• 제목/요약/키워드: Packaging method

검색결과 945건 처리시간 0.029초

Headspace 방법과 tenax 방법을 이용한 잔존 용제 분석 방법의 비교 (Comparison of analytical method of headspace and tenax analysis for residue of solvent amounts on plastic packaging materials)

  • 안덕준
    • 한국포장학회지
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    • 제10권1호
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    • pp.63-68
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    • 2004
  • The regulations for migration amounts in USA, EU and Korea are investigated to compare the actual overall and specific migration date from plastic food packaging materials. Among the packaging materials regulated in above countries, printing ink solvents on packaging materials is used very widely and sometimes cause off-flavor in the food by migration of residual solvents. Even though migration of the residual solvents dose not generally cause safety problems in the contained food, it certainly can generate off-flavor and finally deteriorate quality of the finished product. Therefore regulation and development of analytical method for amount of residual ink solvents are very important issue in food industry. The headspace analytical method and tenax method for residual ink solvent on food packaging materials were evaluated from the accuracy, precise, swiftness and convenience of viewpoint. Headspace analytical method was selected and recommended for using in food industry field.

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노인을 위한 가정배달급식의 포장방법 및 저장조건에 따른 물성ㆍ관능적 품질 변화 3 (Changes of Physical and Sensory Quality in Home-delivered meals for elderly as affected by Packaging methods and Storage conditions 3)

  • 김혜영;류시현
    • 한국식품조리과학회지
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    • 제19권3호
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    • pp.374-389
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    • 2003
  • The Purpose of this study was to propose the most effective packaging method and storage conditions to apply to home-delivered meals for the elderly Changes in the physical and sensory qualities of pan fried oak mushroom and meat, soy sauce glazed hair tail and roasted dodok, in wrap packaging, top sealing and vacuum packaging were evaluated during storage at 25, 4 and -18$^{\circ}C$, for 5 days. The speed of falling-off in the foods qualities, under chilled and frozen storage conditions did not differ much as the 5 day storage period was too short for a proper assessment. The sensory characteristics of taste and texture were better evaluated in the chilled than in the frozen storage. The most effective packaging method at all the storage temperatures was the vacuum packaging, which assured the safety of the foods by the removal of oxygen. The lightness, springiness and hardness were significantly influenced by the storage temperature, period and packaging method, while the sensory characters were affected by storage temperature and the period. In conclusion, the quality of the vacuum packed pan fried oak mushroom and meat and soy sauce glazed hair tail, in frozen storage, were still fresh after the five days of the experiment. The shelf-life of those foods with wrap packaging, in chilled storage, were suggested to be three days. The quality of the roasted dodok, with vacuum packaging in chilled storage, was preserved for five days.

유과 반죽의 콩물 농도 및 Incubation time과 포장방법이 유과의 저장 중 품질 특성에 미치는 영향 (Effect of Bean Water Concentration and Incubation Time of Yukwa Paste and Packaging Method on the Quality of Yukwa)

  • 조미나;전형주
    • 한국식품과학회지
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    • 제33권3호
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    • pp.294-300
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    • 2001
  • 저장 방법의 차이에 따른 유과의 과산화물가는 대바구니 포장이 가장 높았으며, 질소 치환 포장, 냉동 저장 순으로 나타났고, 저장 기간 증가에 따라 현저히 증가하였다. 콩물 농도가 증가함에 따라 과산화물가도 증가하였으나 incubation 시간 증가에 따른 차이는 유의적이지 않았다. 유과의 hardness는 콩물 농도, incubation 시간과 저장 기간의 증가에 따라 현저한 감소를 나타냈으나 저장 방법간에는 유의적인 차이를 나타내지 않았다. Peak number는 저장 기간 10주까지는 냉동 저장군이 다른 군보다 높게 나타났으나, 12주에는 이러한 차이가 나타나지 않았고, 저장 기간 증가에 따라서 증가하였다. 저장 3개월 후 관능 검사 결과, 유과의 색은 저장 방법과 콩물의 농도에 따라서 용적 증가율은 콩물 농도와 incubation 시간에 따라 유의적인 차이가 있었다. 산패취는 저장 방법에 따라서만 유의적인 차이가 있었으며, 부드러운 정도, 맛, 종합적 기호도는 콩물의 농도에 따라서만 유의적 차이가 있었다.

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Four Point Bending Test for Adhesion Testing of Packaging Strictures: A Review

  • Mahan, Kenny;Han, Bongtae
    • 마이크로전자및패키징학회지
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    • 제21권4호
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    • pp.33-39
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    • 2014
  • To establish the reliability of a packaging structures, adhesion testing of key interfaces is a critical task. Due to the material mismatch, the interface may be prone to delamination failure due to conditions during the manufacturing of the product or just from the day-to-day use. To assess the reliability of the interface adhesion strength testing can be performed during the design phase of the product. One test method of interest is the four-point bending (4PB) adhesion strength test method. This test method has been implemented in a variety of situations to evaluate the adhesion strength of interfaces in bimaterial structures to the interfaces within thin film multilayer stacks. This article presents a review of the 4PB adhesion strength testing method and key implementations of the technique in regards to semiconductor packaging.

Design Optimization of Ball Grid Array Packaging by the Taguchi Method

  • Kim, Yeong-K.;Kim, Jae-chang;Choi, Joo-Ho
    • 마이크로전자및패키징학회지
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    • 제17권4호
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    • pp.67-72
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    • 2010
  • In this paper, a design optimization of ball grid array packaging geometry is studied based on the Taguchi method, which allowed robust design by considering the variance of the input parameters during the optimization process. Molding compound and substrate were modeled as viscoelastic, and finite element analyses were performed to calculate the strain energy densities of the eutectic solder balls. Six quality factors of the dimensions of the packaging geometry were chosen as control factors. After performing noise experiments to determine the dominant factors, main experiments were conducted to find the optimum packaging geometry. Then the strain energy densities between the original and optimized geometries were compared. It was found that the effects of the packaging geometry on the solder ball reliability were significant, and more than 40% of the strain energy density was reduced by the geometry optimization.