• Journal of the Ergonomics Society of Korea
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• v.30 no.3
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• pp.427-435
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• 2011

Objective: The objective of this study was to evaluate a work of building cleaners using the ergonomic methods. Background: Previous studies about cleaning worker describe typical physical demands of this work. They found that the most significant risk factors associated with the physical work of cleaners are static loads and repetitive movements and high output of force. Method: A head of ergonomics estimation was work analysis(define of combined task, work tool, work time and frequency of combined task) and posture analysis of worker. Results: The results showed that combined task of building cleaners was classification sweeping, mopping(wet), mopping(oil), moving barrels/carts, dumping trash bags, scrubbing, arrangement of cleaning tool, arrangement of circumferential, moving of cleaning tool, and waiting. The work time of combined task such as mopping(wet) and scrubbing indicated high ratio. The posture analysis of building cleaners indicated high value in bending of the head, lower arm, and hands. Conclusion: The findings appear to indicate that building cleaner were related to high risk of work-related musculoskeletal disorders. So, building cleaner would be required an interventional strategy, improvement of cleaning tools and working environment. Application: If ergonomics rule can be integrated into existing cleaning tools and work environments, the risk of occupational injuries will be reduced.

• Applied Chemistry for Engineering
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• v.25 no.5
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• pp.548-551
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• 2014

In order to reduce toxicity on the human body, four new cleaning agents (1-4) containing ester and ether functionalities have been invented. The synthesized cleaning agents's physical properties, biodegradabilities, and $LD_{50}$ values, which were conducted by Korea Testing Certification Institute by using standard method, showed excellent values. A specimen for cleaning ability was prepared by cutting in $60{\times}40mm$ size of stainless steel plate. The surface of the above specimens was treated with four different kinds of contaminants, such as cutting oil, anti-rust oil, drawing oil, and lubricating oil. Contaminated specimens were then immersed in compounds (1-4) for 1 to 5 minutes to dissolve oil in the cleaning agent. The data indicate that all compounds (1-4) exhibit good cleaning ability toward four contaminant oils. It is also confirmed that these compounds can be applicable to various industrial cleaning fields as nontoxic and biodegradable cleaning agents because of their excellent biodegradabilities and $LD_{50}$ values.

• Clean Technology
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• v.7 no.3
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• pp.203-214
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• 2001

A silicon oxide cleaning characteristic and its mechanism were studied in RF plasma cleaning system with various gases such as $CHF_3$, $CF_4$, Argon, oxygen and mixing gas. The experimental parameters - working pressure (100 mTorr), RF power (300 W, 500 W), electrode distance (5cm, 8cm, 11.5cm), cleaning time (90, 180 seconds), gas flow (50 sccm) were fixed to compare cleaning efficiency by gas types. The results were as follows. First, the argon plasma is retaining only physical sputtering effect and etch rate was low. Second, the oxygen plasma showed good cleaning efficiency in electrode distace of 5cm, 300W, 180secs, but surface roughness increased. Third, $CF_4$ Plasma could get the best cleaning efficiency. Fourth, $CHF_3$ plasma could know that addition gas that can lower the CFx/F ratio need. We could not get good cleaning efficiency in case of added argon to $CHF_3$. But, we could get good cleaning efficiency in case added oxygen.

• Journal of the Korean Society of Costume
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• v.54 no.1
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• pp.1-10
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• 2004

The purpose of this study was to compare the efficiency of four different cleaning method of silk and to fabrics, which were excavated from the sixteenth century tombs. The four cleaning methods were hand washing in water and hand washing in solvent, washing in ultrasonic cleaner, and using of ultrasonic gun after washing in ultrasonic cleaner. The following is the result of the experiment: ㆍBoth silk and jute fabrics shrank the most after hand-wash in water. This cleaning method decreased their thickness the most but changed their strength the least. However, the color of the fabric changed the most after had-wash in water. This washing method might discolor the dyed fabric, so one must check the condition of the fabric thoroughly before washing it. ㆍThe weight and the thickness of the fabric changed little after ultrasonic cleaning. This cleaning method, therefore. is less efficient than hand-water-wash. The use of ultrasonic gun after ultrasonic wash for partial cleansing enhanced the efficiency a little. Nevertheless, this method left stain around the area where the gun was used, and the injected water could damage the fabric. ㆍThe excavated fabric became softer in the cleaning process as the dirt was washed away. In both cases of silk and jute fabrics cleaning, solvent made the fabric softer than water. Washed in solvent, the fabric did not swell. But water penetrated to the fiber during the cleaning process and made the fabric swell. When the water evaporates, the swollen fiber structure collapses and the fabric become stiff. Ultrasonic wash did not cause much change in the flexibility of the fabric, for this method does not remove the dirt as effectively as the other method.

• Particle and aerosol research
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• v.19 no.3
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• pp.63-76
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• 2023

An electrostatic precipitator (ESP) has a low pressure drop and a high collection efficiency but its collection efficiency can be reduced due to dust accumulation on the collection plates during long-term operations. In order to maintain the initial dust collection efficiency, it is necessary to periodically clean the collection plates. The common cleaning methods are using physical impacts or water sprays. These cleaning methods can lead to damage to the collection plate or generate wastewater. Herein, we implemented an electrodynamic screen (EDS) for ESP cleaning and evaluated its surface cleaning performance of particles. The EDS is an electrostatic system that can electrostatically repel particles on surfaces, allowing it to clean the ESP without causing damage and wastewater generation. Our evaluation included the analysis of the effects of AC voltage characteristics, electrode configuration and environmental conditions on the cleaning performance of the EDS with the aim of achieving effective surface cleaning. It has been demonstrated that activating the EDS cleans up to 65% of the particles on the surface, which indicates about 94% of our target cleaning zone.

• Clean Technology
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• v.17 no.2
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• pp.117-123
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• 2011

In this study, evaluation tests for cleaning performance of various cleaning agents and selection of optimal ultrasonic cleaning parameters were executed to develop an efficient cleaning process in remanufacturing of laser copy machine. Cleaning performance tests were executed with 8 cleaning agents (A~H) to remove the contaminants of oil-ink, toner particles, and shoe polish. Physical properties and foamability tests were also applied. For 3 types of contaminants, cleaning agent G showed superior cleaning performance compared to agent A which has being used at a remanufacturing of laser copy machine in Korea. With cleaning agents selected in pre-tests, ultrasonic cleaning tests were executed to remove real contaminants on the parts of used digital laser copy machine parts. Cleaning agent G at 28 kHz ultrasonic frequency showed faster cleaning performance compared to agent A and other frequencies. The productivity and economic efficiency in remanufacturing of laser copy machine are expected to increase by adapting agent G and 28 kHz frequency at ultrasonic cleaning process.

• Clean Technology
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• v.17 no.4
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• pp.306-313
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• 2011

Flux or solder is used in soldering process for manufacturing electronic parts such as printed circuit boards (PCB). After soldering process, residual flux and solder paste on the parts should be removed since their residuals could cause performance degradation or failure of parts due to their corrosion and electric leakage. Ozone depletion substances such as 1,1,1- trichloroethane (TCE) and HCFC-141b have widely been using for removal of residual flux and solder paste after soldering process In manufacturing of electronic parts until now. In this study, non-aqueous cleaning agents without flash point were developed and applied to industrial field for replacement of cleaning agents with ozone depletion. In order to develop non-aqueous cleaning agents without ethers, esters, fluoride- type solvents. And their physical properties and cleaning abilities were evaluated, and they were applied to industrial fields for cleaning of flux and solder on the PCB. And vacuum distillation apparatus were operated to determine their operating conditions and recycling yields for recycling of used cleaning agents formulated in this study. As a result of physical properties measurement of our formulated cleaning agents, they were expected to have good wetting and penetrating power since their surface tensions were relatively low as 18.0~20.4 dyne/$cm^2$ and their wetting indices are relatively large. And some cleaning agents holding fluoride-type solvents as their components did not have any flash point and they seemed to be safe in their handling and storage. The cleaning experimental results showed that some cleaning agents were better in their cleaning of flux and solder paste than 1,1,1-TCE and HCFC-141b. And industrial application results of the formulated cleaning agents for cleaning PCB indicated that they can be applicable to industry due to their good cleaning capability in comparison with HCFC-141b. The recycling experiments of the used formulated cleaning agents through a vacuum distillation apparatus also showed that their 91.9~97.5% could be recycled with its proper operating conditions.

• Analytical Science and Technology
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• v.6 no.5
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• pp.521-530
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• 1993

According to the Montreal Protocol, CFC 113, one of the ozone-depleting substances, will be prohibited to use as a cleaning solvent essentially in the electronic industry. Therefore, the development of the alternative cleaning solvents to CFC 113 is being accelerated. A number of the alternative cleaning solvents are avialable on the market. The alternatives of Axarel 32(DuPont), Cleanthru 750H(KAO Chemical), and EC-Ultra(Petroferm) are chosen for the comparison of cleaning performance with CFC 113. The test methods for measuring the cleaning performance were composed of the measurement of the physical properties, the experiments on the material compatibility with cleaning solvents, the measurement of the evaporation rate, and finally the experiments of the removal efficiency. Normally the basic physical properties of the alternatives had higher boiling points, viscosity and surface tension, which were quite different to those of CFC 113. In terms of solubility of rosin-based flux, the solubilities of abietic acid (nonpolar organic) were similar, but those of the activator (polar organic) in the alternatives were better than CFC 113. The evaporation of the alternatives was very slow, compared to CFC 113, which had much lower boiling point. All the cleaning solvents showed the good material compatibility with FR4 and Cu-coated PCB. The better removal efficiencies of abietic acid were obtained when using the ultrasonic mechanical energy over the dipping method. The experiments also indicated the very slow-eavaporating solvent was not desirable with the dipping cleaning method, and the differences in the removal efficiency of the alternatives with the ultrasonic cleaning method were negligible. Among the alternatives, the overall cleaning performances were obsorved as almost similar. Before selecting the ultimate cleaning solvent, the application of cleaning machine, environmental issues, and economics are simultaneously considered with the cleaning performance.

• Clean Technology
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• v.7 no.1
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• pp.13-25
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• 2001

With fast advancement of fine machineries and semiconductor industries in recent decades, the ultra-cleaning of organic chemicals, submicron particles from contaminated unit equipments and products such as silicon wafers becomes one of the most important steps for further advancement of such industries. To date, two kinds of ultra cleaning techniques are used; one is the wet-cleaning and the other is the dry cleaning. In case of wet cleaning, removal of organic contaminants and submicron particles is made by DIW with additives such as $H_2O_2$, $H_2SO_4$, HCl, $NH_4OH$ and HF, etc. While the wet cleaning method is most widely adopted for various occasions, it is inevitable to discharge significant amount of toxic waste waters in environment. Dry cleaning is an alternative method to mitigate environmental pollution of the wet cleaning with maintaining comparable degree of cleaning to the wet cleaning. Although there are various concept of dry cleaning have been devised, the dry cleaning with environmentally-benign solvent such as carbon dioxide proven to show high degree of cleaning from the contaminated porous surface as well as from the bare surface. Thus, special global attention has been placing on this technique since it has important advantages of simple process schemes and no environmentally concern, etc. Thus, this article critically reviews the state-of-the-art of the supercritical fluid drying with emphasis on the thermo-physical characteristics of the supercritical solvent, environmental gains compared to other dry cleaning methods, and the generic aspects of the basic design and processing engineering.

• Clean Technology
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• v.10 no.2
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• pp.61-72
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• 2004

In this study, aqueous/semi-aqueous cleaning agents which consist of organic solvent, surfactant, cosurfactant, and water were developed by changing formulation parameters such as organic solvent type and contents, surfactant type and contents, and cosurfactant/surfactant(A/S) ratio, etc.. And physical properties and flux removal of the formulated cleaning agents have been evaluated. Also, the performance of oil-water separation from the rinse water contaminated during the cleaning process was evaluated for its recycling. The formulated cleaning agents in this work expected to have good penetration because of their low viscosity and low surface tension values of 30.2~32.5 dyne/cm. The flux removal with the terpene type cleaning agent was higher than that with hydrocarbon type cleaning agent and two commercial products (CPA(commercial product A), CPB(commercial product B)). And the performance of oil-water separation by gravity settling from the rinse water contaminated with formulated cleaning agent and soils was shown to be very good. The cleaning agents developed in this work were applied to surface mounting technology(SMT) cleaning process for manufacturing electronic parts at L electronic company. As a result, the newly developed cleaning agents showed two times better cleaning speed for removal of solder cream than the conventional ond containing ethanol and IPA(isopropyl alcohol). In addition, malodor and VOC problems generated by the previous organic cleaning agents have been solved in the manufacturing field through introduction of the non-volatile and environmental-friendly cleaning agents to the field.