• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.697-698
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• 2009

• Journal of Veterinary Clinics
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• v.34 no.4
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• pp.249-254
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• 2017

The cutaneous microcirculation plays a role in various physiological processes and pathological conditions. Two non-invasive methods were used in this study to obtain reference values for cutaneous microcirculation in intact male beagles. Twenty intact male beagles were used. The experimental environments were standardized. Laser Doppler flowmetry was used to measure cutaneous blood flow, and an infrared thermometer was used to measure cutaneous temperature. The blood flow and temperature were measured from the right side of the subjects at 20 cutaneous sites. Based on the laser Doppler flowmetry, the region with the highest blood flow was the periocular region that with the lowest was the forelimb foot pad. In addition, the standard deviation of the chest wall was the highest while that of the periocular region was the lowest. For skin temperature, the inguinal region had the highest mean skin temperature and the forelimb foot pad had the lowest. The correlation coefficient between the two methods was 0.72. Similar to a previous study, the values derived from repeated measurements at the 20 regions are reproducible and can contribute to research. Compared to the results of a previous study, the temperatures of the two smallest skin regions were the same; however, no specific trend was observed. The correlation coefficient between the two methods was significantly comparable, and this good correlation can reduce their limitations and variables complementarily. In addition to possible use in human studies, accumulated resources on measurements of skin blood flow in the future will potentiate its use in the veterinary medicine field.

• Proceedings of the KSR Conference
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• 2002.05a
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• pp.207-212
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• 2002

The actual buckling of the railroad track structure is suspected to be a complex interaction between the vertical, lateral and torsional modes. To make the analysis tractable, however, most studies restrict themselves to either the vertical or the horizontal plane. Based on a comprehensive and realistic three-dimensional track model developed in the previous study, three dimensional buckling analysis of CWR track subjected to temperature load was performed. Using the study on buckling temperature and mode, sensitivity of track components such as tie spacing, ballast resistance, stiffness of pad-fastening system and rail size were investigated.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.1
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• pp.26-32
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• 2012

Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This study will report the characteristic of wafer according to processing time, machining speed and pressure which have major influence on the abrasion of Si wafer polishing. It is possible to evaluation of wafer abrasion by load cell and infrared temperature sensor. The characteristic of wafer surface according to processing condition is selected to use a result data that measure a pressure, machining speed, and the processing time. This result is appeared by the characteristic of wafer surface in machining condition. Through that, the study cans evaluation a wafer characteristic in variable machining condition. It is important to obtain optimal condition. Thus the optimum condition selection of ultra precision Si wafer polishing using load cell and infrared temperature sensor. To evaluate each machining factor, use a data through each sensor. That evaluation of abrasion according to variety condition is selected to use a result data that measure a pressure, machining speed, and the processing time. And optimum condition is selected by this result.

• Transactions of the Korean Society of Automotive Engineers
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• v.15 no.1
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• pp.154-161
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• 2007

Hot spot phenomenon that occurs, during judder vibration, is locally concentrated heat due to friction between brake disk and pad. It is important to understand the reason behind hot spot phenomenon, for reduction of judder vibration. In this experimental study, experiments were performed in accordance with rotation speed of brake disk, pressure of master cylinder and pad length for achieving different aspects of hot spot phenomenon. Temperature distribution of hot spot was obtained by using the infrared camera. As the hot spot occurred, vibration was measured and frequency analysis was performed. Finite element analysis of thermal deformation of disk was performed by using temperature distribution that was achieved by experimental results. And mode shapes of disk was analyzed by finite element analysis and compared with experimental results. It was observed that the excitation frequency band of frictional contact and frictional force mainly affects the hot spot phenomenon.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.40 no.3
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• pp.245-252
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• 2016

In this study, an alternative bend design is proposed to overcome the aging problem in piping bends. In this design, the foam pad is not included. Finite element analysis was performed based on the total pipe diameter. From this analysis, the shape of the Shear Control Ring (SCR) was determined. Temperature, stress, and other data of the proposed reinforced pipe were acquired and analyzed after the test was performed. The value of the thermal stress for the reinforced steel pipe satisfied the required standard without the foam pad based on the manufacturing of the reinforced fitting and construction site of the test. The reinforcement provided a shear strength level for the foam pad that resulted in maximum shear stress less than stress based on the original foam pad applied at the pipe bend. Additionally, an increasing factor of safety effect for the reinforced fitting application was discovered.

• Journal of Aerospace System Engineering
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• v.14 no.3
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• pp.51-59
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• 2020

In the case of cubesat, a PCB-based deployable solar panel advantageous in terms of weight reduction and electrical circuit design is widely used considering the limited weight and volume of satellites. However, because of the low thermal conductivity of PCB, there is a limit relative to heat dissipation. In this paper, the thermal gap pad is applied to the contact between the PCB-based solar panel and the aluminum stiffener mounted on the outside of the panel. Thus, the heat transfer from the solar cell to the rear side of the panel is facilitated. It maximizes the heat dissipation performance while maintaining the merits of PCB panel, and thus, it is possible to improve the power generation efficiency from reducing the temperature of the solar cell. The effectiveness of the thermal design of the 6U cubesat's deployable solar panel using the thermal gap pad has been verified through on-orbit thermal analysis based on the results, compared with the conventional PCB-based solar panel.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 1999.06a
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• pp.92-100
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• 1999

Friction characteristics of automotive friction materials according to the types of phenolic resin were investigated by using a pad-on-disk type friction tester. Four different simplified friction materials bound with Bakelite$^{TM}$ and Xylok$^{TM}$ phenolic resin were studied in this work. Two different modes of drag test(constant initial temperature test and constant interval test) were employed to analyze the effects of the binders on friction characteristics. Friction materials containing modified Xylok$^{TM}$ resin showed good heat resistance and friction stability. The results also showed that aramid fiber played important roles in improving friction stability and weard wear

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.3
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• pp.729-737
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• 1994

A three-dimensional finite element model of a 20-pin plastic dual-in-line package(PDIP) plugged into a PCE has been developed by using the finite element code ANSYS. The model has been used for thermal characterization of the package during its normal operation under natural convection cooling. Temperature distributions in the package and PCB are obtained from numerical analysis and compared with experimentally measured data. Various cases are assumed and analyzed to study the effects of package and PCB materials on thermal characteristics of PDIP with and without aluminum heatspreader. Thermal dissipation capability of PDIP is greatly increased due to copper die pad/lead frame and heatspreader. However, thermally induced stresses in the package and fatigue life of chip are improved for PDIP with Alloy 42 die pad/lead frame and no heatspreader. It is also found that the role of PCB on thermal characteristics of PDIP is very imporatant.

• Proceedings of the KSR Conference
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• 2002.10b
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• pp.779-786
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• 2002

The Friction Brake Pad of High Speed Train is the most important parts in brake system, which is usually made of Cu-based Sintered friction material. This study has been carried out about the formulation effects of sintered friction material and made lots of sample brake pads. Then, we have done the performance test of the developed product by using full scale inertia Dynamo-meter. This performance test (braking speed 300km/h) was conducted as GEC Alsthom Standard test procedure and High Speed Brake Test (braking speed 350km/h) was done at "Poli" in Italy. The friction properties of this product was almost identical with the brake pad which is currently used to TGV. And the temperature of brake disk on braking speed 350Km/h was a little higher.