• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.10 no.1
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• pp.63-68
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• 2004

The regulations for migration amounts in USA, EU and Korea are investigated to compare the actual overall and specific migration date from plastic food packaging materials. Among the packaging materials regulated in above countries, printing ink solvents on packaging materials is used very widely and sometimes cause off-flavor in the food by migration of residual solvents. Even though migration of the residual solvents dose not generally cause safety problems in the contained food, it certainly can generate off-flavor and finally deteriorate quality of the finished product. Therefore regulation and development of analytical method for amount of residual ink solvents are very important issue in food industry. The headspace analytical method and tenax method for residual ink solvent on food packaging materials were evaluated from the accuracy, precise, swiftness and convenience of viewpoint. Headspace analytical method was selected and recommended for using in food industry field.

• Korean journal of food and cookery science
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• v.19 no.3
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• pp.374-389
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• 2003

The Purpose of this study was to propose the most effective packaging method and storage conditions to apply to home-delivered meals for the elderly Changes in the physical and sensory qualities of pan fried oak mushroom and meat, soy sauce glazed hair tail and roasted dodok, in wrap packaging, top sealing and vacuum packaging were evaluated during storage at 25, 4 and -18$^{\circ}C$, for 5 days. The speed of falling-off in the foods qualities, under chilled and frozen storage conditions did not differ much as the 5 day storage period was too short for a proper assessment. The sensory characteristics of taste and texture were better evaluated in the chilled than in the frozen storage. The most effective packaging method at all the storage temperatures was the vacuum packaging, which assured the safety of the foods by the removal of oxygen. The lightness, springiness and hardness were significantly influenced by the storage temperature, period and packaging method, while the sensory characters were affected by storage temperature and the period. In conclusion, the quality of the vacuum packed pan fried oak mushroom and meat and soy sauce glazed hair tail, in frozen storage, were still fresh after the five days of the experiment. The shelf-life of those foods with wrap packaging, in chilled storage, were suggested to be three days. The quality of the roasted dodok, with vacuum packaging in chilled storage, was preserved for five days.

• Korean Journal of Food Science and Technology
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• v.33 no.3
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• pp.294-300
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• 2001

Effect of bean water concentration and incubation time of Yukwa paste as well as packaging method on the quality of Yukwa was investigated. Quality loss in Yukwa during storage was dependent on the packaging method such as bamboo packaging at $30^{\circ}C$, nitrogen packaging at $30^{\circ}C$ and LDPE packaging at $-18^{\circ}C$. Peroxide value increased with bean water concentration, but showed no significant difference by incubation time. The hardness of Yukwa decreased with the increase of bean water concentration, incubation time, and storage time but showed no significant difference by packaging method. Sensory evaluation after storage for 3 months showed that Yukwa color was significantly influenced by packaging method and bean water concentration. The volume was also significantly influenced by bean water concentration and incubation time. Off-flavor showed significant difference by storage method. Tenderness, taste and overall desirability showed significant difference by bean water concentration. Crispness showed significant difference by storage method and bean water concentration.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.33-39
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• 2014

To establish the reliability of a packaging structures, adhesion testing of key interfaces is a critical task. Due to the material mismatch, the interface may be prone to delamination failure due to conditions during the manufacturing of the product or just from the day-to-day use. To assess the reliability of the interface adhesion strength testing can be performed during the design phase of the product. One test method of interest is the four-point bending (4PB) adhesion strength test method. This test method has been implemented in a variety of situations to evaluate the adhesion strength of interfaces in bimaterial structures to the interfaces within thin film multilayer stacks. This article presents a review of the 4PB adhesion strength testing method and key implementations of the technique in regards to semiconductor packaging.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.67-72
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• 2010

In this paper, a design optimization of ball grid array packaging geometry is studied based on the Taguchi method, which allowed robust design by considering the variance of the input parameters during the optimization process. Molding compound and substrate were modeled as viscoelastic, and finite element analyses were performed to calculate the strain energy densities of the eutectic solder balls. Six quality factors of the dimensions of the packaging geometry were chosen as control factors. After performing noise experiments to determine the dominant factors, main experiments were conducted to find the optimum packaging geometry. Then the strain energy densities between the original and optimized geometries were compared. It was found that the effects of the packaging geometry on the solder ball reliability were significant, and more than 40% of the strain energy density was reduced by the geometry optimization.

• The monthly packaging world
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• s.361
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• pp.74-78
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• 2023

• The monthly packaging world
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• s.107
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• pp.175-179
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• 2002

• The monthly packaging world
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• no.7 s.183
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• pp.52-61
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• 2008

• The monthly packaging world
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• s.170
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• pp.60-76
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• 2007

• The monthly packaging world
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• s.139
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• pp.136-151
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• 2004