• Title/Summary/Keyword: Paper packaging

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Advanced Paper Machine Concepts for the Production of Packaging Papers

  • Kruska, D.;Mirsberger, P.
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.29 no.3
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    • pp.69-81
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    • 1997
  • Up to now 5 Voith Sulzer paper machines with multi-layer headbox and Gapfor-mer are sucessfully running on papckaging papers. Linerboard, testliner and corugating medium is produced in the basis weight range from 105 to 275 $g/m^2$ at machine speeds up to 900 m/min. The nest one, starting up in Oct. `96 in Germany, will be the world's fastest paper machine for packaging papers. The 5.6 m wide machine is designed for a maximum operating speed of 1200 m/min. Approx. 220.000 tons of corrugating medium and testliner based on 100% waste paper in the basis weight range from 90 to 160 $g/m^2$ will be produced each year. An expansion stage planned for the future is intended to increase annual output to 280.000 tons. This machine will not only be the fastest one for packaging papers, it also comprises all described innovative key components which are available today in order to fulfill growing demands of the future with regard to quality and productivity. The concept of this advanced machine is shown in Fig. 9.

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The Study on Storage Stability according to Packaging Material of Traditional Sesame Dasik (깨다식의 포장재에 따른 저장성 조사)

  • 김진숙;한영실
    • The Korean Journal of Community Living Science
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    • v.15 no.2
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    • pp.179-187
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    • 2004
  • The purpose of this study is to investigate the preservation of traditional sesame dasik when stored in different packaging material by comparing its physical and sensorial characteristics. The quality and sensory characteristics of sesame dasik that were evaluated were moisture content, water activity, number of microflora, texture profile, Hunter color different value, and sensory properties (color, chewiness, overall acceptability, etc) during the storage at 35\pm1^\circ{C}$ temperature and $73\pm{2%}$ relative humidity. And the packaging materials were paper boxes (coated 0.02mm thickness polyethylene film), plastic boxes, and oriented polypropylene laminated film. Traditional sesame dasik is made from sesame powder 100g, honey 25g, rice syrup 25g, and table salt 0.5g. During the storage period, the changes in water content and water activity of sesame dasik with different packaging material showed a slight decline. On the other hand, it increased in hardness, and "a" and "b" value of Hunter color difference during the storage. Texture profile analysis data change in hardness was the greatest after the third day in a paper box, and it was affected by the moisture content of dasik and the temperature and relative humidity of the air. Therefore plastic boxes or oriented polypropylene laminated film was found to be better suited than paper boxes for storing sesame dasik.

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화섬용 지관의 강도향상에 관한 연구

  • Lee, Myeong-Hun;Kim, Jae-Neung;Kim, Jong-Gyeong
    • Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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    • 2004.04a
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    • pp.40-48
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    • 2004
  • Paper tube industry for synthetic fiber packaging has approximately 200 billion won of market size in Korea, while any significant research has not done yet about physical characteristics of paper tubes. This study was conducted to find out a adequate structure of paper tubes by changing compositions of paperboards, size of tubes, and makers. Parallel compression strength was not only rely on compositions of paperboards, but also largely impacted by structural design of paper tubes.

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Design Optimization of Ball Grid Array Packaging by the Taguchi Method

  • Kim, Yeong-K.;Kim, Jae-chang;Choi, Joo-Ho
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.4
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    • pp.67-72
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    • 2010
  • In this paper, a design optimization of ball grid array packaging geometry is studied based on the Taguchi method, which allowed robust design by considering the variance of the input parameters during the optimization process. Molding compound and substrate were modeled as viscoelastic, and finite element analyses were performed to calculate the strain energy densities of the eutectic solder balls. Six quality factors of the dimensions of the packaging geometry were chosen as control factors. After performing noise experiments to determine the dominant factors, main experiments were conducted to find the optimum packaging geometry. Then the strain energy densities between the original and optimized geometries were compared. It was found that the effects of the packaging geometry on the solder ball reliability were significant, and more than 40% of the strain energy density was reduced by the geometry optimization.