• Title/Summary/Keyword: Pattern Machining

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A Study on Development and Application of Real Time Vision Algorithm for Inspection Process Automation (검사공정 자동화를 위한 실시간 비전알고리즘 개발 및 응용에 관한 연구)

  • Back, Seung-Hak;Hwang, Won-Jun;Shin, Haeng-Bong;Choi, Young-Sik;Park, Dae-Yeong
    • Journal of the Korean Society of Industry Convergence
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    • v.19 no.1
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    • pp.42-49
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    • 2016
  • This study proposes a non-contact inspective technology based robot vision system for Faulty Inspection of welding States and Parts Shape. The maine focus is real time implementation of the machining parts' automatic inspection by the robotic moving. For this purpose, the automatic test instrument inspects the precision components designator the vision system. pattern Recognition Technologies and Precision Components for vision inspection technology and precision machining of precision parts including the status and appearance distinguish between good and bad. To perform a realization of a real-time automation integration system for the precision parts of manufacturing process, it is designed a robot vision system for the integrated system controller and verified the reliability through experiments. The main contents of this paper, the robot vision technology for noncontact inspection of precision components and machinery parts is useful technology for FA.

Chip Shape Control using AE Signal in Pure Copper Turning (순동선삭가공에서 AE 신호를 이용한 칩 형상 제어)

  • Oh, Jeong Kyu;Kim, Pyeong Ho;Koo, Joon Young;Kim, Duck Whan;Kim, Jeong Suk
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.23 no.4
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    • pp.330-336
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    • 2014
  • The continuous chip generated in cutting process deteriorates workpiece, tool, and machine tool system. It is necessary to treat this continuous chip in ductile material machining condition for stable cutting. This paper deals with the chip control method using acoustic emission(AE) signal in pure copper turning operation. AE raw signals, root mean square(RMS) signals and wavelet transformed signals measured in turning process are introduced to analysis for chip patterns. With analysis of AE signals, it is obtained that the produced chip patterns are correlated with the specified AE signals which are transformed by fuzzy pattern algorithm. By this experimental investigation, the chip patterns can be classified at significant level in pure copper machining process and controlled from continuous chips to reduced-length stable chips.

Grinding Technology for Surface Texturing (연삭기법을 이용한 패터닝 기술)

  • Ko, Tae Jo;Han, Do Sup;Qiu, Kang;Park, Jong-Kweon
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.5
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    • pp.367-373
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    • 2014
  • Surface texturing is a machining process on the surface to give engineering functions. The representative process of the surface texturing is lotus effect to give hydrophobic property by the lithography and chemical etching, which is the bio mimic from the nature. Surface texturing can be manufactured by a lot of processes, in particular using mechanical method such as a precise diamond turning, grinding, rolling, embossing, vibrorolling, and abrasive jet machining (AJM). Among them, the grinding process is notable in terms of the wide range of texturing area and fast processing time. The patterning by grinding is done by the grooved grinding wheel on the work piece. In this case, the pattern shape is determined by the grinding conditions as well as the wheel dressing conditions. In this paper, experimental study on the pattern shapes were done and provide the feasibility in use for the large area patterning.

Development of a Novel Fabrication Process for Multi-layered Microstructures using a Micro Milling and Deep X-ray Lithography (마이크로 밀링과 X-선 리소그래피 공정을 이용한 다층 마이크로 구조물 제작 공정 개발)

  • Kim, Jong Hyun;Chang, Suk Sang;Lim, Geunbae
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.3
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    • pp.269-275
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    • 2014
  • Conventional machining technologies such as a milling process have limitations in accuracy to fabricate microstructures. Deep X-ray lithography using the synchrotron radiation is a promising micromachining process with an excellent accuracy, whereas there are difficulties in the fabrication of multi-layered structures. Therefore, it is mainly used for fabricating simple mono-layered microstructures with a high aspect ratio. In this study, a novel technology for fabricating multi-layered microstructures is proposed by combining two processes. In advance, an X-ray resist material is cut and machined into various shapes and heights by the micro milling process. Subsequent X-ray irradiation process facilitates the fabrication of multi-layered microstructures. The proposed technology can overcome the limitation of the pattern accuracy in conventional milling process and the difficulty of the multi-layered machining in x-ray process. The usefulness of the proposed technology is demonstrated in this study by applying the technique in the realization of various multi-layered microstructures.

Study of ablation depth control of ITO thin film using a beam shaped femtosecond laser (빔 쉐이핑을 이용한 펨토초 레이저 ITO 박막 가공 깊이 제어에 대한 연구)

  • Kim, Hoon-Young;Yoon, Ji-Wook;Choi, Won-Seok;Stolberg, Klaus;Whang, Kyoung-Hyun;Cho, Sung-Hak
    • Laser Solutions
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    • v.17 no.1
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    • pp.1-6
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    • 2014
  • Indium tin oxide (ITO) is an important transparent conducting oxide (TCO). ITO films have been widely used as transparent electrodes in optoelectronic devices such as organic light-emitting devices (OLED) because of their high electrical conductivity and high transmission in the visible wavelength. Finding ways to control ITO micromachining depth is important role in the fabrication and assembly of display field. This study presented the depth control of ITO patterns on glass substrate using a femtosecond laser and slit. In the proposed approach, a gaussian beam was transformed into a quasi-flat top beam by slit. In addition, pattern of square type shaped by slit were fabricated on the surfaces of ITO films using femtosecond laser pulse irradiation, under 1030nm, single pulse. Using femtosecond laser and slit, we selectively controlled forming depth and removed the ITO thin films with thickness 145nm on glass substrates. In particular, we studied the effect of pulse number on the ablation of ITO. Clean removal of the ITO layer was observed when the 6 pulse number at $2.8TW/cm^2$. Furthermore, the morphologies and fabricated depth were characterized using a optical microscope, atomic force microscope (AFM), and energy dispersive X-ray spectroscopy (EDS).

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A Study on the Machinability of the Micro-EDM Depending on the Materials (재료변화에 따른 Micro-EDM에서의 가공성에 관한 연구)

  • Lee, Sang-Kuk;Kim, Tae-Hyun;Hong, Min-Sung
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.21 no.4
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    • pp.658-665
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    • 2012
  • Micro-EDM is widely used in metallic pattern, electronics, nuclear power and industry in the form of precision process. The improvement of Electro Discharge Machining has been on a steady progress since $19^{th}$ century. The technology has overcome the limits of the traditional precision process, enabling micro-EDM, micro electrolytic machining, micro drilling, micro punching and laser beam machining, which create versatile products with smaller sizes. What have been known about the major feature of Micro-EDM is high thermal energy so that their products are free from the hardness of their products as long as they are electrical conductor. However, each metal is suspected to have different features and natures even if they are created through the same procedure. In this thesis, the methodology of Micro-EDM and how to categorize them are explained. Also, the nature of the examined materials with surface shape and surface roughnes are analyzed. The results of the experiments are expected to understand surface roughness and workability of other materials for Micro-EDM.

A Study on the Characteristics of Silicon Micro-hole machining (단결정 실리콘 미세 홀 가공특성에 관한 연구)

  • Chae, Seung-Su;Lee, Sang-Min;Park, Hwi-Keun;Cho, Jun-Hyun;Lee, Jong-Chan;Heo, Chan
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.12 no.2
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    • pp.75-80
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    • 2013
  • Cathode is an essential component used in plasma etching process which is to make micro pattern on the silicon wafer. The currently used cathodes produce particles at the high temperature plasma etching process. To overcome this problem, a 'Silicon Only Cathode' was developed. This 'Silicon Only Cathode' requires manufacturing process changes due to the change of shapes, material features, and machining characteristics of work materials. This research investigates the small hole drilling process. The conclusion is that PCD drills with twist angles of $20^{\circ}$ and $25^{\circ}$ were tested for small hole drilling and the experimental results indicate that the drill with $25^{\circ}$ twist angle drill causes less thrust force.