• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1507-1510
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• 2005

This study was carried out as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-\mu{m}-deep$ indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.49 GPa and 100 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46-0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined area during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.171-177
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• 2006

This study was performed as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-{\mu}m$-deep indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.51 GPa and 104 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$ ) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46- 0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined are a during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.1
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• pp.95-101
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• 2022

This paper proposes a method to process the shape of an optical transmission road and attempts to determine the most suitable single processing method for an acrylic plate optical transmission road. In addition, by manufacturing an automatic pattern processing device to generate certain shapes on the acrylic plate at regular intervals, and measuring the illuminance of the patterned acrylic plate optical transmission road, the measured illuminance was confirmed to fall under the KS illuminance values presented in Table 1. In conclusion, when an incident light of approximately 20,000 lx is applied, the transmission illumination is approximately 200 lx, which represents a transmission rate of approximately 1% for incident light and corresponds to the KS illumination criterion F. Additionally, the right-angle triangular pyramid base size (A) processed at a temperature of 350 ℃ for one second was 2 mm, exhibiting the largest transmission illumination of 280 lx. When the transparent acrylic plate was set to a constant size of 1.6 mm at the bottom of the right-angle triangular pyramid, the fastest response occurred at a processing tip temperature of 350 ℃ (0.04 s). On the other hand, it took 10 s to process the size of the bottom of the right-angled triangular pyramid at a temperature of 200 ℃ to 1.6 mm, and it was confirmed that the optical transmission efficiency was significantly reduced because of the burr that occurred at this time.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.3
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• pp.273-278
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• 2014

This study presents a chatter vibration avoidance program for the milling process. Chatter vibration has a negative effect on workpieces and spindle-tools. When chatter vibration occurs, the cutting tool is loaded dynamically, a chatter pattern is generated on the workpiece, and the tool life is reduced. The developed program is composed of various modules such as an FFT analyzer, an impact test analyzer, a chatter vibration indicator, and a spindle speed recommender. The proposed program is verified using an AISI D2 cutting experiment in milling process. The effect of chatter vibration on the machining condition can be simulated by the suggested method, and successfully exploited to avoid chatter vibration.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.4
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• pp.134-140
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• 2009

The feasibility of electrochemical drilling and milling on stainless steel are investigated using tungsten microelectrode with $10{\mu}m$ in diameter. For the development of environmentally friendly and safe electrochemical process, citric acid solution is used as electrolyte. A few hundred nanoseconds duration pulses are applied between the microelectrode and work material for dissolution localization. Tool fracture by Joule heating, micro welding, capillary phenomenon, tool wandering by the generated bubbles are observed and their effects on micro ECM are discussed. Occasionally, complex textures including micro pitting corrosion marks appeared on the hole inner surface. Metal growth is also observed under the weak electric conditions and it hinders further dissolutions for workpiece penetration. By adjusting appropriate pulse and chemical conditions, micro holes of $37{\mu}m$ in diameter with $100{\mu}m$ in depth and 26Jim in diameter with $50{\mu}m$ in depth are drilled on stainless steel 304. Also, micro grooves with $18{\mu}m$ width and complex micro hand pattern are machined by electrochemical milling.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.326-329
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• 2005

As a flexible method to fabricate sub-micrometer patterns, Focused Ion Beam (FIB) instrument and Self-Assembled Monolayer (SAM) resist are introduced in this work. FIB instrument is known to be a very precise processing machine that is able to fabricate micro-scale structures or patterns, and SAM is known as a good etch resistance resist material. If SAM is applied as a resist in FIB processing fur fabricating nano-scale patterns, there will be much benefit. For instance, low energy ion beam is only needed for machining SAM material selectively, since ultra thin SAM is very sensitive to $Ga^+$ ion beam irradiation. Also, minimized beam spot radius (sub-tens nanometer) can be applied to FIB processing. With the ultimate goal of optimizing nano-scale pattern fabrication process, interaction between SAM coated specimen and $Ga^+$ ion dose during FIB processing was observed. From the experimental results, adequate ion dose for machining SAM material was identified.

• Design & Manufacturing
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• v.14 no.1
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• pp.63-68
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• 2020

Ultra-high brightness and thin displays need to optical micro-patterns which can uniformly diffuse the lights and low loss. The micro random patterns have characteristics to rise the optical efficiency such as light extraction, uniform diffusion. For this reason, various fabrication processes are studied for random patterns. In this study, the micro random patterns were machined by diamond turning which used a controlled cutting tool path with random cutting depth. The machined patterns had random shape and directionality along the circumferential direction. The average width and length of machined random pattern according to rotation radius were 40.13㎛~55.51㎛ and 37.25㎛~59.49㎛, and these results were compared with the designed result. Also, the machining error according to rotation radius in diamond turning using randomly controlled cutting depth was discussed.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.13 no.2
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• pp.33-39
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• 2004

Sandblasting has recently been developed into a powder blasting technique for brittle materials. In this study, the machinability of $Si_3N_4$-hBN based machinable ceramics are evaluated for micro - pattern making processes using powder blasting. Material properties of the developed machinable ceramics according to the variation of h-BN contents give a good machinability to the ceramics. The effect of scanning times, the size of patterns and variation of BN contents on the erosion depth of samples without mask and samples with different mask patterns in powder blasting of $Si_3N_4$-hBN ceramics are investigated. The Parameters are the impact angle of $90^{\circ}$, the scanning times of nozzle up to 40, and the stand-off distances of 100mm The widths of masked pattern are 0.1mm 0.5mm and 1mm. The powder used is Alumina particles, WA#600. and the blasting pressure of powder is 0.2MPa. Through required experiments, the results are investigated and analyzed. As the results, the machinability of the developed ceramics increases as the BN contents in the ceramics.

• Transactions of Materials Processing
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• v.12 no.7
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• pp.640-646
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• 2003

The nanoprobe based on lithography, mainly represented by SPM based technologies, has been recognized as potential application to fabricate the surface nanostructures because of its operational versatility and simplicity. The objective of the work is to suggest new mastless pattern fabrication technique using the combination of machining by nanoindenter and KOH wet etching. The scratch option of the nanoindenter is a very promising method for obtaining nanometer scale features on a large size specimen because it has a very wide working area and load range. Sample line patterns were machined on a silicon surface, which has a native oxide on it, by constant load scratch (CLS) of the Nanoindenter with a Berkovich diamond tip, and they were etched in KOH solutions to investigate chemical characteristics of the machined silicon surface. After the etching process, the convex structure was made because of masking effect of the affected layer generated by nano-scratch. On the basis of this fact, some line patterns with convex structures were fabricated. Achieved patterns can be used as a mold that will be used for mass production processes such as nanoimprint or PDMS molding process. All morphological data of scratch traces were scanned using atomic force microscope (AFM).

• Transactions of Materials Processing
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• v.22 no.1
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• pp.23-29
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• 2013

In this study, a micro/nano-random-pattern-structure surface was machined by electric discharge machining (EDM) followed by replicating the EDM surface with a silicone elastomer having low energy and greater hydrophobicity. The variation of hydrophobicity was of prime interest and was examined as a function of the surface roughness of the replicated silicone elastomer. The hydrophobicity was evaluated by the water contact angle (WCA) measured on the relevant surface. For the experiments, the original surfaces were machined by die sinking electric discharge machining (DS-EDM) and wire cutting electric discharge machining (WC-EDM). The ranges of surface roughness were Ra $0.8{\sim}19{\mu}m$ for the DS-EDM and Ra $0.5{\sim}4.7{\mu}m$ for the WC-EDM. In order to fabricate a hydrophobic surface, the EDM surfaces were directly replicated using a liquid-state silicone elastomer, which was thermally cured. The measured WCA on the replicated surfaces for DS-EDM was in the range of $115{\sim}130^{\circ}$ and for WC-EDM the WCA was in the range of $123{\sim}150^{\circ}$. Additionally, the dynamic hydrophobicity was evaluated by measuring an advancing and a receding WCA on the replicated silicone elastomer surfaces.