• 한국전자파학회논문지
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• 제25권5호
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• pp.515-525
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• 2014

본 논문에서는 저 위상잡음을 갖는 전압 제어 평판형 복합공진기 발진기(Vt-PCRO: Voltage-tuned Planar Composite Resonator Oscillator)를 설계, 제작하였다. 설계된 발진기는 공진기, 2개의 위상천이기, 증폭기로 구성된다. 공진기는 dual mode SIW(Substrate Integrated Waveguide) 공진기를 이용하여 구성하였으며, 약 40 nsec의 높은 군지연을 갖도록 하였다. 2개의 위상천이기 중(PS1, PS2: Phase Shifter 1 및 Phase Shifter 2) PS1은 $360^{\circ}$의 위상천이량을 가지며, 제작된 발진기의 전송선로 길이에 관계없이 개루프 이득(open loop gain) 발진조건을 만족하도록 한다. PS2는 약 $70^{\circ}$의 위상천이량을 가지며 발진 주파수 조정용으로 사용된다. 증폭기는 제작 시 발생한 큰 삽입손실의 문제를 보완하기 위해 2단으로 구성하였다. 개루프 이득 측정을 통해 발진 조건을 만족하는 PS1의 전압을 측정한 뒤, 폐루프로 구성하여 발진기를 구현하였다. 발진기 측정 결과, 5.345 GHz의 발진 주파수에서, 위상 잡음은 100 kHz offset 주파수에서 -130.5 dBc/Hz를 얻었다. 이때 출력 전력은 약 3.5 dBm, 전기적 주파수 조정 범위는 0~10 V의 조정 전압에서 약 4.2 MHz를 보였다.

• 마이크로전자및패키징학회지
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• 제31권1호
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• pp.29-34
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• 2024

전류가 전도체를 통과할 때 발생하는 줄 열을 이용한 발열체는 자동차 창유리, 고속열차 창유리 및 태양전지와 같은 다양한 산업 분야에서 수분 제거 등을 위해 널리 연구되고 개발되고 있고, 최근에는 기계적 변형 조건 하에서도 안정적인 가열을 유지할 수 있는 유연 발열체를 개발하기 위하여 여러 나노 구조의 발열체를 이용한 연구가 활발하게 진행중이다. 본 연구에서는 유연성이 우수한 폴리우레탄을 기판으로 선정하고 마그네트론 스퍼터링을 이용하여 낮은 전기비저항(1.6 μΩ-cm)을 가지는 은 (Ag) 박막을 형성하여 발열층으로 이용한 연구를 진행하였다. 2D 박막구조에서의 전면발열에 의하여 열응답속도가 매우 높아 목표 온도의 95%까지 20초 이내에 도달하였으며 우수한 발열재현성을 보여주었다. 또한 기계적 변형이 가해지는 환경에서도 우수한 발열특성이 유지되었으며 반복적인 굽힘 테스트 (10,000회, 곡률반경 5 mm 기준)에서도 3% 이내의 전기저항 증가만이 발생할 정도로 우수한 유연성을 보유하여, 폴리우레탄/은 구조의 면상발열체는 굴곡진 형태를 가진 다양한 기기에서부터 인체분위와 같이 다양한 응력이 가해지는 환경에서 사용할 수 있는 플렉서블/웨어러블 면상발열체로의 적용이 매우 유망하다는 것을 보여준다. 또한 증착된 은 박막 발열 층 구조는 다양한 목적을 위한 기능을 추가하여 다양한 분야에서 사용할 수 있는 플렉서블/웨어러블 발열체로서의 적용 가능성을 보여줍니다.

• 한국전자파학회논문지
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• 제25권3호
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• pp.339-347
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• 2014

본 논문에서는 유연성 기판을 이용한 새로운 광대역 메타물질 구조의 흡수체를 제안하였다. 제안된 메타 물질 구조의 단위 셀은 유연성 있는 폴리이미드 기판 위의 동일 평면상에 놓여진 ELC 공진기와 cut-wire 구조로 이루어졌으며, 설계 주파수 대역 밖에서 레이더 단면적(RCS) 값을 감소시키기 위하여 제안된 구조의 금속 패턴 층은 입사 전자파의 진행 방향과 평행하게 놓았다. 총 $33{\times}45$개의 단위 셀들의 배열로 이루어진 흡수체 시작품을 제작하고, 측정한 결과, 주파수 9.06 및 15.0 GHz에서 각각 92 % 및 93 % 이상의 최대 흡수율과 75 %의 full-width at half-maximum 대역폭을 나타내었다. 제안된 금속 접지 판이 없는 메타물질 구조는 마이크로파 주파수대 광대역 흡수체로 곡면 구조에도 응용이 가능하다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.389-389
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• 2012

Molybdenum is one of the most important materials used as a back ohmic contact for $Cu(In,Ga)(Se,S)_2$ (CIGS) solar cells because it has good electrical properties as an inert and mechanically durable substrate during the absorber film growth. Sputter deposition is the common deposition process for Mo thin films. Molybdenum thin films were deposited on soda lime glass (SLG) substrates using direct-current planar magnetron sputtering technique. The outdiffusion of Na from the SLG through the Mo film to the CIGS based solar cell, also plays an important role in enhancing the device electrical properties and its performance. The structure, surface morphology and electrical characteristics of Mo thin films are generally dependent on deposition parameters such as DC power, pressure, distance between target and substrate, and deposition temperature. The aim of the present study is to show the resistivity of Mo layers, their crystallinity and morphologies, which are influenced by the substrate temperature. The thickness of Mo films is measured by Tencor-P1 profiler. The crystal structures are analyzed using X-ray diffraction (XRD: X'Pert MPD PRO / Philips). The resistivity of Mo thin films was measured by Hall effect measurement system (HMS-3000/0.55T). The surface morphology and grain shape of the films were examined by field emission scanning electron microscopy (FESEM: Hitachi S-4300). The chemical composition of the films was obtained by the energy dispersive X-ray spectroscopy (EDX). Finally the optimum substrate temperature as well as deposition conditions for Mo thin films will be developed.

• 한국재료학회지
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• 제30권7호
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• pp.350-358
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• 2020

A variety of composite powders having different aluminum and carbon contents are prepared using various organic solvents having different amounts of carbon atoms in unit volume as ball milling agents for titanium and aluminum ball milling. The effects of substrate temperature and post-heat treatment on the texture and hardness of the coating are investigated by spraying with this reduced pressure plasma spray. The aluminum part of the composite powder evaporates during spraying, so that the film aluminum content is 30.9 mass%~37.4 mass% and the carbon content is 0.64 mass%~1.69 mass%. The main constituent phase of the coating formed on the water-cooled substrate is a non-planar α₂ phase, obtained by supersaturated carbon regardless of the alloy composition. When these films are heat-treated at 1123 K, the main constituent phase becomes γ phase, and fine Ti₂AlC precipitates to increase the film hardness. However, when heat treatment is performed at a higher temperature, the hardness is lowered. The main constitutional phase of the coating formed on the preheated substrate is an equilibrium gamma phase, and fine Ti₂AlC precipitates. The hardness of this coating is much higher than the hardness of the coating in the sprayed state formed on the water-cooled substrate. When hot pressing is applied to the coating, the porosity decreases but hardness also decreases because Ti₂AlC grows. The amount of Ti₂AlC in the hot-pressed film is 4.9 vol% to 15.3 vol%, depending on the carbon content of the film.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.618-618
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• 2013

Graphene is only one atom thick planar sheet of sp2-bonded carbon atoms arranged in a honeycomb crystal lattice, which has flexible and transparent characteristics with extremely high mobility. These noteworthy properties of graphene have given various applicable opportunities as electrode and/or channel for various flexible devices via suitable physical and chemical modifications. In this work, for the development of all-graphene devices, we performed to synthesize alternately patterned structure of mono- and multi-layer graphene by using the patterned Ni film on Cu foil, having much different carbon solid solubilities. Depending on the process temperature, Ni film thickness, introducing occasion of methane and gas ratio of CH4/H2, the thickness and width of the multi-layer graphene were considerably changed, while the formation of monolayer graphene on just Cu foil was not seriously influenced. Based on the alternately patterned structure of mono- and multi-layer graphene as a channel and electrode, respectively, the flexible TFT (thin film transistor) on SiO2/Si substrate was fabricated by simple transfer and O2 plasma etching process, and the I-V characteristics were measured. As comparing the change of resistance for bending radius and the stability for a various number of repeated bending, we could confirm that multi-layer graphene electrode is better than Au/Ti electrode for flexible applications.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2003년도 하계종합학술대회 논문집 II
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• pp.1125-1128
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• 2003

This paper presents the design method of a Colpitts type oscillator with coplanar waveguide(CPW) structures in the range of Ka-band frequency for transmitter and receiver modules. Series short stubs of CPW patterns provide inductances and capacitances in the range of Ka-band which can be expressed as a CLC-$\pi$ equivalent circuit. The experimentation has employed ro4003 substrates as a CPW substrate which has a dielectric constant of 3.38 and a signal and ground space of 100um. A method of momentum simulation for the CPW patterns has performed with an ADS software tool of Hewlett-Packard Corp. Inductance and capacitance circuits of a Colpitts oscillator was interconnected to a MESFET with CPW bend structures of including the input and output impedance matching circuits of the active transistor. Circuit parameters for impedance matching were determined through the network conversion to the equivalent length of CPW transmission lines by using T-network 1 $\pi$-network conversion circuit. A Colpitts oscillator was fabricated on the substrate of a area of 8.5mm x 17.4mm with a MESFET of Fujitsu FMM5704X and CPW series short stubs. The design suggested the possibility of realizing oscillators on a planar surface for the wireless system of tansmitter and receiver modules in the frequency range of 30GHz

• BMB Reports
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• 제38권5호
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• pp.517-525
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• 2005

Solid phase peptide synthesis method, which was introduced by Merrifield in 1963, has spawned the concept of combinatorial chemistry. In this review, we summarize the present technologies of solid phase peptide synthesis (SPPS) that are related to combinatorial chemistry. The conventional methods of peptide library synthesis on polymer support are parallel synthesis, split and mix synthesis and reagent mixture synthesis. Combining surface chemistry with the recent technology of microelectronic semiconductor fabrication system, the peptide microarray synthesis methods on a planar solid support are developed, which leads to spatially addressable peptide library. There are two kinds of peptide microarray synthesis methodologies: pre-synthesized peptide immobilization onto a glass or membrane substrate and in situ peptide synthesis by a photolithography or the SPOT method. This review also discusses the application of peptide libraries for high-throughput bioassays, for example, peptide ligand screening for antibody or cell signaling, enzyme substrate and inhibitor screening as well as other applications.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1572-1575
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• 1996

A new type $Cu_{x}N/Cu/Cu_{x}N$ thin film electrode material with high adhesion to glass was developed by the dc reactive planar magnetron sputtering system for the PDP(Plasma Display Panel). The adhesive force of the $Cu_{x}N$ thin film was in the range of $20{\sim}40(N)$ under the conditions of the $N_2$ partial pressure of 15%, discharge current of 70mA, discharge voltage of 450V and substrate bias voltage of -100V. The adhesive force was depended on the $N_2$ partial pressure, discharge current and substrate bias voltage.

• 한국정밀공학회지
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• 제31권6호
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• pp.469-475
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• 2014

The roll to roll (RTR) imprint process is an integrated imprinting process where steps ranging from assignment of a function to a flexible rolled substrate to rewinding of the same substrate in a roll are performed. RTR imprint is a green, low-cost technology without limitations. In RTR imprint, it is important to manufacture the mold precisely and maintain uniform process condition. To this, process conditions have to include precision tension control, optimization of process parameters. We introduced RTR imprint to fabricate planar lightwave circuit (PLC) device for communication, by new schematic design and process optimization, we fabricated successfully optical device. The fabricated optical device showed the optical performance which was satisfied to meet international standard.