• 제목/요약/키워드: Paper chip

검색결과 3,326건 처리시간 0.034초

직교배열법에 의한 칩절단특성 예측 (Pridiction of chip breakability by an orthogonal array method)

  • 이영문;양승한;권오진
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 2001년도 춘계학술대회 논문집
    • /
    • pp.1008-1011
    • /
    • 2001
  • The purpose of this paper is to evaluate the chip breakability during turning using the experimental equation, which is developed by an orthogonal array method. The chip breaking index(CB), non-dimensional parameter is used in the evaluation of chip breakability. The analysis of variance(ANOVA)-test has been used to check the significance of cutting parameters. And using the result of ANOVA-test, the experimental equation of chip breakability, which consists of significant cutting parameters, has been developed.

  • PDF

백프로파게이션 알고리즘을 이용한 칩 형태의 인식 (Identification of the Chip Form Using Back Propagation Algorithm)

  • 심재형;권혁준;백인환
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 1996년도 추계학술대회 논문집
    • /
    • pp.206-211
    • /
    • 1996
  • A major problem in automation of turning operation is the difficulty in obtaining a sufficient and reliable chip control. Therefore it becomes desirable to find a method which can detect the chip form. In this paper, a method of the identification of chip form using output of pyrometer and neural network technique is developed. An efficiency of developed method is examined by experiments in turning and the validity of it is confirmed.

  • PDF

반도체 칩 캡슐화 공정의 최적조건에 관한 연구 (A Study on Optimal Process Conditions for Chip Encapsulation)

  • 허용정
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 1995년도 춘계학술대회 논문집
    • /
    • pp.477-480
    • /
    • 1995
  • Dccisions of optimal filling conditions for the chip encapsulation have been done primarily by an ad hoc use of expertise accumulated over the years because the chip encapsulation process is quite complicated. The current CAE systems do not provide mold designers with necessary knowledge of the chip encapsulation for the successful design of optimal filling except flow simulation capability. There have been no attempts to solve the optimal filling problem in the process of the chip encapsulation. In this paper, we have constructed an design system for optimal filling to avoid short shot in the chip encapsulation process which combines an optimization methodology with CAE software.

  • PDF

A Multi-Level Knowledge-Based Design System for Semiconductor Chip Encapsulation

  • Huh, Y.J.
    • 마이크로전자및패키징학회지
    • /
    • 제9권1호
    • /
    • pp.43-48
    • /
    • 2002
  • Semiconductor chip encapsulation process is employed to protect the chip and to achieve optimal performance of the chip. Expert decision-making to obtain the appropriate package design or process conditions with high yields and high productivity is quite difficult. In this paper, an expert system for semiconductor chip encapsulation has been constructed which combines a knowledge-based system with CAE software.

  • PDF

종이기반 농도 구배 형성 칩을 통한 포도당 발색 반응 검사 (A Colorimetric Glucose Assay via Concentration Gradient Paper Chip)

  • 김태훈;신현영;이윤일;태기식;김민석
    • 대한의용생체공학회:의공학회지
    • /
    • 제38권6호
    • /
    • pp.302-307
    • /
    • 2017
  • This paper presents a paper-based concentration gradient chip to analyze colorimetric glucose assay. The paper-based concentration gradient chip was fabricated through a wax patterning technique that can design the fluidic channel by selectively printing hydrophobic and hydrophilic areas. Afterwards, glucose and dilution solutions were loaded into the inlet of a concentration gradient chip and each solution was then mixed sequentially at mixing channel. Finally, concentration gradient was formed at each outlet of the chip. To measure the glucose concentration of the solution in outlets, we conducted colorimetric glucose assay with fixed concentration of glucose solution (0, 5, 10, 15 and 20 mM) and obtained normalized intensity. Subsequently, glucose concentrations of the outlets were calculated by substituting the normalized intensity to linear regression function based on the normalized intensity of fixed glucose concentration. Finally, the concentration gradient of glucose was formed on the chip with the result of colorimetric assay. The concentration gradient paper chip has the potential to accurately analyze unknown glucose concentration.

Digital Hearing Aid DSP Chip Parameter Fitting Optimization

  • Jarng, Soon-Suck;Kwon, You-Jung;Lee, Je-Hyung
    • 제어로봇시스템학회:학술대회논문집
    • /
    • 제어로봇시스템학회 2005년도 ICCAS
    • /
    • pp.1820-1825
    • /
    • 2005
  • DSP chip parameters of a digital hearing aid (HA) should be optimally selected or fitted for hearing impaired persons. The more precise parameter fitting guarantees the better compensation of the hearing loss (HL). Digital HAs adopt DSP chips for more precise fitting of various HL threshold curve patterns. A specific DSP chip such as Gennum GB3211 was designed and manufactured in order to match up to about 4.7 billion different possible HL cases with combination of 7 limited parameters. This paper deals with a digital HA fitting program which is developed for optimal fitting of GB3211 DSP chip parameters. The fitting program has completed features from audiogram input to DSP chip interface. The compensation effects of the microphone and the receiver are also included. The paper shows some application examples.

  • PDF

칩브레이커 형상변수에 의한 칩유동각 예측 (The Prediction of Chip Flow Angle on chip Breaker Shape Parameters)

  • 박승근
    • 한국생산제조학회지
    • /
    • 제9권2호
    • /
    • pp.96-101
    • /
    • 2000
  • In machining with cutting tool inserts having complex chip groove shape the flow curl and breaking pattern of the chip are different than in flat-face inserts. In the present work an effort is made to understand the three basic phe-nomena occurring in a chip since its formation in machining with groove type and pattern type inserts. These are the ini-tial chip flow the subsequent development of up and side curl and the final chip breaking due to the development of tor-sional and bending stresses. in this paper chip flow angle in a groove type and pattern type inserts. The expres-sion for chip flow angle in groove type and pattern type inserts is also verified experimentally using high speed filming techniques.

  • PDF

칩브레이커 형상변수에 의한 칩유동각 예측 (The Prediction of Chip Flow Angle on Chip Breaker Shape Parameters)

  • 박승근
    • 한국공작기계학회:학술대회논문집
    • /
    • 한국공작기계학회 1999년도 추계학술대회 논문집 - 한국공작기계학회
    • /
    • pp.381-386
    • /
    • 1999
  • In machining with cutting tool inserts having complex chip groove shape, the flow, curl and breaking patterns of the chip are different than in flat-face type inserts. In the present work, an effort is made to understand the three basic phenomena occurring in a chip since its formation in machining with groove type and pattern type inserts. These are the initial chip flow, the subsequent development of up and side curl and the final chip breaking due to the development of torsional and banding stresses. In this paper, chip flow angle in a groove type and pattern type inserts. The expression for chip flow angle in groove type and pattern type insets is also verified experimentally using high speed filming techniques.

  • PDF

Web 기반 Chip Mounter의 원격 관리 (The Remote Supevisory of Chip Mounter Using Web)

  • 임선종;박경택
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 2002년도 추계학술대회 논문집
    • /
    • pp.488-491
    • /
    • 2002
  • This growth if WWW(World Wide Web) with the spread of ADSL provides us with a variety of service that are the extensions of opportunities to get information. a various education methods by remote courses and electronic commerce. Remote Monitoring Server(RMS) that uses internet and WWW is constructed for chip mounter. Hardware base consists of RMS, chip mounter and C/S server. In this paper, we realize the remote management system with monitoring and diagnosis function to efficiently operate chip mounter the one of PCB assembly equipment. The remote management system for chip mounter consists of RMS(Remote Monitoring Server) and C/S server. RMS manages real-time information from chip mounter through TCP/IP. RMS that utilizes real-time information informs user of the actual output the operation status of chip mounter, user of the actual output, the operation status of chip mounter, the trouble code and the trouble description.

  • PDF

Design and Contact Force Control of a Flip Chip Mounting Head system

  • Kim, Kyoung-Jun;Shim, Jae-Hong
    • 제어로봇시스템학회:학술대회논문집
    • /
    • 제어로봇시스템학회 2003년도 ICCAS
    • /
    • pp.1060-1065
    • /
    • 2003
  • This paper contributes to development of a new chip mounting head system for flip chip. Recently, the LDM(Linear DC Motor) has been widely used, because it has particular merits than the rotary type motors. In this paper, we proposed a macro/micro positioning system for force control of a chip mounting system. In the proposed macro/micro system, the macro actuator provide the system with a gross motion while the micro device yields fine tuned motion to reduce the harmful impact force that occurs between very small sized electronic parts and PCB surface. In order to prove the effectiveness of the proposed macro/micro chip mounting system, we compared the proposed chip mounting head with the conventional chip mounting head equipped with a macro actuator only. A series of experiments were executed under the mounting conditions of various access velocities and PCB stiffness. As a result of this study, a satisfactory voice coil actuator as the micro actuator has been developed, and its performance meet well the specifications desired for the design of the chip mounting head system and show good correspondence between theoretical analysis and experimental results.

  • PDF