• Journal of Ocean Engineering and Technology
• /
• v.25 no.6
• /
• pp.105-109
• /
• 2011

As is well appreciated, welding is the most important fundamental process in manufacturing marine structures. However, weld-induced deformation is inevitable because of the non-uniform distribution of temperature during welding. The deformation caused by welding is one of the principal obstacles in enhancing the productivity in the manufacturing procedure for marine structures. This should be much more seriously considered in the case of the thin blocks found in a ship with multi-deck structures. This paper is concerned with the deformation control of thin panel blocks by applying intermittent welding to fillet welding. In order to investigate the quantitative effect of the intermittent welding, a thermo elasto-plastic analysis was carried out with various welding pitches and plate thicknesses. Welding tests were also carried out to show the validity of the present thermo-elasto-plastic analysis. Numerical analysis results showed good agreement with those of the welding tests. As far as the present numerical results are concerned, it has been seen that a more than 50% reduction in angular distortion can be achieved by applying the intermittent welding because of the low heat input.

• Proceedings of the KIEE Conference
• /
• 2005.07d
• /
• pp.2643-2645
• /
• 2005

The power source of inverter welder stable power of low voltage and high current. Because if shouldn't be, it is caused to spark between the parent metal and the peak. So that, we designed to be base on high frequency transformer and reactor of DC part. Then, we optimized control of PWM, current rising slant, voltage, current, pulse current and inverter out-put voltage. Also we designed PCB for EMI and noises.

• Journal of the Microelectronics and Packaging Society
• /
• v.22 no.1
• /
• pp.69-74
• /
• 2015

With difficulties during the cleaning of reflow flux residues due to the decrease of the part size and interconnection pitch in the advanced electronic devices, the need for the no-clean solder paste is increasing. In this study, an epoxy curable solder paste was made with SAC305 solder powder and the curable flux of which the main ingredient is epoxy resin and its reflow solderability, flux residue corrosivity and solder joint mechanical properties was investigated with comparison to the commercial rosin type solder paste. The fillet shape of the cured product around the reflowed solder joint revealed that the curing reaction occurred following the fluxing reaction and solder joint formation. The copper plate solderability test result also revealed that the wettability of the epoxy curable solder paste was comparable to those of the commercial rosin type solder pastes. In the highly accelerated temperature and humidity test, the cured product residue of the curable solder paste showed no corrosion of copper plate. From FT-IR analysis, it was considered to be resulted from the formation of tight bond through epoxy curing reaction. Ball shear, ball pull and die shear tests revealed that the adhesive bonding was formed with the solder surface and the increase of die shear strength of about 15~40% was achieved. It was considered that the epoxy curable solder paste could contribute to the improvement of the package reliability as well as the removal of the flux residue cleaning process.