• 한국재료학회:학술대회논문집
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• 한국재료학회 1998년도 IUMRS-ICEM ABSTRACT BOOK
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• pp.98.3-98
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• 1998

• 대한기계학회논문집
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• 제18권3호
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• pp.729-737
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• 1994

A three-dimensional finite element model of a 20-pin plastic dual-in-line package(PDIP) plugged into a PCE has been developed by using the finite element code ANSYS. The model has been used for thermal characterization of the package during its normal operation under natural convection cooling. Temperature distributions in the package and PCB are obtained from numerical analysis and compared with experimentally measured data. Various cases are assumed and analyzed to study the effects of package and PCB materials on thermal characteristics of PDIP with and without aluminum heatspreader. Thermal dissipation capability of PDIP is greatly increased due to copper die pad/lead frame and heatspreader. However, thermally induced stresses in the package and fatigue life of chip are improved for PDIP with Alloy 42 die pad/lead frame and no heatspreader. It is also found that the role of PCB on thermal characteristics of PDIP is very imporatant.

• Asian-Australasian Journal of Animal Sciences
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• 제16권11호
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• pp.1695-1700
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• 2003

A total of 30 pork loin sections were utilized to evaluate the effects of FIR ceramic sheet in PE and vacuum package on preserving the quality of chilled pork stored at 4 and $0^{\circ}C$. Based on meat color, results indicated that pork loin packaged in ceramic sheet and control treatment showed that the samples of the control treatment tended to darken gradually in comparison with the samples at 0 day, but FIR treatment had few changes. Among the total plate counts of sliced loin in PE and loin in vacuum package under different storage times at 4 and $0^{\circ}C$, results showed that FIR ceramic sheet package treatment had lower total plate counts and significant differences (p<0.05). In VBN value, both treatments tended to rise high with the increasing of storage time, but the FIR treatment was significantly lower (p<0.05) than the control treatment. Its results had a corresponding relationship with the total plate counts. Regarding the drip loss of sliced loin in PE and loin in vacuum package, it showed that FIR ceramic sheet package treatment had lower drip loss and significant differences (p<0.01). These results showed that the use of FIR ceramic sheet package, including PE and vacuum package, is an effective method of maintaining the quality of meat.

• 한국포장학회지
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• 제28권1호
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• pp.9-14
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• 2022

Packages of different atmospheres (air (control), 100% CO₂, vacuum, and vacuum + O₂ absorber) were prepared for 0.4 kg rice cake (ddukgukdduk) using gas-barrier plastic film and stored at 10℃ for 11 days. The stored products were evaluated in their packages atmosphere, total aerobic bacteria, yeast and molds, texture and sensory quality during storage period. In the air package, the O₂ concentration decreased from initial 21% to 16% on storage 4 days and the CO₂ concentration increased to 23% on storage of 11 days, which resulted from the growth of microorganisms. CO₂ concentration decreased from initial 98% to 36% on storage 11 days in the 100% CO₂ package. It is reasoned that CO₂ was dissolved into the product reducing the volume of the package. Vacuum and vacuum +O₂ absorber package maintained shrunk vacuum condition until 11 days of storage. Total aerobic bacteria count increased significantly in the control package (6.41 log (cfu/g) after 11 days) compared to the 100% CO₂ package (4.96 log (cfu/g) after 11 days). Yeast and molds were 6.66 in control package, 3.43 in 100% CO₂ package, 4.66 in vacuum package, and 3.78 in vacuum + O₂ absorber package after 11 days. There was no significant difference between control and the other treatments for the texture of the stored products. Sensory quality was the worst in control package on the storage of 8 days. All treatment groups except control improved the quality preservation, but vacuum and vacuum + O₂ absorber packages suffered from cracking of the product. Thus 100% CO₂ flushing is suggested as a desired packaging condition.

• 한국응급구조학회지
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• 제9권2호
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• pp.207-221
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• 2005

Purpose: The purpose of this study was to develop and apply a simulation-problem based learning(S-PBL) package in basic life support(BLS). Methods: This study was used to developed BLS' S-PBL package throughout 12 steps of PBL package development model. Then, BLS' S-PBL methodology was implemented in second year student in the undergraduate emergency medical technology, and survey was done. Results: 1. S-PBL package model was presented based on conceptual model II of PBL ; PEL for professional action. 2. Quantitative analysis of survey was to the effectiveness of learning, 3.59 points ; 4.15 of BLS and 3.84 of integration and practical use of knowledge. 3. As to the satisfaction of student, S-PBL package management, tutor and self-satisfaction' score was 3.59, 3.82, 3.39 respectively. Conclusion: This study was suggested that S-PBL education would be necessary with improved tutor skill and achieved advantage of simulation and PBL.

• 한국응급구조학회지
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• 제14권2호
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• pp.25-40
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• 2010

Purpose : The purpose of this study was to develop and apply a Core Skill-TLP(Core Skill-Tutorial, Laboratory, Practicum) package in Patient Management and to effect of core skill-TLP education. Methods : This study was used to developed Patient Management' Core Skill-TLP package throughout 14 steps of Core Skill-TLP package development model. Then, Core Skill-TLP Learning methodology was implemented in first year student in the undergraduate emergency medical technology, and survey was done. Results : 1. Core Skill-TLP package model was presented based on conceptual model of PBL(S-PBL). 2, The student in OSCE did significantly better in clinical patient management core skills performance. 3. As to the satisfaction of Core Skill-TLP package management, student, tutor and self-satisfaction score was 3.21, 3.42, 3.38 respectively. Conclusion : This study was suggested that Core Skill-TLP education would be necessary with well-structured package and achieved advantage of simulation and PBL.

• 한국IT서비스학회지
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• 제8권2호
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• pp.1-22
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• 2009

Recently, improving service quality for customer satisfaction is one of the most important issues and the task for the growth of company. Furthermore, plenty studies are going on progress to develop service quality in IT industry. There have been so many researches of product quality on package software but yet the service quality of package software has been rarely studied before. Thus, the purpose of this study is to formulate a scheme on how to enhance the competitivity of package software company by analyzing the impacts of these two factors on the customer satisfaction, Word-of-Mouth intention and the reuse intention. The study models have been designed and the hypotheses have been made through the examination of the precedent literature about package software product and service quality. A questionnaire survey was performed to collect information, and the unit of analysis was a person who used package software. This study used the statistical technique such as regression analysis. This study may be utilized as basic data for building marketing strategies when package software companies offer service to customers.

• 한국시뮬레이션학회논문지
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• 제26권1호
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• pp.69-75
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• 2017

MCP(Multi-chip Package)는 두 개 이상의 Chip을 적층하여 하나의 패키지로 합친 제품이다. MCP를 만들기 위해서는 두 개 이상의 Chip이 동일한 Substrate에 적층되기 때문에 다수의 조립 공정이 필요하다. Package 공정에서는 Lot들이 동일한 특성을 가지는 Chip으로 구성되고 MCP를 구성하는 Chip의 특성은 Layer sequence에 의해 결정된다. MCP 생산 공정에서 WIP Balance 뿐만 아니라 Throughput을 달성하기 위해서는 Chip의 Layer sequence가 중요하다. 본 논문에서는 Chip들의 Layer sequence의 제약 조건을 고려한 스케쥴링 방법론을 제안한다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1998년도 추계종합학술대회 논문집
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• pp.1141-1144
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• 1998

A new design methodology for the shortchannel CMOS IC-package is presented. It is developed by representing the package inductance with an effective lumpedinductance. The worst case maximum-simultaneous-switching noise (SSN) and gate propagation delay due to the package are modeled in terms of driver geometry, the maximum number of simultaneous switching drivers, and the effective inductance. The SSN variations according to load capacitances are investigated with this model. The package design techniques based on the proposed guidelines are verified by performing HSPICE simulations with the $0.35\mu\textrm{m}$ CMOS model parameters.

• 응용통계연구
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• 제22권5호
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• pp.893-910
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• 2009

대학교 기초통계학 교육 시 우리는 통계패키지로서 R을 사용할 수 있다. R은 대화식 처리방식을 따르기 때문에 실행결과를 즉시 볼 수 있다. 또한 R에서의 그래픽스는 아주 강력하다. 그리고 가장 큰 장점은 R의 사용이 무료라는 것이다. 이러한 많은 장점을 갖고 있는 R을 대학교 기초통계교육 현장에서 사용하는 표준 통계패키지로서 고려할 필요가 있다 본 논문은 기초통계학 내용 중 추측통계 영역을 대상으로 R의 활용에 대하여 기술하고자 한다.