• Title/Summary/Keyword: Package products

검색결과 398건 처리시간 0.025초

상업 패턴을 포함한 의류 DIY 패키지 개발 (The Development of Clothing DIY Packages Including Commercial Patterns)

  • 이은혜
    • 한국의류산업학회지
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    • 제25권3호
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    • pp.333-345
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    • 2023
  • The rising demand for fashion do-it-yourself (DIY) products that cater to individual preferences and which allow for creative expression has highlighted the need for systematic organization within the clothing society. This study addresses this gap by identifying and discussing clothing DIY packages and proposes a systematic package model comprising essential raw materials, commercial patterns, and production instructions. Four key elements have been emphasized to differentiate and enhance the product. Firstly, highly practical commercial patterns have been developed to facilitate easy transformations - from blouses to dresses. Furthermore, the versatility of these patterns has been optimized so as to allow their utilization as outerwear, increasing their efficiency. Secondly, to accommodate diverse body shapes, the package offers six different sizes, providing users with a range of options tailored to their specific measurements. Thirdly, detailed production instructions are provided, supplemented by a Q&A bulletin board. The instructions are available in a printed format, featuring actual photographs on A4 paper, while video production instructions are accessible via a QR code, ensuring comprehensive guidance. Lastly, the basic package comprises clothing patterns, production instructions, fabrics, and labels, providing a complete toolkit for clothing DIY enthusiasts. This study aims to contribute to the development of the hobby sewing field and to establish a practical resource for the clothing DIY package industry.

밀키트(Meal Kit) 제품의 사용자 경험 디자인 연구 (A Study on Meal Kit User Experience Design)

  • 박서연;김승인
    • 디지털융복합연구
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    • 제19권1호
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    • pp.373-378
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    • 2021
  • 본 연구는 밀키트(Meal Kit) 제품 정보의 사용자 경험 디자인 연구로서 구매자에게 필요한 제품 정보와 사용 편의성을 위한 필요사항을 도출하고 개선방안을 제안하는 데 목적이 있다. 밀키트 제품을 구매할 때 영양 섭취에 관한 정보 표기와 패키지 디자인, 환경에 관한 문제를 국내 밀키트 브랜드 피코크와 프레시지 2종을 비교 분석하였다. 연구방법으로는 1차로 문헌 연구와 선행연구를 통해 밀키트 제품 구매 요인 7가지 요소를 도출하여 설문 조사를 진행하였고, 2차로 30대 1인 가구 남녀 4명씩, 총 8명을 대상으로 심층 인터뷰를 진행하였다. 연구 결과, 구매자에게 만족을 주는 요인으로는 조리 과정, 음식, 맛/영양, 패키지, 편리성, 가격, 정보 순으로 나타났으며, 과대포장 또한 문제점으로 드러났다. 이를 통해 밀키트 제품의 개선사항 도출과 발전 방안을 제시할 수 있었다. 본 연구가 향후 1인 가구의 식생활개선과 밀키트 제품 개발에 도움을 줄 것으로 기대한다.

Research on blind box packaging design based on consumer psychology

  • Ruiyu Li;Alber Young Choi
    • International Journal of Advanced Culture Technology
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    • 제11권3호
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    • pp.163-171
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    • 2023
  • A blind box is a kind of sales method in that you can only get the product information by opening the package. In 2019, blind box products began to grow rapidly in the Chinese market, and gradually formed a special "blind box economy". The particularity of blind box products is that driven by consumers' curiosity, consumers' purchasing behavior can be directly induced by the visual and tactile perception of commodity packaging. Therefore, it is necessary to explore the psychological needs of consumers and master the blind box packaging design elements under the influence of consumer psychology. This paper takes figurine blind box packaging elements as the research scope and Chinese blind box consumers as the research object. Through market research and literature study, We are designed to conduct a questionnaire survey and SPSS empirical study to find out the differences in the preferences of different consumer temperament types for blind box packaging, taking the characteristics of blind box products and consumer psychology as the relevant theoretical background. The research results show that among the blind box consumers, choleric type consumers predominate, the color of the blind box packaging presents red, orange, and yellow preference, and the material presents metal, and plastic preference. The shape of the blind box shows a preference for special shape.

패키지 관광 상품에 포함된 관광목적지들 간의 사회 네트워크 분석 (A Social Network Analysis of Tourism Destinations in Package Tourism Products)

  • 박득희;이계희
    • 한국산학기술학회논문지
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    • 제15권3호
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    • pp.1414-1423
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    • 2014
  • 본 연구는 사회네트워크 분석을 활용해 패키지 관광 상품 안에 포함된 관광 목적지들의 구성 패턴과 POI(point of interests)를 도출하고 관광 패키지 상품으로 구성된 관광 목적지 별 특징을 알아보고자 하였다. 이를 위해, 여행사에서 판매하는 패키지 관광 상품을 조사한 후, Pajek, Cytoscape, UCINET을 활용하여 밀도, 집중도, 중심성, 관심지점 설정, 컴퍼넌트 등의 분석을 하였다. 분석결과는 다음과 같다. 첫째, 관광목적지 네트워크는 관광 목적지들 간의 연결이 고르게 이루어 진 것을 알 수 있었다. 둘째, 중심성 값을 통해 연결정도 중심성이 높으면, 매개 중심성 또한 높음을 발견하였다. 셋째, 관심지점 설정 결과, 관광 목적지 안의 관심지점은 널리 퍼져있는 것이 아닌 가까운 거리에 모여 있는 것을 발견하였다. 끝으로, 하위 네트워크 분석 결과, 관광 목적지 네트워크는 하위 집단간 파편화가 일어난 것으로 분석되었다.

패키지형 해외진출을 통한 정보통신분야 글로벌 경쟁력 강화 방안에 대한 고찰 (A Study on strengthening the global competitiveness of Korea's IT industry through exporting the IT package-type service)

  • 김선배
    • 한국컴퓨터정보학회논문지
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    • 제13권6호
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    • pp.279-286
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    • 2008
  • 우리 IT산업은 2007년 현재 GDP에서 차지하는 비중이 약 17%에 이를 정도로 국가 경제에 중추적 역할을 하고 있다. 그러나 최근 미국發글로벌 경기침체가 지속되면서, 이에 따른 소비위축으로 IT수요가 부진을 보이고 있다. IT수요의 부진은 IT공급과잉으로 이어져, 결국 IT가격의 경쟁심화로까지 나타나면서, IT산업 전체의 위기감이 고조되고 있다. 따라서 기존 수출품목 및 대상국가의 다변화와 그에 따른 차별화된 수출전략에 대한 요구가 높아지고 있기에 차별화된 수출전략을 위하여 전략품목 및 국가에 대하여 대기업과 중소기업간, 산업간, 연계사업간 등의 다양한 IT분야 패키지형 해외진출 방안을 제시해 보고자 한다. IT산업은 앞으로도 우리 경제의 큰 버팀목으로 자리잡고 발전해 나아갈 것이며, IT분야의 패키지형 해외진출 방안이 일조를 해 나아갈 것이다.

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건조인삼제품의 품질 특성 조사 (A Survey on the Quality Characteristics of Dried Ginseng Products)

  • 길복임
    • 한국식품과학회지
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    • 제35권5호
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    • pp.1003-1006
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    • 2003
  • 시중에서 유통되고 있는 건조인삼제품인 백삼, 홍삼, 태극삼의 품질을 인삼산업법과 한국산업규격 등 국내 규격과 관련하여 조사하였다. 모든 제품이 일반품질기준인 수분함량 14.0% 이하, 회분함량 5.0% 이하, 물포화 n-부탄올 추출물함량 2.0% 이상에 적합하였다. 고려인삼의 유효성분인 진세노사이드 $Rb_1$, Rf, $Rg_1$도 HPLC 분석결과 관찰되었다. 그러나 홍삼제품을 제외하고는 단위포장내 개체중량의 균일성이 거의 지켜지지 않고 있는 것으로 나타났다.

절화류의 포장규격에 관한 연구 (A Research on Standard Dimensions for Fresh Cut Flower Packages)

  • 하영선;김종경
    • 한국포장학회지
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    • 제12권1호
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    • pp.1-5
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    • 2006
  • Increasement of total cost during distribution chain requires packaging standardization to reduce extra handling and delays at transshipment point. In Korea, high valued agricultural products to export are most often shipped by air freight. Fresh flowers, in particular, the need to set package standard for air palletization are strongly recommended. This study tried to find an optimum standard dimensions for export packages. After extensive research on combinations of various flower dimensions, package dimensions and pallet sizes, we found that 96 inches pallet was most adequate for international air freight. Based on the results, new 40 standard package dimensions were introduced and stacking efficiencies were calculated.

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The Analysis of Heat Transfer through the Multi-layered Wall of the Insulating Package

  • Choi, Seung-Jin
    • 한국포장학회지
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    • 제12권1호
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    • pp.45-53
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    • 2006
  • Thermal insulation is used in a variety of applications to protect temperature sensitive products from thermal damage. Several factors affect the performance of insulation packages. Among these factors, the thermal resistance of the insulating wall is the most important factor to determine the performance of the insulating package. In many cases, insulating wall consists of multi-layered structure and the heat transfer through this structure is a very complex process. In this study, an one-dimensional mathematical model, which includes all of the heat transfer principles covering conduction, convection and radiation in multi-layered structure, were developed. Based on this model, several heat transfer phenomena occurred in the air space between the layer of the insulating wall were investigated. From the simulation results, it was observed that the heat transfer through the air space between the layer were dominated by conduction and radiation and the low emissivity of the surface of each solid layer of the wall can dramatically increase the thermal resistance of the wall. For practical use, an equation was derived for the calculation of the thermal resistance of a multi-layered wall.

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High-density Through-Hole Interconnection in a Silicon Substrate

  • Sadakata, Nobuyuki
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2003년도 International Symposium
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    • pp.165-172
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    • 2003
  • Wafer-level packaging technology has become established with increase of demands for miniaturizing and realizing lightweight electronic devices evolution. This packaging technology enables the smallest footprint of packaged chip. Various structures and processes has been proposed and manufactured currently, and products taking advantages of wafer-level package come onto the market. The package enables mounting semiconductor chip on print circuit board as is a case with conventional die-level CSP's with BGA solder bumps. Bumping technology is also advancing in both lead-free solder alternative and wafer-level processing such as stencil printing using solder paste. It is known lead-free solder bump formation by stencil printing process tend to form voids in the re-flowed bump. From the result of FEM analysis, it has been found that the strain in solder joints with voids are not always larger than those of without voids. In this paper, characteristics of wafer-level package and effect of void in solder bump on its reliability will be discussed.

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패키지 인쇄에 있어서 Kubelka-Munk Model 유래의 산란 및 흡수 계수를 이용한 색상 재현성 예측 (Prediction of Color Reproduction using the Scattering and Absorption Coefficients derived from the Kubelka-Munk model in Package Printing)

  • 현영주;박재상;태현철
    • 한국포장학회지
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    • 제27권3호
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    • pp.203-210
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    • 2021
  • With the development of package printing technology, the package has expanded from the basic function of protecting products to the marketing function through package design. Color, the visual element that composes the package design, is delivered to the consumer most quickly and effectively. As color marketing of these package designs expands, accurate color reproduction that the product wants to express is becoming more important. The color of an object is transmitted by absorption and scattering of light. Spectral reflectance refers to the intensity of light reflected by an object at different wavelengths by the spectral effect. As a result, the color of the object is expressed in various colors. Packaged printing inks have their own absorption and scattering coefficients, and the Kubelka-Munk model for color reproduction and prediction defines the relationship between these correlation coefficients through reflectance. In the Kubelka-Munk model for color reproduction and prediction, the relationship between the absorption and scattering coefficients (K/S) of printed material is predicted as the sum of the K/S values according to the mixing ratio of all color ink used. In this study, the reflectance of the measured print is reversely calculated at the mixing ratio of print ink using the Kubelka-Munk model. Through this, the relationship value of the ink-specific absorption/scattering coefficient constituting the final printed material is predicted. Delta E is derived through the predicted reflectance, and the similarity between the measured value and the predicted value is confirmed.