• Title/Summary/Keyword: Pin-By-Pin Analysis

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Case Study on the Firing Pin Fatigue Destruction of the Korean Rifle by Repeated Impact (반복충격에 의한 한국형 소총의 공이 피로파괴 사례 연구)

  • Lee, Ho-Jun;Choi, Si-Young;Shin, Tae-Sung;Seo, Hyun-Su
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.21 no.5
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    • pp.648-655
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    • 2020
  • The firing pin of modern automatic rifles detonates the primer of loaded ammunition via a hammer. During this process, the firing pin receives an impact load and repetitive force throughout the life of the rifle. An endurance test of a rifle showed that the firing pin breaks prematurely at 96.26% of life. Accordingly, a case study was conducted through cause analysis and a reconstruction test. Optical microscopy and scanning electron microscopy of the broken surface of the firing pin showed that a crack began in the circumferential direction of the surface, resulting in a fatigue crack to the core after repeated impact. Crack growth and fatigue destruction occurred at the end due to the repetitive impact and was estimated using a notch. For verification, a sample that produced a 0.03mm circumferential notch was broken at 64.25% of life in the reconstruction test. A test of breakage according to the notch types showed that a 0.3mm and a 0.5mm one-side notch were broken at 66.53% and 50.76%, respectively, and a 0.03mm six-point notch was broken at 85.65%. The endurance life of a sample firing pin with a rough surface and tool mark was examined, but an approximately 381 ㎛ internal crack formed. Through this study, failure for each notch type was considered. These results show that quality control of the notch and surface roughness is essential for ensuring the reliability of a component subjected to repeated impact.

Structural Analysis of Damping Hinge for Built-in Side-by-Side Refrigerator and Design Improvement of Bracket Pin to Reduce Stress Concentration (빌트인 양문형 냉장고 댐핑힌지의 구조해석 및 브래킷핀의 응력집중 저감을 위한 설계개선)

  • Lee, Boo-Youn
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.21 no.1
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    • pp.373-379
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    • 2020
  • This study performed stress and fatigue life analysis of the damping hinge of a built-in side-by-side refrigerator that occurs when the door is opened to the maximum angle. An analysis of the initial design showed that stress concentration occurred at the corner between the cylinder and upper disk of the bracket pin, and the maximum stress exceeded the yield strength. The maximum stress location and the calculated fatigue life were consistent with the door opening-and-closing endurance test results for a prototype. Three cases of design improvement for the bracket pin were derived with the aim of reducing the stress concentration that appeared in the initial design. An analysis of the cases showed that inserting a fillet between the disk and the cylinder of the bracket pin reduced the stress and increased the fatigue life. Moreover, changing the disk into two steps was more favorable. In conclusion, the best design improvement was the case that the disk was changed to two steps and the fillet with a large radius was inserted. In that case, the stress was the smallest and the fatigue life was infinite.

Conditions for Assuming Hertzian Stress for the Contact between a Circular Pin and Hole (원형 핀과 구멍의 접촉에서 헤르츠 응력장 가정을 위한 조건)

  • Kim, Hyung-Kyu
    • Tribology and Lubricants
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    • v.31 no.5
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    • pp.189-194
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    • 2015
  • This paper focuses on the conformal contact problem. A typical example of conformal contact is the contact between a pin and hole. In particular, this paper focuses on the condition for assuming a contact stress field to be a Hertzian pressure profile by using well-known classical solutions associated with Hertzian contact. Persson first developed the conformal contact analysis method around half a century ago, but there have been no significant improvements since then. The present research also adopted this method, but developed new solutions from the viewpoint of application to structural design. The analysis began with a comparison between Persson°Øs conformal contact stress and the Hertzian stress fields. The next step was to check the differences in the normalized stress values of both. This study used the tolerance for the difference in the peak stresses of Persson°Øs solution and the Hertz solution to validate the Hertzian assumption. This gave the range for the difference in radii of the pin and hole when the contact force and mechanical properties of the material are specified. The results showed that, at a tolerance of 5%, the Hertzian assumption is valid if half of the contact angle is less than 35°ý. In addition, the Hertzian assumption holds even for a relatively long contact length, in contrast to the general incomplete contact problem. This paper discusses these results along with other aspects of the application to the design.

Design of Heavy Weight Door Hinge for Built-in Appliances (빌트인 가전기기용 고 중량 도어힌지의 설계에 관한 연구)

  • Choi, Seong-Dae;Byn, Yong-Kun;Kim, Gi-Man
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.20 no.7
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    • pp.41-47
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    • 2021
  • In this study, the hinges of heavy weight doors were designed and analyzed in line with the trend that built-in appliances are becoming larger and the weight of doors is also increasing. The main specification of the heavy weight door hinge is to allow the deflection at the end of the door to be less than 2 mm when opening and closing, including the automatic closing, slow closing, and closing force control functions. The structural analysis of the design mechanism, component design, and methods for improving the deflection are as follows: 1) Mechanism of the automatic closing function should sense automatically using the spring compression force at a specific angle by the contact between the cam and the cam module roller. 2) Through structural analysis, the maximum stress of the door was found in the link pin hole connected to the pin at each link. 3) Consequently, the pin holder was designed and applied, with little variance, but up to 93% of the specification limit.

Effect of Roundness Error of a Crank Pin Bearing for a Marine Engine on the Minimum Film Thickness (박용엔진 크랭크 핀 베어링의 형상오차가 최소유막두께에 미치는 영향)

  • Ha, Yang-Hyup;Shin, In-Dong;Lee, Sang-Min;Lee, Seung-Jun;Lee, Deug-Woo
    • Tribology and Lubricants
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    • v.27 no.5
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    • pp.256-263
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    • 2011
  • Bearings of marine engines are operated under severe conditions because of dynamic load and low sliding speed. This paper deals with lubrication analysis of a crank pin bearing for a marine diesel engine. Journal center locus and oil film thickness are compared of crank pin bearing. In the past researches, journal bearings have been studied only about the surface of bearing. In addition to this conventional research, this paper analyzes the effect of roundness error of a journal and a bearing on the minimum film thickness. Numerical analysis has been studied by using Reynolds equation and also Half-Sommerfeld condition is applied as boundary condition. Futhermore, this study investigates the effect of roundness error change on the minimum film thickness. The results demonstrate that the bigger amplitude of roundness error yields, the lower minimum oil film thickness is. In comparison to previous research considered a journal and a bearing individually, the results considering a journal and a bearing together show that amplitude of roundness error of journal has very little effect on the minimum oil film thickness.

Molecular mechanism underlying Arabidopsis root architecture changes in response to phosphate starvation

  • Chun, Hyun Jin;Lee, Su Hyeon;Kim, Min Chul
    • Proceedings of the Korean Society of Crop Science Conference
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    • 2017.06a
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    • pp.174-174
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    • 2017
  • To cope with phosphate (Pi) deficient stress, plants modulate various physiological and developmental processes, such as gene expression, Pi uptake and translocation, and root architecture changes. Here, we report the identification and characterization of novel activation-tagged mutant involved in Pi starvation signaling in Arabidopsis. The hpd (${\underline{h}ypersensitive}$ to ${\underline{P}i}$ $ {\underline{d}eficiency}$) mutant exhibits enhanced phosphate uptake and altered root architectural change under Pi starvation compared to wild type. Expression analysis of auxin-responsive DR5::GUS reporter gene in hpd mutant indicated that auxin translocation in roots under Pi starvation are suppressed in hpd mutant plants. Impaired auxin translocation in roots of hpd mutant was attributable to abnormal root architecture changes in Pi starvation conditions. Our results indicated that abnormal auxin translocation in hpd mutant might be due to mis-regulation of auxin efflux carrier proteins, PIN-FORMED (PIN) 1, and 2 under Pi starvation conditions. Not only expression levels but also expression domains of PIN proteins were altered in hpd mutant in response to Pi starvation. Molecular genetic analysis of hpd mutant revealed that the mutant phenotype is caused by the lesion in ENHANCED SILENCING PHENOTYPE4 (ESP4) gene whose function is proposed in mRNA 3'-end processing. The results suggest that mRNA processing plays crucial roles in Pi homeostasis as well as developmental reprograming in response to Pi deprivation in Arabidopsis.

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Analysis of the thermal-mechanical behavior of SFR fuel pins during fast unprotected transient overpower accidents using the GERMINAL fuel performance code

  • Vincent Dupont;Victor Blanc;Thierry Beck;Marc Lainet;Pierre Sciora
    • Nuclear Engineering and Technology
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    • v.56 no.3
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    • pp.973-979
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    • 2024
  • In the framework of the Generation IV research and development project, in which the French Commission of Alternative and Atomic Energies (CEA) is involved, a main objective for the design of Sodium-cooled Fast Reactor (SFR) is to meet the safety goals for severe accidents. Among the severe ones, the Unprotected Transient OverPower (UTOP) accidents can lead very quickly to a global melting of the core. UTOP accidents can be considered either as slow during a Control Rod Withdrawal (CRW) or as fast. The paper focuses on fast UTOP accidents, which occur in a few milliseconds, and three different scenarios are considered: rupture of the core support plate, uncontrolled passage of a gas bubble inside the core and core mechanical distortion such as a core flowering/compaction during an earthquake. Several levels and rates of reactivity insertions are also considered and the thermal-mechanical behavior of an ASTRID fuel pin from the ASTRID CFV core is simulated with the GERMINAL code. Two types of fuel pins are simulated, inner and outer core pins, and three different burn-up are considered. Moreover, the feedback from the CABRI programs on these type of transients is used in order to evaluate the failure mechanism in terms of kinetics of energy injection and fuel melting. The CABRI experiments complete the analysis made with GERMINAL calculations and have shown that three dominant mechanisms can be considered as responsible for pin failure or onset of pin degradation during ULOF/UTOP accident: molten cavity pressure loading, fuel-cladding mechanical interaction (FCMI) and fuel break-up. The study is one of the first step in fast UTOP accidents modelling with GERMINAL and it has shown that the code can already succeed in modelling these type of scenarios up to the sodium boiling point. The modeling of the radial propagation of the melting front, validated by comparison with CABRI tests, is already very efficient.

Paratic Impedance Extraction of FC-PGA Package Pin using the Static Fast Multipole Method (Static FMM을 이용한 FC-PGA 패키지 핀에서의 기생 임피던스 추출)

  • 천정남;이정태;어수지;김형동
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.12 no.7
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    • pp.1076-1085
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    • 2001
  • In this paper, the FMM(Fast Multipole Method) combined with GMRES(Generalized Minimal RESidual Method) matrix solver is used to extract the parasitic impedance for complicated 3-D structures in uniform dielectric materials which limit the use of MoM(Method of Moment) due to its large computation time and memory requirement. This algorithm is a fast multipole-accelerated method based on quasistatic analysis and is very efficient for computing impedance between conductors. This paper proved the accuracy and efficiency of the FMM by comparing with MoM in simple examples. Finally the parasitic impedance of FC-PGA(Flip Chip Pin Grid Array) Package pins has been extracted by this algorithm and we have considered the possibility of the EMI/EMC problem caused by the signal interference.

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Formation Mechanisms of Sn Oxide Films on Probe Pins Contacted with Pb-Free Solder Bumps (무연솔더 범프 접촉 탐침 핀의 Sn 산화막 형성 기제)

  • Bae, Kyoo-Sik
    • Korean Journal of Materials Research
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    • v.22 no.10
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    • pp.545-551
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    • 2012
  • In semiconductor manufacturing, the circuit integrity of packaged BGA devices is tested by measuring electrical resistance using test sockets. Test sockets have been reported to often fail earlier than the expected life-time due to high contact resistance. This has been attributed to the formation of Sn oxide films on the Au coating layer of the probe pins loaded on the socket. Similar to contact failure, and known as "fretting", this process widely occurs between two conductive surfaces due to the continual rupture and accumulation of oxide films. However, the failure mechanism at the probe pin differs from fretting. In this study, the microstructural processes and formation mechanisms of Sn oxide films developed on the probe pin surface were investigated. Failure analysis was conducted mainly by FIB-FESEM observations, along with EDX, AES, and XRD analyses. Soft and fresh Sn was found to be transferred repeatedly from the solder bump to the Au surface of the probe pins; it was then instantly oxidized to SnO. The $SnO_2$ phase is a more stable natural oxide, but SnO has been proved to grow on Sn thin film at low temperature (< $150^{\circ}C$). Further oxidation to $SnO_2$ is thought to be limited to 30%. The SnO film grew layer by layer up to 571 nm after testing of 50,500 cycles (1 nm/100 cycle). This resulted in the increase of contact resistance and thus of signal delay between the probe pin and the solder bump.

CAE Analysis of Powder Injection Molding Process for Dental Scaler Mold (치과용 스케일러 금형의 분말사출성형 CAE 해석설계)

  • Ko Y. B.;Park H. P.;Chung S. T.;Rhee B. O.;Hwang C. J.
    • Transactions of Materials Processing
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    • v.14 no.6 s.78
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    • pp.570-576
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    • 2005
  • Powder Injection Molding(PIM) has recently been recognized as an advanced manufacturing technology for low-cost mass production of metal or ceramic parts of complicated geometry With this regards, design technology of dental scaler tip PIM mold, which has complex shape and small core pin (diameter=0.6mm), with the help of computer-aided analysis of powder injection molding process was developed. Computer-aided analysis for dental scaler tip mold was implemented by finite element method with non-Newtonian fluid, modified Cross model viscosity, PvT data of powder/binder mixture. Compter-aided analysis results, such as filling pattern, weldline formation, air vent position prediction were compared with experimental result, and eventually have been shown good agreement. The core pin (diameter=0.6mm) deflection analysis of dental scaler tip PIM mold during PIM filling process was also investigated before mold fabrication.