• Title/Summary/Keyword: Photo-Electrode Material

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Electrical Properties of Supercapacitor Based on Dispersion Controlled Graphene Oxide According to the Change of Solution State by Washing Process (Washing을 통한 상분리 변화에 따른 그래핀 산화물의 분산도 조절 및 슈퍼커패시터의 특성에 관한 연구)

  • Sul, Ji-Hwan;You, In-kyu;Kang, Seok Hun;Kim, Bit-Na;Kim, In Gyoo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.31 no.2
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    • pp.102-106
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    • 2018
  • Recently, there has been an increasing interest in the use of graphene as electrode materials for supercapacitors. In this regard, graphene oxide (GO) films were prepared using GO slurry obtained by dispersing GO powder in deionized (DI) water. The degree of dispersion of GO powder in DI water depends on the concentration of GO slurry, pH, impurity content, GO particle size, types of functional groups contained in GO, and manufacturing method of GO powder. In this study, the dispersivity of the GO powder was improved by adjusting the pH using only DI water (without additives), and a uniform GO film was obtained. The GO film was reduced by exposure to xenon intense pulsed light for a few milliseconds, and the reduced GO film was used as electrodes of a supercapacitor. The supercapacitor was characterized using cyclic voltammetry (CV), charge-discharge cycle, and electrochemical impedance spectroscopy measurements, and the specific capacitance of the supercapacitor was found to be ~140 F/g from the CV data.

Study on the Compositions of Photosensitive Resistor Paste Using Epoxy Acrylate Oligomers and Conductive Carbonblack (에폭시 아크릴레이트 올리고머와 전도성 카본블랙을 이용한 감광성 저항 페이스트 조성 연구)

  • Park, Seong-Dae;Kang, Nam-Kee;Lim, Jin-Kyu;Kim, Dong-Kook
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.421-421
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    • 2008
  • Generally, the polymer thick-film resistors for embedded organic or hybrid substrate are patterned by screen printing so that the accuracy of resistor pattern is not good and the tolerance of resistance is too high(${\pm}$20~30%). To reform these demerits, a method using Fodel$^{(R)}$ technology, which is the patterning method using a photosensitive resin to be developable by aqueous alkali-solution as a base polymer for thick-film pastes, was recently incorporated for the patterning of thermosetting thick-film resistor paste. Alkali-solution developable photosensitive resin system has a merit that the precise patterns can be obtained by UV exposure and aqueous development, so the essential point is to get the composition similar to PSR(photo solder resist) used for PCB process. In present research, we made the photopatternable resistor pastes using 8 kinds of epoxy acrylates and a conductive carbonblack (CDX-7055 Ultra), evaluated their developing performance, and then measured the resistance after final curing. To become developable by alkali-solution, epoxy acrylate oligomers with carboxyl group were prepared. Test coupons were fabricated by patterning copper foil on FR-4 CCL board, plating Ni/Au on the patterned copper electrode, applying the resistor paste on the board, exposing the applied paste to UV through Cr mask with resistor patterns, developing the exposed paste with aqueous alkali-solution (1wt% $Na_2CO_3$), drying the patterned paste at $80^{\circ}C$ oven, and then curing it at $200^{\circ}C$ during 1 hour. As a result, some test compositions couldn't be developed according to the kind of oligomer and, in the developed compositions, the measured resistance showed different results depending on the paste compositions though they had the same amount of carbonblack.

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Fabrication and Performance of Electron Cyclotron Resonance Ion Milling System for Etching of Magnetic Film Device (자성박막 소자 에칭용 전자 사이클로트론 공명 이온밀링 시스템 제작과 특성연구)

  • Lee, Won-Hyung;Hwang, Do-Guwn;Lee, Sang-Suk;Rhee, Jang-Roh
    • Journal of the Korean Magnetics Society
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    • v.25 no.5
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    • pp.149-155
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    • 2015
  • The ECR (Electron Cyclotron Resonance) Ar ion milling was manufactured to fabricate the device of thin film. The ECR ion milling system applied to the device etching operated by a power of 600W, a frequency of 2.45 GHz, and a wavelength of 12.24 cm and transferred by a designed waveguide. In order to match one resonant frequency, a magnetic field of 908 G was applied to a cavity inside of ECR. The Ar gas intruded into a cavity and created the discharged ion beam. The surface of target material was etched by the ion beam having an acceleration voltage of 1000 V. The formed devices with a width of $1{\mu}m{\sim}9{\mu}m$ on the GMR-SV (Giant magnetoresistance-spin valve) multilayer after three major processes such as photo lithography, ion milling, and electrode fabrication were observed by the optical microscope.