• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.11-19
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• 2015

Since CMOS device scaling has stalled, three-dimensional (3-D) integration allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. 3-D integration has many benefits such as increased multi-functionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, because it vertically stacks multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip. Anticipated applications start with memory, handheld devices, and high-performance computers and especially extend to multifunctional convengence systems such as cloud networking for internet of things, exascale computing for big data server, electrical vehicle system for future automotive, radioactivity safety system, energy harvesting system and, wireless implantable medical system by flexible heterogeneous integrations involving CMOS, MEMS, sensors and photonic circuits. However, heterogeneous integration of different functional devices has many technical challenges owing to various types of size, thickness, and substrate of different functional devices, because they were fabricated by different technologies. This paper describes new 3-D heterogeneous integration technologies of chip self-assembling stacking and 3-D heterogeneous opto-electronics integration, backside TSV fabrication developed by Tohoku University for multifunctional convergence systems. The paper introduce a high speed sensing, highly parallel processing image sensor system comprising a 3-D stacked image sensor with extremely fast signal sensing and processing speed and a 3-D stacked microprocessor with a self-test and self-repair function for autonomous driving assist fabricated by 3-D heterogeneous integration technologies.

• Journal of Sensor Science and Technology
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• v.24 no.4
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• pp.264-269
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• 2015

An infrared (IR) bolometer measures the change of resistance by absorbing incident IR radiation and generates a signal as a function of the radiation intensity. Since a bolometer requires temperature stabilization and light filtering except for the infrared rays, it is essential for the device to be packaged meeting conditions that above mentioned. Minimization of heat loss is needed in order to stabilize temperature of bolometer. Heat loss by conduction or convection requires a medium, so the heat loss will be minimized if the medium is a vacuum. Therefore, vacuum packaging for bolometer is necessary. Another important element in bolometer packaging is germanium (Ge) window, which transmits IR radiation to heat the bolometer. To ensure a complete transmittance of IR light, anti-reflection (AR) coatings are deposited on both sides of the window. Although the transmittance of Ge window is high for IR rays, it is difficult to use frequently in low-price IR bolometer because of its high price. In this paper, we fabricated IR window by utilizing silicon (Si) substrate instead of Ge in order to reduce the cost of bolometer packaging. To enhance the IR transmittance through Si substrate, it is textured using Reactive Ion Etching (RIE). The texturing process of Si substrate is performed along with the change of experimental conditions such as gas ratio, pressure, etching time and RF power.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.5 no.1
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• pp.1-5
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• 1999

To improve freshness maintenance function of food containers, many methods have been applied. Most of the methods utilize absorption properties of porous ceramics powders. However, this kind of methods was appeared to be a non-realistic one because of the short effective periods of the produce and reduced die life due to the ceramic powders mixed in the raw materials. Other methods, e.g., CA or MA, need more study for practical application bemuse of the high cost in process. In addition to this, different method should be applied depends on foods. In this paper, a new technology based on information templation was applied in making a food preservation film. It has been known recently that water memorizes informations and this information could be tempelated to other materials through appropriate pretest. One of the participating company developed this process to template informations to PE materials unitizing water as an information rallier. Food packaging film was made using this PE chips. Experimental results of freshness maintenance test of foods showed that it is effective. Results and disussions are reported in this paper.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.84-87
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• 2003

Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.

• Journal of the Korean Ceramic Society
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• v.42 no.10 s.281
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• pp.698-702
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• 2005

Dielectric and Piezoelectric properties of complex perovskite 0.92Pb($Zr_{1/2}Ti_{1/2})O_{3}-(0.08-x)Pb(Cu_{1/3}Nb_{2/3})O_{3}-xPb(Mn_{1/3}Nb_{2/3})O_{3}(0{\leq}x{\leq}0.080$) (PZT-PCN-PMN) system were investigated as a function of PMN content. With the increase of PMN content of the sintered specimens, tetragonal phase was coexisted with rhombohedral phase, the dielectric constant was decreased, mechanical quality factor ($Q_{m}$) was inceased, and optimal sintering temperature was increased up to 1050$^{\circ}C$. For the composition of x = 0.064 sintered at 1050$^{\circ}C$ for 2 h, 1939 of maximum mechanical quality factor ($Q_{m}$), 57$\%$ of electromechanical coupling factor ($k_{p}$), and 1100$^{\circ}C$ of dielectric constant, 0.37$\% $ of dielectric loss (tan $\delta$) were obtained.

• Journal of Biosystems Engineering
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• v.41 no.3
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• pp.221-231
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• 2016

Purpose: The objective of this study was to develop cushion curves models and analyze the cushioning performance of multi-layered corrugated structures (MLCS) using a method based on dynamic stress-energy relationship. Methods: Cushion tests were performed for developing cushion curve models under 12 combinations of test conditions: three different combinations of drop height, material thickness, and static stress for each of four levels of energy densities between 15 and $60kJ/m^3$. Results: Dynamic stress and energy density for MLCS followed an exponential relationship. Cushion curve models were developed as a function of drop height, material thickness, and static stress for different paperboards and flute types. Generally, the differences between the shock pulse (transmitted peak acceleration) and cushion curve (position and width of belly portion) for the first drop and the averaged second to fifth drop were greater than those for polymer-based cushioning materials. Accordingly, the loss of cushioning performance of MLCS was estimated to be greater than that of polymer-based cushioning materials with the increasing number of drops. The position of the belly of the cushion curve of MLCS tends to shift upward to the left with increasing drop height, and the belly portion became narrower. However, depending on material thickness, under identical conditions, the cushion curve of MLCS showed an opposite tendency. Conclusions: The results of this study can be useful for environment-friendly and optimal packaging design as shock and vibrations are the key factors in cushioning packaging design.

• Proceedings of the Korean Society for Applied Microbiology Conference
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• 2000.10a
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• pp.31-50
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• 2000

Almost all currently available retroviral vectors based on murine leukemia virus (MLV) contain one or more viral coding sequences Because these sequences are also present in the packaging genome, it has been suggested that homologous recombination may occur between the same nucleotide sequence in the packaging genome and the vector, resulting in the production of replication competent retrovirus (RCR). Up until now, it has been difficult to completely remove viral coding sequences since some were thought to be involved in the optimum function of the retroviral vector. For example, the gag coding sequence present in almost all available retroviral vectors has been believed to be necessary for efficient viral packaging, while the pol coding sequence present in the highly efficient vector MFG has been thought to be involved in achieving the high levels of gene e(pression. However, we have now developed a series of reroviral vectors that are absent of any retroviral coding sequences but produce even higher levels of gene expression without compromising viral titer. In these vectors the intron and exon sequences from heterologous cellular or viral genes are present, When compared to the well blown MLV-based vectors, some of these newly developed vectors have been shown to produce significantly higher levels of gene expression for a longer period. In an experimental system that can maximize the production of RCR, our newly constructed vectors produced an absence of RCR. These vectors should prove to be safer than other currently available retroviral vectors containing one or more viral coding sequences

• Journal of Sensor Science and Technology
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• v.24 no.5
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• pp.319-325
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• 2015

While the conventional personal protective equipments (PPEs) covers a variety of devices and garments such as respirators, turnout gear, gloves, blankets and gas masks, several electronic devices such as personal alert safety system (PASS) and heads-up displays in the facepiece have become a part of firefighters personal protective equipments through past several years. Furthermore, more advanced electronic sensors including location traking sensor, thermal imaging caerma, toxic gas detectors, and even physiological monitoring sensors are being integrated into ensemble elements for better protection of firefighters from fire sites. Despite any electronic equipment placed on the firefighter must withstand environmental extremes and continue to properly function under any thermal conditions that firefighters routinely face, there are no specific criteria for these electronics to define functionability of these devices under given thermal conditions. Although manufacturers provide the specifications and performance guidelines for their products, their operation guidelines hardly match the real thermal conditions. Present study overviews firefighter's fatalities and thermal conditions that firefighters and their equipments face. Lastly, thermal packaging methods that we have developed and tested are introduced.

• Journal of Ceramic Processing Research
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• v.19 no.6
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• pp.504-508
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• 2018

Diopside is a ceramic material with excellent physical and chemical properties. However, when it is applied as an LED packaging material, heat dissipation of the LED element is not sufficient due to its relatively lower thermal conductivity, which may cause degradation of the LED function. In this study, glass-ceramics based on a $ZrO_2-CaO-MgO-SiO_2$ system, in which diopside is the main crystal phase, were prepared by heat-treating the glass, which was composed of zircon ($ZrO_2-SiO_2$) powders and diopside ($CaO-MgO-2SiO_2$) powders. The possibility of using the glass-ceramics as a packaging material for LEDs was then investigated by analyzing the density, shrinkage, thermal conductivity, and phases generated according to the amount of zircon powder added. The density and shrinkage of specimens decreased slightly and then increased again with the amount of $ZrO_2-SiO_2$ added within a range of 0~0.38 mol. Even though the crystal phase of zircon does not appear in the $ZrO_2-CaO-MgO-SiO_2$ system, the glass containing 0.38 mol zircon powder showed the highest thermal conductivity, 1.85 W/mK, among the specimens fabricated in this study: this value was about 23% higher than that of pure diopside. It was found that the thermal conductivity of the glass-ceramics based on a $ZrO_2-CaO-MgO-SiO_2$ system was closely related to the density, but not to the phase type. Zirconia ($ZrO_2$), a component oxide of zircon, plays an important role in increasing the density of the specimen. Furthermore the thermal conductivity of glass-ceramics based on a $ZrO_2-CaO-MgO-SiO_2$ system showed a nearly linear relationship with thermal diffusivity.

• Food Science and Preservation
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• v.11 no.3
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• pp.411-416
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• 2004

Botanical antimicrobial agent-grapefruit seed extract mixture(BAAG), which could be applied to the preparation of antimicrobial packaging paper, was investigated in order to prove the preservative function of fruits and vegetables. HAAG showed remarkable antimicrobial effects against Fusarium solani Botrytis cinerea, Pencillium crustosum, Erwinia carotovora, Phoma destructiva and Alternaria radicina causing the postharvest decay of fruits and vegetables. We have examined that HAAG could inhibit the growth of microorganims when treated with more than 500 $\mu$g/mL concentration. The activities of HAAG were stable in the wide spectrum of pH and temperature. Direct visualization of microbial cells by using scanning electron microscope showed the loss of microbial cell membrane function, which was destroyed by treating with the dilute solutions of HAAG. We could confirm that HAAG be an antimicrobial agent for the preparation of antimicrobial packaging paper.