• Title/Summary/Keyword: Peeling

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Key Parameter of Peel-off Test for Reliability Assessment of Toner Film (토너 박막의 신뢰성 평가를 위한 Peel-off Test의 주요인자)

  • Kim, Kwang-Il;Kim, Dae-Eun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.34 no.11
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    • pp.1567-1573
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    • 2010
  • In printing systems, the reliability of printed material depends on the ability of the toner film to remain adhered to the paper surface. In order to measure the strength between the toner film and the paper surface, a peel-off test is often performed. After conducting the test, the amount of toner film remaining on the paper is measured in order to determine the interfacial strength. The results of this test can be affected by many factors such as the peeling rate, weight of the roller used, and dwell time of tape. Sensitivity analysis was performed with respect to peeling rate, weight of roller and dwell time of tape at different levels. It was found that the interfacial strength increased with an increase in these main parameters. On the other hand, the trend with respect to the percentage of toner loss was different. Further, the interfacial strength and percentage of toner loss were significantly affected by the peeling rate.

Peeling Behavior of Backsheet according to Surface Temperature of Photovoltaic Module (태양광 모듈 표면 온도 제어에 따른 백시트 박리 거동)

  • Kim, Jeong-Hun;Lee, Jun-Kyu;Ahn, Young-Soo;Yeo, Jeong-Gu;Lee, Jin-Seok;Kang, Gi-Hwan;Cho, Churl-Hee
    • Korean Journal of Materials Research
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    • v.29 no.11
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    • pp.703-708
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    • 2019
  • In this study, we investigate the relationship between the peeling behavior of the backsheet of a photovoltaic(PV) module and its surface temperature in order facilitate removal of the backsheet from the PV module. At low temperatures, the backsheet does not peel off whereas, at high temperatures, part of the backsheet remains on the surface of the PV module after the peeling process. The backsheet material remaining on the surface of the PV module is confirmed by X-ray diffraction(XRD) analysis to be poly-ethylene(PE). Differential scanning calorimetry(DSC) is also performed to investigate the interfacial characteristics of the layers of the PV module. In particular, DSC provides the melting temperature($T_m$) of laminated ethylene vinyl acetate(EVA) and of the backsheet on the PV module. It is found that the backsheet does not peel off below the $T_m$ of ethylene of EVA, while the PE layer of the backsheet remains on the surface of the PV module above the $T_m$ of the PE. Thus, the backsheet is best removed at a temperature between the $T_m$ of ethylene and that of PE layer.

Peeling Damage of Sapling caused by the Developing Process of Roe Deer Antlers in Warm-temperate Forests of Jeju Island (제주도 난대림에서 노루 뿔의 성장과정에 의한 어린나무 박피에 관한 연구)

  • Kim, Eun Mi;Park, Youngkyu;Kwon, Jino;Kim, Ji Eun;Kang, Chang Wan;Lee, Chi Bong
    • Korean Journal of Agricultural and Forest Meteorology
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    • v.14 no.4
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    • pp.254-259
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    • 2012
  • Peeling damage of trees is usually caused by Cervidae such as deer, roe deer because of the lack of food in forests. However, it happens as part of the developing of antlers in Jeju Island when the roe deer try to remove the Velvet-the skin of the antlers. The research area is the Hannam experimental forest (400 m up to 500 m above sea level) of Korea Forest Research Institute in Jeju Island, and the survey was carried out along the 6 km long of forest road with 5 m width on both sides. Twenty five tree species (total 267 stands) are damaged by peeling; 18 (134 stands) deciduous broad-leaved species, 5 (71 stands) in evergreen broad-leaved species, 2 (62 stands) coniferous species. The most common damaged species are in order of Daphniphyllum macropodum, Cryptomeria japonica, Lindera erythrocarpa, Clerodendrum trichotomum, Zanthoxylum schinifolium. Mainly damaged trees are approximately 3~4 years old saplings, and they show the mean height $120.7{\pm}42.4cm$, diameter measured at 5 cm height $1.5{\pm}0.5cm$. The Lowest peeling beginning height is $22.1{\pm}10.1cm$, and the mean length of peeling is $27.5{\pm}10.6cm$. Once the peeling damage happens, the saplings are infected by fungi secondly, and are distorted or dead, therefore the future structure of warm-temperate forests could be in influenced in species. Warm-temperate forest landscape and species change related to the climate change is a rising issue in Jeju Island. However the changes caused by peeling damage also could be an important issue in the natural process of forest environment, afforestation, local nursery and sustainable forest management of Jeju Island.

Study on the restored Sungnyemun Gate Dancheong (숭례문 복원 단청에 관한 연구)

  • Kim, Soon Kwan;Han, Min Su;Jeong, Seon Hye;Kim, Mi Jeong
    • Journal of Conservation Science
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    • v.30 no.4
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    • pp.447-456
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    • 2014
  • This study is mainly about materials that are used in Sungnyemun gate's dancheong to find causes of dancheong's damage such as desquamation and peeling off. 12 kinds of pigments' components which are used in dancheoong are analyzed. Except for Hobun and Seokganju, the pigments are artificial. Samples are made with different conditions of adhesives and the rate of binder. To estimate promotion weathering test, adhesives are applied in a different order. Desquamation and peeling off presented especially when different adhesives are used on dancheong and also, generally the layer thickened.

A study of WSi$_2$ film peeling off from Si substrate (텅스텐 실리사이드 박막 들뜸에 관한 연구)

  • 한성호;이재갑;김창수;이은구
    • Journal of the Korean institute of surface engineering
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    • v.29 no.1
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    • pp.3-14
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    • 1996
  • High temperature anneal of W-rich silicides, inferior to adherence compared with Si-rich silicides, resulted in the film peeling off from the Si-substrate when WSix thickness reached more than critical thickness. Investigation of the W-rich silicide films peeling off from the substrate revealed that the voids underneath the $WSi_2$ produced through silicide reaction were responsible for the poor adherence of W-rich silicide. In addition, internal stress in the film increased as the silicide thickness increased. In order to promote the adhesion of WSix to Si-substrate, thin Ti-layer was formed between WSi and Si-substrate(WSix/Ti/Si). No voids were observed in $WSi_2$/Ti/Si $N_2$-annealed at $1000^{\circ}C$, thereby leading to an increase of the critical thickness from ~1700$\AA$ to more than 2500$\AA$. However, higher resisiti-vity was obtained in WSix/Ti/Si than in WSix/Si. Finally, different silicide reaction mechanism for the structures(WSix/Si, WSix/Ti/Si) was proposed to explain the formation of voids as well as the role of thin Ti-layer.

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Quadrant Analysis in Correlation between Mechanical and Electrical Properties of Low-Temperature Conductive Film Bonded Crystalline Silicon Solar Cells

  • Baek, Su-Wung;Choi, Kwang-Il;Lee, Woo-Hyoung;Lee, Suk-Ho;Cheon, Chan-Hyuk;Hong, Seung-Min;Lee, Kil-Song;Shin, Hyun-Woo;Yan, Yeon-Won;Lim, Cheolhyun
    • Current Photovoltaic Research
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    • v.3 no.1
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    • pp.1-4
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    • 2015
  • In this study, we analyzed the correlation between mechanical and electrical properties of low-temperature conductive film (LT-CF) bonded silicon solar cells by a quadrant analysis (horizontal axis (peeling strength), vertical axis (power loss)). We found that a series of points with various bonding parameters such as bonding temperature, pressure and time were distributed in the different three regimes; weak regime (Q2: weak bonding strength and high power loss), moderate regime (Q4 : strong bonding strength and low power loss) and hard regime (Q3 : weak bonding strength and low power loss). Using this analogous technique, it was possible to fabricate the LT-CF bonded silicon solar cells with the various conditions displayed in Q3 of the quadrant plots, possessing the peeling strength of ~ 1N/mm and power loss of 2~3%.

Component Analysis of Paper Mulberry Bark for the Automation of Bark Peeling Process (닥나무 박피 자동화를 위한 닥 인피의 구성성분 분석)

  • Seo, Jin-Ho;Kim, Hyoung-Jin
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.43 no.1
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    • pp.74-82
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    • 2011
  • The bast fiber of Paper mulberry has been generally used as a fibrous raw material in traditional Hanji-making. Nowadays, its uses is expanded to different special purposes such as paper mulberry yarn, laminated paper, antimicrobial paper depending on its application. Despite the wide array of the use of mulberry fibers, it is still limited due to some difficulties in the automation process of manufacturing works. This study is focused on the analysis of chemical components and morphological properties of paper mulberry bark for the automation of bark peeling process. The bast tissue of paper mulberry was separated in three plies; black outer layer, green inner layer, and white inner layer. The total lignin content, holocelluloses, extractives and ashes, and the anatomical structure of the three layers in mulberry bark tissue were investigated. The analysis showed that the black outer layer is composed of about 50% of total lignin content, whereas the white inner layer is composed of about 90% of holocellulose content.

Effect of Tio2 particles on the mechanical, bonding properties and microstructural evolution of AA1060/TiO2 composites fabricated by WARB

  • Vini, Mohamad Heydari;Daneshmand, Saeed
    • Advances in materials Research
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    • v.9 no.2
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    • pp.99-107
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    • 2020
  • Reinforced aluminum alloy base composites have become increasingly popular for engineering applications, since they usually possess several desirable properties. Recently, Warm Accumulative Roll Bonding (WARB) process has been used as a new novel process to fabricate particle reinforced metal matrix composites. In the present study, TiO2 particles are used as reinforcement in aluminum metal matrix composites fabricated through warm accumulative roll bonding process. Firstly, the raw aluminum alloy 1060 strips with TiO2 as reinforcement particle were roll bonded to four accumulative rolling cycles by preheating for 5 min at 300℃before each cycle. The mechanical and bonding properties of composites have been studied versus different volume contents of TiO2 particles by tensile test, peeling test and vickers micro-hardness test. Moreover, the fracture surface and peeling surface of samples after the tensile test and peeling test have been studied versus different amount of TiO2 volume contents by scanning electron microscopy. The results indicated that the strength and the average vickers micro-hardness of composites improved by increasing the volume content of TiO2 particles and the amount of their elongation and bonding strength decreased significantly.

Determination of PCB film of Un-peeling Defect Using Deep Learning (딥러닝을 이용한 PCB 필름 미박리 양품 판정)

  • Jeong-Gu, Lee;Young-Chul, Bae
    • The Journal of the Korea institute of electronic communication sciences
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    • v.17 no.6
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    • pp.1075-1080
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    • 2022
  • Recently, the effort is continuously applied in machine learning and deep learning algorithm which is represented as artificial intelligence algorithm in the varies field such as prediction, classification and clustering. In this paper, we propose detection algorithm for un-peeling status of PCB protection film by using Dectron2. We use 42 images of data as training and 19 images of data as testing based on 61 images which was taken under the condition of a critical reflection angel of 42.8°. As a result, we get 16 images that was detected and 3 images that was not detected among 19 images of testing data.

Effects of Root Diameter and Peeling Methods on Drying Time and Paeoniflorin Content of Paeonia Lactiflora Pallas (작약(芍藥)의 뿌리굵기와 각피(刻皮)정도가 건조시간 및 품질에 미치는 영향)

  • Kim, Ki-Jae;Park, Chun-Hong;You, Oh-Jong;Shin, Jong-Hee;Park, So-Deuk;Choi, Boo-Sull
    • Korean Journal of Medicinal Crop Science
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    • v.6 no.1
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    • pp.38-43
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    • 1998
  • This experiment was carried out to gather basic information for improvement of peeling methods in peony (Paeonia lactiflora) roots which have been used for medicinal resources in Korea. Drying time required was shortened in thin root. Optimum drying time after machine peeling appeared to be 20 hrs in 5 to 10mm of root diameter, 39 hrs in 10 to 15mm, 48 hrs in 15 to 20mm, 56 hrs in more than 20mm, but those of unpeeled roots took 11 hrs in 5mm of root diameter and 4 hrs in exposed parent material. Paeoniflorin content in dried roots after peeling was lower than that of unpeeled root. Paeoniflorin content in root below 5mm in diameter was highest (6.15 %) and that was decreased in the increased root diameter up to 20mm, but it was slightly increased in root greater than 20mm in diameter.

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