• Phonetics and Speech Sciences
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• v.14 no.3
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• pp.27-40
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• 2022

This study identifies distinguishing features and variability of intonation patterns in Korean phonological phrases. Syllable count and segmental content, which are phonological conditions, of the intonation of phonological phrases were examined. Based on the four syllables, the intonation of a phonological phrase can be set to LHLH as the basic form, and syllable count acts as a condition for making a variation. The "3 syllables or less condition" changes the intonation from a curved line to a straight line. Variation occurs in pitch bandwidth and fluctuation according to segmental content. The first segment affects the phonological phrase formation bandwidth, and the following segment affects the pitch fluctuation. If the first segment has [+aspirate], [+tense], [+continuant], the intonation is formed in the high band, otherwise, it is formed in the low band. If the second or after segment in the intonation realized in the high band has [-aspirate], [-tense], [-continuant], the pitch is lowered to the lowest level of the low bandwidth. In the intonation realized in the low band, [+aspirate], [+tense], [+continuant] is blocked by the second descent of LHLH.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.1-6
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• 2014

The demand for fine-pitch devices is increasing due to an increase in I/O pin count, a reduction in power consumption, and a miniaturization of chip and package. In addition non-scalability of Cu pillar/Sn cap or Pb-free solder structure for fine-pitch interconnection leads to the development of bumpless interconnection system. Few bumpless interconnect systems such as BBUL technology, SAB technology, SAM technology, Cu-toCu thermocompression technology, and WOW's bumpless technology using an adhesive have been reviewed in this paper: The key requirements for Cu bumpless technology are the planarization, contamination-free surface, and surface activation.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.2
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• pp.37-42
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• 2001

The BGA package has been the area array package of choice for several years. Recently, the transition has been to finer pitch configurations called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch. requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and place equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.27-34
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• 2001

The BGA Package has been the area array package of choice for several rears. Recently, the transition has been to finer pitch configuration called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch, requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and piece equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.109-119
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• 2003

o In order to start SIP Project .Marketing (& ASIC team) should present biz planning, schedule, device/SIP specs., in SIP TFT prior to request SIP development for package development project. .In order to prevent (PCB) revision, test, burn-in, & quality strategy should be fixed by SIP TFT (PE/Test, QA) prior to request for PKG development. .Target product price/cost, package/ test cost should be delivered and reviewed. o Minimum Information for PCB Design, Package Size, and Cost .(Required) package form factor: size, height, type (BGA, QFP), Pin count/pitch .(Estimated) each die size including scribe lane .(Estimated) pad inform. : count, pitch, configuration(in-line/staggered), (open) size .(Estimated) each device (I/O & Core) power (especially for DRAM embedded SIP) .SIP Block diagram, and net-list using excel sheet format o Why is the initial evaluation important\ulcorner .The higher logic power resulted in spec. over of DRAM Tjmax. This caused business drop longrightarrow Thermal simulation of some SIP product is essential in the beginning stage of SIP business planning (or design) stage. (i.e., DRAM embedded SIP) .When SIP is developed using discrete packages, the I/O driver Capa. of each device may be so high for SIP. Since I/O driver capa. was optimized to discrete package and set board environment, this resulted in severe noise problem in SIP. longrightarrow In this case, the electrical performance of product (including PKG) should have been considered (simulated) in the beginning stage of business planning (or design).

• Journal of Broadcast Engineering
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• v.26 no.7
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• pp.838-843
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• 2021

This paper presents an algorithm for effective retrieval of score information to an input score image. The originality of the proposed algorithm is that it is designed to be robust to recognition errors by an OMR (Optical Music Recognition), while existing methods such as pitch histogram requires error induced OMR result be corrected before retrieval process. This approach helps people to retrieve score without training on music score for error correction. OMR takes a score image as input, recognizes musical symbols, and produces structural symbolic notation of the score as output, for example, in MusicXML format. Among the musical symbols on a score, it is observed that filled noteheads are rarely detected with errors with its simple black filled round shape for OMR processing. Barlines that separate measures also strong to OMR errors with its long uniform length vertical line characteristic. The proposed algorithm consists of a descriptor for a score and a similarity measure between a query score and a reference score. The descriptor is based on note-count, the number of filled noteheads in a measure. Each part of a score is represented by a sequence of note-count numbers. The descriptor is an n-gram sequence of the note-count sequence. Simulation results show that the proposed algorithm works successfully to a certain degree in score image-based retrieval for an erroneous OMR output.

• Journal of the Korean Society for Nondestructive Testing
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• v.10 no.1
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• pp.65-72
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• 1990

Comparison of acoustic emission, ultrasonic testing and crack gauge in 3-point bending testing have been studied. As the results, COD is indirectly assumed by strain gauge rate and grid pitch width when crack gauge grid is out. Acoustic emission is qualitatively able to measure crack growth by total count but ultrasonic testing has a difficulty in measuring it because of echo height fluctuation according to the change and pressure of UT. probe.

• Clinics in Shoulder and Elbow
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• v.19 no.1
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• pp.15-19
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• 2016

Background: To investigate how many rookie pitchers suffered from injuries while playing in the amateur league without guidelines for prevention of excessive pitching, we analyzed their amateur pitching patterns based on the pitch count, use of breaking balls, and pitches during winter camp. Methods: Forty-one rookie pitchers who graduated from high school or university in 2013 and joined professional baseball teams. Participants were interviewed by a trainer using our questionnaire. Injury inclusion criteria were 1) history of shoulder surgery, 2) history of elbow surgery, 3) shoulder pain requiring treatment, and 4) elbow pain requiring treatment. Results: Mean number of pitches per game and warm-up pitches for practice was 84.5 pitches (range, 15 to 130 pitches) and 16.4 pitches (range, 2 to 210 pitches), respectively. Mean number of pitches during the last year was 906.9 (range, 80 to 2,000). Mean number of maximal pitches was 127 pitches (range, 50 to 210 pitches). Fourteen pitchers had pitched over 150 pitches. Twenty-seven pitchers (65.9%) had pitched in spite of enduring pain. During winter training (mean 1.8 months), mean number of pitches per day was 162.5 pitches, and 20 pitchers (48.8%) had practiced pitching excessively despite the cold weather. Twenty-six rookies (63.4%) had shoulder pain or history of shoulder surgery, and 31 pitchers (75.6%) had elbow pain or history of elbow surgery. Only four participants (9.8%) did not have pain and history of surgery. Conclusions: For young baseball pitchers, guidelines for prevention of excessive pitching and for regulating the winter training program may be needed.

• Proceedings of the KSME Conference
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• 2001.11b
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• pp.610-615
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• 2001

Effects of rotor-stator blade count ratio on the unsteady aerodynamic characteristics of a cascade was studied by using a Navier-Stokes code. Present Navier-Stokes code is a parallel code and works on a multi-cpu machine. It is based on the SIMPLE algorithm and uses QUICK scheme for convection terms and second order back difference for all temporal derivatives. Computations were carried out for two cases : case 1 is for 3 stator cascade passages subjected to two upstream wakes while case 2 is for 2 stator cascade passages subjected to three upstream wakes. Numerical solutions show that rotor-stator blade count ratio plays a significant role in the unsteady aerodynamic characteristics of the stator cascade. Case 2 shows smaller unsteady fluctuation than case 1, even if they show the same time averaged value. The smaller fluctuation of case 2 is believed due to strong interaction between unsteady vortices. The unsteady lift variation of case 2 is shown to have many high frequency fluctuations as more unsteady vortices travel around the cascade. The unsteady turbulent kinetic energy due to the upstream wake is also shown to decay faster through the cascade passage than in the free stream.

• Journal of the Korean Society of Radiology
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• v.1 no.3
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• pp.17-21
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• 2007

We describe recent observations and measurements realized with microdot (MDOT) detectors having 50 mm, 100 mm, and 200 mm pitches for 3.7 keV X-rays. A gas gain of $3.1{\times}10^3$ has been measured with 50 mm pitch MDOT at potential difference much lower than those usually obtained with MSGCs. The defocusing effect caused by the existence of the readout lines passing below the insulator layer has been investigated from the drift voltage dependence of the count rate variation and the electric field simulation for all the detectors. Results concerning the spatial resolutions are presented with collimated X-ray beams.