• Title/Summary/Keyword: Pattern Fabrication

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Investigation on the Effect of Contact Load on Fine Pattern Fabrication by AFM (AFM을 이용한 미세 패턴 가공 시 접촉 하중에 따른 선폭 변화에 대한 연구)

  • Jo S.B.;Kim D.E.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.10a
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    • pp.502-505
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    • 2005
  • To overcome some of the limitations in the conventional photolithography technique, MC-SPL which has advantages such as flexibility and high speed was developed in the past. To make a fine pattern using MC-SPL, there are many variables to control, for example, applied load, scribing speed, chemical etching condition, and etc. In this work, the effect of contact load on the width of the pattern was investigated. The load not only influences the width of the pattern but it also affects the wear of the probe tip. It was found that it is beneficial to load the tip in two stages. Futhermore, the experimental results showed that the pattern width was more sensitive to the initial contact force.

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Die Making and Product Prototype Fabrication in Investment Casting by SLA Rapid Prototyping Technique (급속조형기술을 이용한 쾌속정밀주조 금형 및 시제품 제작)

  • Park, Moon-Sun;Kim, Dae-Hwan;Kwak, Jeong-Gi;Hwang, Sang-Moon;Kang, Beom-Soo
    • Journal of the Korean Society for Precision Engineering
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    • v.16 no.11
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    • pp.74-80
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    • 1999
  • In this study, a stereolithography apparatus (SLA) prototype is used as a master model to be transformed into the silicone pattern by vacuum tool forming. The tool for the first prototype is fabricated by using this silicone pattern. Following this procedure, a temporary tool with metal powder and epoxy for wax injection is prepared for the die set of quick change type which consists of upper and lower base die나 and an insert die. The die set of quick change type appears to be very effective in casting operation by changing tools rapidly. The original wax pattern is formed through the die set, and is made of lost-was. Finally the lost-wax pattern is applied to investment casting. The final casting product is checked regarding its dimensional accuracy.

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Fabrication of Real 3D Shape Components Using Bi-Sn Alloys (Bi-Sn 합금을 이용한 3차원 미세 구조물의 제작기술 개발)

  • Chung, Sung-Il;Park, Sun-Joon;Im, Yong-Gwan;Choi, Jae-Young;Jeong, Hae-Do
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.28 no.5
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    • pp.624-631
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    • 2004
  • In this paper, new replication techniques fur a metal microcomponent having a real 3D shape were introduced. Helical gear was selected as one of a real 3D microcomponents for this study. The helical gear, which was made of photo-curable resin, was fabricated as a master pattern by microstereolithography technology. Then, a silicone rubber mold was fabricated from the master pattern. Lastly, a final bismuth alloy pattern was transferred from the silicone rubber mold by the microcasting process. In this paper, the replication technique is described in detail from the master pattern to the final pattern with some investigation on factors related to the technique.

Fabrication of 70nm-sized metal patterns on flexible PET Film using nanoimprint lithography

  • Lee, Heon;Lee, Jong-Hwa
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08b
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    • pp.1119-1120
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    • 2007
  • Nano-sized metal patterns were successfully fabricated on flexible PET substrate using nanoimprint lithography. 70nm line and space PMMA resist pattern was formed on PET substrate without residual layer by 'artial filling effect' and 20nm thin Cr metal layer was deposited by e-beam evaporation. Then, PMMA resist was selectively removed by acetone and 70nm narrow Cr pattern was formed.

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Address Electrode for PDP by Ink-Jet Method

  • Park, Lee-Soon;Im, Moo-Sik;Jung, Young-Chul
    • 한국정보디스플레이학회:학술대회논문집
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    • 2003.07a
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    • pp.775-777
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    • 2003
  • Several methods are available for the fabrication of electrode pattern for the plasma display panel(PDP) including screen printing and photolithographic method. Piezo type ink-jet printing method is considered to the method of choice for electrode patterning in manufacturing of PDP. Both silver ink and absorbent layer paste formulation were developed for ink-jet printing of electrode pattern. The ink-jet printing of silver electrode with preformed absorbent layer was especially suitable for the patterning of address electrode for high resolution PDP.

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Wafer Fail Pattern Classification Simulation (웨이퍼 오류 패턴 인식 시뮬레이션)

  • 김상진;한영신;이칠기
    • Journal of the Korea Society for Simulation
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    • v.12 no.3
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    • pp.13-20
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    • 2003
  • Semiconductor Manufacturing has emerged as one of the most important world industries. Even with the highly automated and precisely monitored facilities used to process the complex manufacturing steps in a near particle free environment, processing variations in wafer fabrication still exist. The causes of these variations may arise from equipment malfunctions, delicate and difficult processing steps, or human mistakes. In this paper, we could specify the cause stage and the cause equipment and take countermeasures at a speed by the conventional method, without depending on the experience and skills of the engineer

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Fabrication of 70nm-sized metal patterns on flexible PET Film using nanoimprint lithography

  • Lee, Heon;Lee, Jong-Hwa
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2007.04a
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    • pp.24-25
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    • 2007
  • Nano-sized metal patterns were successfully fabricated on flexible PET substrate using nanoimprint lithography. 70nm line and space PMMA resist pattern was formed on PET substrate without residual layer by "partial filling effect' and 20nm thin Cr metal layer was deposited by e-beam evaporation. Then, PMMA resist was selectively removed by acetone and 70nm narrow Cr pattern was formed.

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