• 마이크로전자및패키징학회지
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• 제8권2호
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• pp.37-42
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• 2001

The BGA package has been the area array package of choice for several years. Recently, the transition has been to finer pitch configurations called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch. requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and place equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• 한국치위생학회지
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• 제11권4호
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• pp.595-602
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• 2011

Objectives : This study purpose were the effect of toothbrushing for decreasing halitosis for gingivitis and periodontitis patients. Methods : The university staffs were examined oral condition and analysised a change of oral health state score after using 3 types of toothbrushing. Results : The results were as followed : OHI-S shows that the decreasing effect takes place in the M. bass method and Tooth pick method, but shows no differences by each method. GI for Self test method shows decreasing effect after 2nd week during education while the M. bass method and Tooth pick method shows after 1st week during education. The M. bass method shows much greater effect of halitosis amongst 3 kind of method. PI for Self test method and Tooth pick method show decreasing effect. Decreasing effect during education shows until 2nd week by 3 kind of method, but it shows no differences after 3rd week. VSC(ppb) for M. bass method and Tooth pick method show decreasing effect. Decreasing effect during education shows after 3rd week by 3 kind of method, but it shows no differences until 2nd week. PHP for Self test method, M. bass method and Tooth pick method show decreasing effect after 2nd week during education. But, there is no differences of decreasing effect by among 3 kind of method. Conclusions : This study reports that it is necessary to carry outt further studies on the improvement of oral health management of adults based on the development of oral health education.

• 대한기계학회논문집A
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• 제32권5호
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• pp.451-457
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• 2008

Flat Panel Display(FPD) is widely used a video display terminals to consumer products of LCD and PDP. The contamination and damage were affected by using the previous contact conveyor's method. In this paper, it analyzes the FPD deflection to develop the non-contact FPD transfer process using lift force. Each conveyor's equipment is called a horizontal conveyor, vertical conveyor and robot pick-up equipment. As result of an analysis of FPD panel's deflection, a robot pick-up equipment has performed according to under the present conditions like panel's weight and loaded glass to move FPD panel from one place to other places properly. Results of the analysis showed 0.474 mm, 0.424 mm and 1.237 mm. Those values are lower than a predicted optimum values : 2 mm for both horizontal and vertical conveyers; 5 mm for robot pick-up equipment. Therefore, those results verify each equipment have safety and reliability.

• Journal of Biosystems Engineering
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• 제38권2호
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• pp.138-148
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• 2013

Purpose: Determining an appropriate path is a top priority in order for a robot to maneuver in a dynamically efficient way especially in a pick-and-place task. In a non-standardized work environment, current robot arm executes its motion based on the kinematic displacements of joint variables, though resulting motion is not dynamically optimal. In this research we suggest analyzing and applying motion patterns of the human arm as an alternative to perform near optimum motion trajectory for arbitrary pick-and-place tasks. Methods: Since the motion of a human arm is very complicated and diverse, it was simplified into two links: one from the shoulder to the elbow, and the other from the elbow to the hand. Motion patterns were then divided into horizontal and vertical components and further analyzed using kinematic and dynamic methods. The kinematic analysis was performed based on the D-H parameters and the dynamic analysis was carried out to calculate various parameters such as velocity, acceleration, torque, and energy using the Newton-Euler equation of motion and Lagrange's equation. In an attempt to assess the efficacy of the analyzed human motion pattern it was compared to the virtual motion pattern created by the joint interpolation method. Results: To demonstrate the efficacy of the human arm motion mechanical and dynamical analyses were performed, followed by the comparison with the virtual robot motion path that was created by the joint interpolation method. Consequently, the human arm was observed to be in motion while the elbow was bent. In return this contributed to the increase of the manipulability and decrease of gravity and torque being exerted on the elbow. In addition, the energy required for the motion decreased. Such phenomenon was more apparent under vertical motion than horizontal motion patterns, and in shorter paths than in longer ones. Thus, one can minimize the abrasion of joints by lowering the stress applied to the bones, muscles, and joints. From the perspectives of energy and durability, the robot arm will be able to utilize its motor most effectively by adopting the motion pattern of human arm. Conclusions: By applying the motion pattern of human arm to the robot arm motion, increase in efficiency and durability is expected, which will eventually produce robots capable of moving in an energy-efficient manner.

• 한국산학기술학회논문지
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• 제15권8호
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• pp.4815-4820
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• 2014

최근에 반도체 칩이 소형화, 대용량화, 고집적화가 되고 있어 그 정밀도 및 신뢰성의 확보를 위해 반도체 테스트 핸들러 장비에서 픽앤플레이스의 개발이 필요하다. 본 연구에서는 반도체 테스트 핸들러 픽커 검사장비 프레임에 대한 진동해석을 하여 고유진동수와 하모닉 반응의 특성을 연구하였다. 해석모델로서는 세 가지 모델로서 픽앤플레이스 장치가 위 가이드라인의 왼쪽에 있는 경우(Case 1), 가운데에 있는 경우(Case 2) 및 오른쪽에 있는 경우(Case 3)이다. 이 프레임 모델들에 대해서 6차 모드까지의 고유진동수 범위는 80Hz~500Hz가 된다. Harmonic Response 해석 결과, 프레임에 공진이 발생할 때, Case 2는 Case 1과 Case 3보다 더 큰 52.802MPa의 최대 등가응력을 나타났다. 세 모델 중, Case 2의 경우가 진동에 의한 파손에 가장 강함을 알 수 있다. 본 연구의 해석 결과를 이용하여 시스템의 안전한 작업환경으로 실제 적용할 수 있는 모델 설계가 효율적으로 가능하다고 사료된다.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1988년도 한국자동제어학술회의논문집(국내학술편); 한국전력공사연수원, 서울; 21-22 Oct. 1988
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• pp.501-506
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• 1988

This paper describes an experimental system for automatic robot programming, The SNU-ARPS (Seoul National University Automatic Robot Programming System). The SNU-ARPS generates executable robot programs for pick and place operation and some simple mechanical assembly tasks by menudriven dialog. It is intended to enable the user to concentrate on the overall operation sequence instead of the knowledge regarding the details of robot languages. To convert task specifications into manipulator motions, the SNU-ARPS uses an internal representation of the world. This representation initially consists of geometric database from CAD system and is updated at each operation step to reflect the state changes of the world.

• 대한기계학회논문집A
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• 제37권8호
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• pp.1043-1050
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• 2013

병렬로봇은 구조적 특성 때문에 정밀성 및 고강성이 요구되는 분야와 고속성이 요구되는 분야에서 주로 적용되고 있다. 물류 분야에서 고속이송의 중요성은 날이 갈수록 증가하고 있으며, 본 연구에서도 동일한 목적으로 고속 이송에 적용될 병렬로봇이 개발되었다. 개발된 로봇은 최대 3kg의 부하를 이송할 수 있으며 0.1kg의 부하조건에서의 최대 운전 조건은 싸이클 타임 0.3sec로 최대 속도 약 4.5m/sec로 운전할 수 있으며(Pick & Place 작업, Adept cycle) 이때 최대 가속도는 약 13G에 달한다. 본 논문에서는 개발된 고속 병렬로봇의 설계 및 해석에 관한 연구결과와 개발된 로봇의 성능에 관해 소개하고자 한다.

• 한국전자통신학회논문지
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• 제17권3호
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• pp.507-514
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• 2022

가정에서 사람을 보조하기 위해 이동과 작업이 모두 가능한 모바일 매니퓰레이터의 필요성이 커지고 있다. 본 논문에서는 크기가 작고 낮은 가격으로 구성할 수 있는 모바일 매니퓰레이터를 개발하기 위해 모바일 로봇에 탑재할 수 있는 소형 매니퓰레이터 시스템을 개발하였다. 개발한 매니퓰레이터는 4자유도를 가지며, 끝단에 그리퍼와 카메라를 부착하여 물체의 인식과 인식한 물체에 대한 작업 수행이 가능하다. 개발한 매니퓰레이터는 수직 방향의 선형 이동이 가능하여 상대적으로 높이 위치한 사람의 손에 물건을 전달하거나 협업을 수행하는 데 유리하다. 개발한 매니퓰레이터의 4자유도 동작을 위한 4개의 액츄에이터를 매니퓰레이터의 베이스에 가깝게 배치하고 매니퓰레이터의 회전 관성을 줄임으로써 매니퓰레이터의 작업 중 안정성을 높이고 모바일 매니퓰레이터의 전복 위험을 낮추었다. 개발한 매니퓰레이터의 끝단에 위치한 카메라에서 RGB 영상을 획득하고 영상처리를 통해 물체를 인식하여 목표한 위치로 옮기는 픽 앤 플레이스 동작을 시험하였으며 로봇의 작업영역(workspace) 내에서 성공적으로 동작함을 확인하였다.

• 대한기계학회논문집A
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• 제39권6호
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• pp.561-566
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• 2015

본 논문에서는 고 중량물을 빠르게 이송시키며'Pick & Place'작업을 수행하는 병렬로봇의 작동강성 최적설계에 대한 연구를 수행하였다. 20~30kg 의 고 중량물을 사용하여 특정 작업을 빠르게 수행하기 위해서는 빠른 응답속도를 위한 관성 기구부 경량 설계와 동시에 동작의 정밀도를 위한 고 강성설계가 필요하다. 하지만 요구조건인 관성 기구부 경량 설계와 고강성 설계는 상호 배타적인 관계이므로 본 연구에서는 다물체동역학 해석을 통해서 병렬로봇의 동적 거동을 분석함으로써 로봇의 작동 중에 작용하는 하중상태를 분석하였고, 상호 배타적인 두 성능을 동시에 만족시키기 위해 관성 기구부 위상 최적 설계를 수행하였다. 그리고 위상 최적설계 결과를 병렬로봇에 적용하여 그 신뢰성을 검증하였다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
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• pp.27-34
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• 2001

The BGA Package has been the area array package of choice for several rears. Recently, the transition has been to finer pitch configuration called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch, requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and piece equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.