• 한국정밀공학회지
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• 제15권2호
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• pp.99-106
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• 1998

In this paper, we have constructed an expert system for semiconductor chip encapsulation which combines a knowledge-based system with CAE software. The knowledge-base module includes heuristic and pre analysis knowledge for evaluation and redesign. Evaluation of the initial design and generation of redesign recommendations can be developed from the rules as applied to a given chip package. The CAE programs can be used for simulating the filling and packing stage of encapsulation process. The expert system is a new tool which enables package design or process conditions with high yields and high productivity.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.72-75
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• 2009

In this paper, we have designed a novel lens for LED's package that can expend the radiation angle of LED from $120^{\circ}$ to $170^{\circ}$ successfully. At the same brightness and uniformity condition of 37" LED BLU system, using novel lens LED package can be reduced amounts of LED 40% or thickness of BLU 30% respectively. Besides, the power consumption of BLU also can be reduced 25%.

• 대한물리치료과학회지
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• 제9권4호
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• pp.83-94
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• 2002

Within physical therapy education, there has been increased attention to curricula and course that emphasize problem solving, clinical reasoning, and synthesis of information across traditional discipline-specific boundaries. This article describes the development implementation, and outcomes of a problem-based learning course in Physical therapy. The course was designed to help students to integrate the various elements of a physical therapy curriculum and to enhance their abilities to respond to an ever-changing health care environment. An evaluation of the course by the first 50 students who completed it revealed both strengths and weaknesses. Students responded that the course enhanced their professional behavior, including interpersonal communication skills, team work, and follow-through with professional responsibilities. The learning package was developed by the authors and implemented to a college students during three weeks of the first semester of 2001. Most studies which conducted PBL module development were short period or temporary PBL package application and evaluation rather than a whole semester's. While, this study carried on partial integrated PBL curriculum development and application with recomposing content of the two subjects to one subject Physical therapy which includes four PBL packages. This package was developed from a simple concept to complex and partial integrated PBL curriculum application systematically variable learning methods such as discussion, practice, lecture, video. There are 2 classes, each class has 25 students, in the college. Each class has 5 small groups consisting 5 students. Two tutors proceeded discussion charging each class also, they used multiple methods and materials like tutorials, self-directed learning, lecture, and video. The package is 5 grades and 5 hours per week and the rate of discussion, lecture is 4, 1 respectively. One of the most change is the increase of interaction between students and tutors. Whenever students need information and suggestion, they can visit tutors who provide reading materials and guide for the direction of self learning. Therefore, this study describes the PBL package development process and application during one semester recomposing contents of two subjects to Physical therapy concepts. Besides, it will contribute to active application of existing each subject to tutors who intend to convert as PBL methods. The study has significant meaning to show potentiality of partially integrated PBL application, using systematic PBL package development from two subjects contents. However, when students' need of yearning is over the extent of Introduction of Physical therapy and Rehabilitation medicine, tutors should set learning extent. So, there is limitation to attain completely integrated PBL education within one subject, therefore, it is high lighted to proceed development of integrated curriculum to maximize learning effects of PBL. It is exected that partial integrated PBL package development and application will distribute to prosper excellent physiotherapist in practice.

• Journal of Information Processing Systems
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• 제17권3호
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• pp.473-488
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• 2021

The enterprise resource planning (ERP) system is a standardized and advanced business process that many companies are implementing now-a-days through customization. However, it affects the efficiency of operations as these customizations are based on uniqueness. In this study, we analyzed the impact of customized modules and processing time on customer service request (CSR), by utilizing the stacked CSR data during the construction and operation of ERP, focusing on small and medium-sized enterprises (SMEs). As a result, a positive correlation was found between unit companies and the length of ERP implementation; ERP modules and the length of ERP implementation; ERP modules and unit companies; and the type of ERP implementation and ERP module. In terms of CSR, a comparison of CSR processing time of CBO (customized business object) module and STD (standard) module revealed that while the five modules did not display statistically significant differences, one module demonstrated a statistically very significant difference. In sum, the analysis indicates that the CBO-type CSR and its processing cost are higher than those of STD-type CSR. These results indicate that companies planning to implement an ERP system should consider the ERP module and their customization ratio and level. It not only gives the theoretical validity that should be considered as an indicator for decision making when ERP is constructed, but also its implications on the impact of processing time suggesting that the maintenance costs and project scheduling of ERP software must also be considered. This study is the first to present the degree of impact on the operation and maintenance of customized modules based on actual data and can provide a theoretical basis for applying SW change ratio in the cost estimation of ERP system maintenance.

• 한국레이저가공학회지
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• 제8권3호
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• pp.21-26
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• 2005

A bonding process between tape-carrier package and a glass panel with anisotropic conductive film (ACF) has been investigated by making use of high power diode laser as a heat source for cure. The results from modeling of process and from optical properties of layers showed that heat absorbed from polyimide film surface and ACF layer is dominant source of curing during laser illumination. Laser ACF bonding has better bonding quality than conventional bonding in view of peel strength, flatness, pressure unbalance and processing time. New ACF bonding processes by making use of high power diode laser are proposed.

• 한국정밀공학회지
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• 제19권11호
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• pp.46-53
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• 2002

In order to overcome the conventional robot's physical limitation to frequent changes in operational requirements, it is quite appealing to modularize its system components and allow them to be combined into various configurations to best suit the needs to a particular application. Several researchers have presented the concept of modular robot. In this paper, the kinematics and dynamics of modular robot are studied, which concretes the concept of modular robot. This study includes the selection of individual module, the definition of their parameters and the development of module based manipulate. analysis software package (MBMAP).

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2006년도 SMT/PCB 기술세미나
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• pp.1-14
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• 2006

[ $\blacklozenge$ ] PCB에 있어서 Embedded passive 는chip을 직접 내장하는 방법과 특별한 특성을 갖는 재료 및 공법을 사용하여 chip 응 대치하는 방법이 있다. $\blacklozenge$ Embedded passive PCB가 적용될 수 있는 유력한 적용 분야는 소형화가가 요구되는 분야와 고속 특성이 요구되는 분야를 들 수 있고, 따라서, Module, SOP/SIP, Package substrate 등이 우선적으로 적용될 수 있는 분야다. $\blacklozenge$ Embedded capacitor를 적용한 경우, 일반적인 chip capacitor를 적용한 경우보다 더 좋은 전기적인 특성(SRF, Q)을 얻을 수 있으며, solder joint 등의 영향을 포함하면 더욱 좋은 특성이 얻어질 수 있다. $\blacklozenge$ Embedded passive 의 상용화를 위해서, 공차를 관리하는 방법의 개발과 공차에 대한 합리적인 규격을 설정하는 것이 우선 과제이다. $\blacklozenge$ Embedded resistor 의 경우, Laser trim을 적용하여 ${\pm}\;5\%$ 또는 그 이하의 공차를 실현할 수 있고, $30\;K\Omega/sq$. 의 고저항의 적용까지 가능하다. $\blacklozenge$ 고속 신호에서의 noise 감소, module, SIP/SOP 의 소형화를 실현하는데 Embedded passive(혹은 active)PCB 가 기여 할 수 있을 것이고, 이를 위하여 Set 업체, PCB 업체, 재료 업체간의 지속적인 협조가 필요할 것이다.

• 마이크로전자및패키징학회지
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• 제5권2호
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• pp.21-26
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• 1998

대용량, 고속데이터 처리가 요구되는 System 개발은 이들의 복잡하고 고기능의 회 로 구현이 가능하냐에 달려 있고 또한 이들고기능 요구를 가장 잘 만족할수 있는 패키지는 MCM 이라 할 수있다. 시스템의 고속화, 소형화는 회로의 복잡성을 요구하는 있는 이를 패 키지로 구현하는 MCM은 시험성 확보에 심각한 문제점으로 나타나고 있다. 본 논문에서는 고밀도 구조의 MCM 기판에 대한 Interconnetion Line 시험검증을 위한 Flying Prober의 적 용 및 모듈 패키징 공정에 대한 조립성 검증을 위한 BST에 대해 설명한다. 연구에 사용된 MCM 모듈은 MCM-D 공정으로 제작되었으며 31um 신호선폭, 50um Via Hole Dia. 5신호 선층 5절연층 및 455 Net의 기판으로절연층은 Dow chemical의 BCB-4024/4026을 적용하였 다. 조립은 3 ASIC, 24소자 실장 및 2000 Wire Bonding으로 이루어지며 패키지는 방열특성 을 고려한 BGA(491 I /O,50mil pitch)를 개발하여 사용하였다. MCM 기판의미세패턴으로 구성된 Interconnection Line에 대해 Fine Ptich Probing이 가능한 Flying Prober를 사용하 여 평가하였으며 BST를 이용하여 실장소자의 KGD평가 및 능동, 수동소자가 실장된 MCM Package의 조립시험성을 확보할수 있었다.

• 반도체디스플레이기술학회지
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• 제4권4호
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• pp.27-31
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• 2005

This article contains the development of FPC bonder that used for repair or trial product. Nowadays, in FPO module process (including PDP) accept the thermo-compress bonding method when attach FPC(Flexible Printed Circuit Board), TCP(Tape Carrier Package) and COF(Chip on the FPC) by ACF(Anisotropic Conductive Film). This system consists of ACF attachment part, pre-bonding part, main bonding part, loading / unloading part. This composition is a stand-alone system, not an in-line system. Hereafter, this composition should be developing into in-line system in all area of FPD industry.

• 한국항해항만학회:학술대회논문집
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• 한국항해항만학회 2003년도 춘계공동학술대회논문집
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• pp.251-256
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• 2003

최근 세계 시장은 기업 간의 경쟁이 격화됨에 따라 비즈니스의 전 영역을 지원할 수 있는 강력한 경영정보시스템을 필요로 하고 있다 이러한 추세에 따라 최근 ERP(전사적자원관리시스템) 패키지를 도입하여 경영정보시스템을 구축하는 기업이 날로 증가하고 있다. 이에 본 연구에서는 ERP에 대한 이론적 고찰과 사례연구 등을 통해 해운기업에 맞는 ERP 모들 적용 방법을 제시하였다.