameter of chamber, and the distance between source and substrate for the development of plasma equipment for 450 mm wafer. The aspect ratio of chamber was divided by diameter, distance from substrate, and pumping port area. And we found the condition with the optimized plasma uniformity by changing the antenna structure. The drift diffusion and quasi-neutrality for simplification were used, and the ion energy function was activated for the surface recombination and etching reaction. The uniformity of plasma density on substrate surface was improved by being far of the distance between substrate wall and chamber wall, and substrate and plasma source. And when the antenna of only 2 turns was used, the plasma uniformity can improve from 20~30% to 4.7%.