• 마이크로전자및패키징학회지
• /
• 제22권2호
• /
• pp.11-19
• /
• 2015

Since CMOS device scaling has stalled, three-dimensional (3-D) integration allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. 3-D integration has many benefits such as increased multi-functionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, because it vertically stacks multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip. Anticipated applications start with memory, handheld devices, and high-performance computers and especially extend to multifunctional convengence systems such as cloud networking for internet of things, exascale computing for big data server, electrical vehicle system for future automotive, radioactivity safety system, energy harvesting system and, wireless implantable medical system by flexible heterogeneous integrations involving CMOS, MEMS, sensors and photonic circuits. However, heterogeneous integration of different functional devices has many technical challenges owing to various types of size, thickness, and substrate of different functional devices, because they were fabricated by different technologies. This paper describes new 3-D heterogeneous integration technologies of chip self-assembling stacking and 3-D heterogeneous opto-electronics integration, backside TSV fabrication developed by Tohoku University for multifunctional convergence systems. The paper introduce a high speed sensing, highly parallel processing image sensor system comprising a 3-D stacked image sensor with extremely fast signal sensing and processing speed and a 3-D stacked microprocessor with a self-test and self-repair function for autonomous driving assist fabricated by 3-D heterogeneous integration technologies.

• 센서학회지
• /
• 제24권4호
• /
• pp.264-269
• /
• 2015

An infrared (IR) bolometer measures the change of resistance by absorbing incident IR radiation and generates a signal as a function of the radiation intensity. Since a bolometer requires temperature stabilization and light filtering except for the infrared rays, it is essential for the device to be packaged meeting conditions that above mentioned. Minimization of heat loss is needed in order to stabilize temperature of bolometer. Heat loss by conduction or convection requires a medium, so the heat loss will be minimized if the medium is a vacuum. Therefore, vacuum packaging for bolometer is necessary. Another important element in bolometer packaging is germanium (Ge) window, which transmits IR radiation to heat the bolometer. To ensure a complete transmittance of IR light, anti-reflection (AR) coatings are deposited on both sides of the window. Although the transmittance of Ge window is high for IR rays, it is difficult to use frequently in low-price IR bolometer because of its high price. In this paper, we fabricated IR window by utilizing silicon (Si) substrate instead of Ge in order to reduce the cost of bolometer packaging. To enhance the IR transmittance through Si substrate, it is textured using Reactive Ion Etching (RIE). The texturing process of Si substrate is performed along with the change of experimental conditions such as gas ratio, pressure, etching time and RF power.

• 한국포장학회지
• /
• 제5권1호
• /
• pp.1-5
• /
• 1999

식품의 선도가 될 수 있는대로 오래 유지되도록 하여 소비자들에게 보다 신선한 식품이 공급되도록 하는 것은 매우 중요한 일중의 하나이다. 지금까지는 식품의 선도가 유지되도록 하기 위한 방편으로서 식품보존용기에 사람에게 유해한 방부제를 첨부하거나 분위기를 제어하는 방법, 혹은 식품의 표면을 특수처리하는 방법 등이 활용되어 왔다. 그러나 이러한 방법들은 모두 나름대로의 장단점을 안고 있다. 본 연구에서는 식품보존방법에 대해 새로운 개념을 도입하여 다른 이물질을 식품 보관용 필름에 혼입하지 않고도 식품자체의 선도가 유지되도록 하는 기술을 개발하고자 하였다. 기술의 요체는 식품이 오래 선도를 유지할 수 있도록 하는 정보를 물에 각인한 다음에 이를 식품 보관용 필름에 전사하여 그러한 기능을 갖도록 한 것으로서 일종의 기능성 필름이라고 할 수 있다. 이러한 개념에 입각한 기술의 실용화 가능성을 검토하기 위하여 실험을 수행한 결과 선도유지 기능이 우수한 것으로 나타났다. 앞으로 이러한 기술이 보다 더 다듬어지고 그 작용기전이 밝혀진다면 더욱 우수한 제품이 개발될 가능성이 높다고 하겠다.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
• /
• pp.84-87
• /
• 2003

Since Pb-free solder alloys have been used extensively in microelectronic packaging industry, the interaction between UBM (Under Bump Metallurgy) and solder is a critical issue because IMC (Intermetallic Compound) at the interface is critical for the adhesion of mechanical and the electrical contact for flip chip bonding. IMC growth must be fast during the reflow process to form stable IMC. Too fast IMC growth, however, is undesirable because it causes the dewetting of UBM and the unstable mechanical stability of thick IMC. UP to now. Ni and Cu are the most popular UBMs because electroplating is lower cost process than thin film deposition in vacuum for Al/Ni(V)/Cu or phased Cr-Cu. The consumption rate and the growth rate of IMC on Ni are lower than those of Cu. In contrast, the wetting of solder bumps on Cu is better than Ni. In addition, the residual stress of Cu is lower than that of Ni. Therefore, the alloy of Cu and Ni could be used as optimum UBM with both advantages of Ni and Cu. In this paper, the interfacial reactions of Sn-3.5Ag-0.7Cu solder on Ni-xCu alloy UBMs were investigated. The UBMs of Ni-Cu alloy were made on Si wafer. Thin Cr film and Cu film were used as adhesion layer and electroplating seed layer, respectively. And then, the solderable layer, Ni-Cu alloy, was deposited on the seed layer by electroplating. The UBM consumption rate and intermetallic growth on Ni-Cu alloy were studied as a function of time and Cu contents. And the IMCs between solder and UBM were analyzed with SEM, EDS, and TEM.

• 한국세라믹학회지
• /
• 제42권10호
• /
• pp.698-702
• /
• 2005

Dielectric and Piezoelectric properties of complex perovskite 0.92Pb($Zr_{1/2}Ti_{1/2})O_{3}-(0.08-x)Pb(Cu_{1/3}Nb_{2/3})O_{3}-xPb(Mn_{1/3}Nb_{2/3})O_{3}(0{\leq}x{\leq}0.080$) (PZT-PCN-PMN) system were investigated as a function of PMN content. With the increase of PMN content of the sintered specimens, tetragonal phase was coexisted with rhombohedral phase, the dielectric constant was decreased, mechanical quality factor ($Q_{m}$) was inceased, and optimal sintering temperature was increased up to 1050$^{\circ}C$. For the composition of x = 0.064 sintered at 1050$^{\circ}C$ for 2 h, 1939 of maximum mechanical quality factor ($Q_{m}$), 57$\%$ of electromechanical coupling factor ($k_{p}$), and 1100$^{\circ}C$ of dielectric constant, 0.37$\% $ of dielectric loss (tan $\delta$) were obtained.

• Journal of Biosystems Engineering
• /
• 제41권3호
• /
• pp.221-231
• /
• 2016

Purpose: The objective of this study was to develop cushion curves models and analyze the cushioning performance of multi-layered corrugated structures (MLCS) using a method based on dynamic stress-energy relationship. Methods: Cushion tests were performed for developing cushion curve models under 12 combinations of test conditions: three different combinations of drop height, material thickness, and static stress for each of four levels of energy densities between 15 and $60kJ/m^3$. Results: Dynamic stress and energy density for MLCS followed an exponential relationship. Cushion curve models were developed as a function of drop height, material thickness, and static stress for different paperboards and flute types. Generally, the differences between the shock pulse (transmitted peak acceleration) and cushion curve (position and width of belly portion) for the first drop and the averaged second to fifth drop were greater than those for polymer-based cushioning materials. Accordingly, the loss of cushioning performance of MLCS was estimated to be greater than that of polymer-based cushioning materials with the increasing number of drops. The position of the belly of the cushion curve of MLCS tends to shift upward to the left with increasing drop height, and the belly portion became narrower. However, depending on material thickness, under identical conditions, the cushion curve of MLCS showed an opposite tendency. Conclusions: The results of this study can be useful for environment-friendly and optimal packaging design as shock and vibrations are the key factors in cushioning packaging design.

• 한국미생물생명공학회:학술대회논문집
• /
• 한국미생물생명공학회 2000년도 추계 학술대회
• /
• pp.31-50
• /
• 2000

Almost all currently available retroviral vectors based on murine leukemia virus (MLV) contain one or more viral coding sequences Because these sequences are also present in the packaging genome, it has been suggested that homologous recombination may occur between the same nucleotide sequence in the packaging genome and the vector, resulting in the production of replication competent retrovirus (RCR). Up until now, it has been difficult to completely remove viral coding sequences since some were thought to be involved in the optimum function of the retroviral vector. For example, the gag coding sequence present in almost all available retroviral vectors has been believed to be necessary for efficient viral packaging, while the pol coding sequence present in the highly efficient vector MFG has been thought to be involved in achieving the high levels of gene e(pression. However, we have now developed a series of reroviral vectors that are absent of any retroviral coding sequences but produce even higher levels of gene expression without compromising viral titer. In these vectors the intron and exon sequences from heterologous cellular or viral genes are present, When compared to the well blown MLV-based vectors, some of these newly developed vectors have been shown to produce significantly higher levels of gene expression for a longer period. In an experimental system that can maximize the production of RCR, our newly constructed vectors produced an absence of RCR. These vectors should prove to be safer than other currently available retroviral vectors containing one or more viral coding sequences

• 센서학회지
• /
• 제24권5호
• /
• pp.319-325
• /
• 2015

While the conventional personal protective equipments (PPEs) covers a variety of devices and garments such as respirators, turnout gear, gloves, blankets and gas masks, several electronic devices such as personal alert safety system (PASS) and heads-up displays in the facepiece have become a part of firefighters personal protective equipments through past several years. Furthermore, more advanced electronic sensors including location traking sensor, thermal imaging caerma, toxic gas detectors, and even physiological monitoring sensors are being integrated into ensemble elements for better protection of firefighters from fire sites. Despite any electronic equipment placed on the firefighter must withstand environmental extremes and continue to properly function under any thermal conditions that firefighters routinely face, there are no specific criteria for these electronics to define functionability of these devices under given thermal conditions. Although manufacturers provide the specifications and performance guidelines for their products, their operation guidelines hardly match the real thermal conditions. Present study overviews firefighter's fatalities and thermal conditions that firefighters and their equipments face. Lastly, thermal packaging methods that we have developed and tested are introduced.

• Journal of Ceramic Processing Research
• /
• 제19권6호
• /
• pp.504-508
• /
• 2018

Diopside is a ceramic material with excellent physical and chemical properties. However, when it is applied as an LED packaging material, heat dissipation of the LED element is not sufficient due to its relatively lower thermal conductivity, which may cause degradation of the LED function. In this study, glass-ceramics based on a $ZrO_2-CaO-MgO-SiO_2$ system, in which diopside is the main crystal phase, were prepared by heat-treating the glass, which was composed of zircon ($ZrO_2-SiO_2$) powders and diopside ($CaO-MgO-2SiO_2$) powders. The possibility of using the glass-ceramics as a packaging material for LEDs was then investigated by analyzing the density, shrinkage, thermal conductivity, and phases generated according to the amount of zircon powder added. The density and shrinkage of specimens decreased slightly and then increased again with the amount of $ZrO_2-SiO_2$ added within a range of 0~0.38 mol. Even though the crystal phase of zircon does not appear in the $ZrO_2-CaO-MgO-SiO_2$ system, the glass containing 0.38 mol zircon powder showed the highest thermal conductivity, 1.85 W/mK, among the specimens fabricated in this study: this value was about 23% higher than that of pure diopside. It was found that the thermal conductivity of the glass-ceramics based on a $ZrO_2-CaO-MgO-SiO_2$ system was closely related to the density, but not to the phase type. Zirconia ($ZrO_2$), a component oxide of zircon, plays an important role in increasing the density of the specimen. Furthermore the thermal conductivity of glass-ceramics based on a $ZrO_2-CaO-MgO-SiO_2$ system showed a nearly linear relationship with thermal diffusivity.

• 한국식품저장유통학회지
• /
• 제11권3호
• /
• pp.411-416
• /
• 2004

식물성 천연항균제인 자몽종자추출제재(Boatanical antimicrohiagent-grapefruit seed extract mixture : BAAG)의 항균특성을 구명하고, 과채류의 선도유지제로서의 기능과 효능을 입증하기 위하여 BAAG를 조제하여 과채류의 저장, 유통중 발생하는 변패균주, Fuarium solani, Botrytis cinerea Pencilliumcrutosua Ewinia carotovora Phoma destructiva and Alternaria radirina등을 공시균주로 사용하여 Paper disk method에 의한 농도별 항균력을 실험한 결과,변패미생물에 대하여 농도에 비례하여 상당한 항균효과를 보였으며, 또한 생육저해곡선에서는 500 $\mu$g/mL 이상에서 미생물의 생육이 완전히 억제되는 것을 볼수 있었다. 그리고 열 및 pH 안전성에 대해서도 열처리의 온도와 pH 범위에 관계없이 항균력을 보임으로써 열과 pH에 안정한 것으로 나타났다. 또한 항균력에 의한 미생물의 생태변화에 대한 전자현미경적 검사(SEM에서도 항균물질이 미생물 세포벽 또는 세포막의 기능성을 파손하여 삼투기능이 상실됨으로 해서 미생물의 생리가 중단되고 생육이 억제되는 것을 볼 수 있으며, 균체내부에 빈 사멸 균체들이 증대함을 알 수 있었다. 이상의결과로 미루어, BAAG는 항균포장원지 또는 항균포장상자의기능성 소재로 이용될 수 있음을 확인할 수 있었다.