• Title/Summary/Keyword: Package method.

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Thermal and Stress Analysis of Power IGBT Module Package by Finite Element Method (유한요소법에 의한 대전력 IGBT 모듈의 열.응력해석)

  • 김남균;최영택;김상철;박종문;김은동
    • Journal of the Microelectronics and Packaging Society
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    • v.6 no.4
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    • pp.23-33
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    • 1999
  • A finite element method was employed fort thermal and stress analyses of an IGBT module of 3-phase full bridge. The effect of material parameters such as substrate material, substrate area, solder thickness on the temperature and stress distributions of the module packages has been investigated. Thermal analysis results have also been compared by setting of boundary conditions such as equivalent heat transfer coefficient or constant temperature at a base metal surface of the package. The increase of ceramic substrate area up to 3 times does little contribution to the reduction(8.9%) of thermal resistance, while contributed a lot to the reduction(60%) of thermal stress. Thicker solder resulted in higher thermal resistance but did slightly reduced thermal stresses. It is revealed by the stress analysis that maximum stress was induced at the region of copper pads which are bonded with ceramic substrate.

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Dynamic Analysis and Structural Optimization of a Fiber Optic Sensor Using Neural Networks

  • Kim Yong-Yook;Kapania Rakesh K.;Johnson Eric R.;Palmer Matthew E.;Kwon Tae-Kyu;Hong Chul-Un;Kim Nam-Gyun
    • Journal of Mechanical Science and Technology
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    • v.20 no.2
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    • pp.251-261
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    • 2006
  • The objective of this work is to apply artificial neural networks for solving inverse problems in the structural optimization of a fiber optic pressure sensor. For the sensor under investigation to achieve a desired accuracy, the change in the distance between the tips of the two fibers due to the applied pressure should not interfere with the phase change due to the change in the density of the air between the two fibers. Therefore, accurate dynamic analysis and structural optimization of the sensor is essential to ensure the accuracy of the measurements provided by the sensor. To this end, a normal mode analysis and a transient response analysis of the sensor were performed by combining commercial finite element analysis package, MSC/NASTRAN, and MATLAB. Furthermore, a parametric study on the design of the sensor was performed to minimize the size of the sensor while fulfilling a number of constraints. In performing the parametric study, the need for a relationship between the design parameters and the response of the sensor was fulfilled by using a neural network. The whole process of the dynamic analysis using commercial finite element analysis package and the parameter optimization of the sensor were automated within the MATLAB environment.

Studies on the Improvement of Packaging of Retorted Samgyetang (레토르트 삼계탕의 포장 개선을 위한 연구)

  • Lee, Jin-Hwan;Lee, Keun-Taik
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.15 no.2
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    • pp.49-54
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    • 2009
  • The effects of filling temperatures of broth and degassing method on the residual oxygen content and gas composition in the pouch and physical strength of packaging material for Samgyetang depending on the contamination of broth on the sealing layer and sterilization process were investigated. The residual oxygen content in the broth and the oxygen proportion in the headspace of package were decreased with the increase of broth temperature at filling into the pouch from 50 to 100. When the products were packaged as air-contained (Air), manually squeezed the upper side of package out to minimize the headspace (Degas) and flushed with nitrogen gas ($N_2$-Flushing) while maintaining the broth temperatures of Samgyetang at 50 or 85. The residual oxygen content and oxygen proportion were increased in the order of $N_2$-Flushing

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Measurement of Thermal Expansion Coefficient of Package Material Using Strain Gages (스트레인 게이지를 이용한 패키지 재료의 열팽창계수 측정)

  • Yang, Hee-Gul;Joo, Jin-Won
    • Journal of the Microelectronics and Packaging Society
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    • v.20 no.3
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    • pp.37-44
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    • 2013
  • It is well known that thermal deformation of electronic packages with Pb-Sn solder and with lead-free solder is significantly affected by material properties consisting the package, as well as those of the solder itself. In this paper, the method for determining coefficient of thermal expansion(CTE) of new material is established by using temperature characteristic of strain gages, and the CTE of molding compound are obtained experimentally. The temperature-dependent CTE of molding compound for Pb-Sn solder and that for lead-free solder are obtained by using strain measurements with well known steel specimen and aluminium specimen as reference specimens, and the CTE's are also measured non-contactly by using moire interferometry. Those results are compared, and the agreement between the two types of strain gage experiment and the moire experiment show the strain gage method used in this paper to be reliable. In the case of the molding compound for Pb-Sn solder, the CTE is measured as approximately $15.8ppm/^{\circ}C$ regardless of the temperature. In the case for the lead-free solder, the CTE is measured as of approximately $9.9ppm/^{\circ}C$ below the temperature of $100^{\circ}C$, and then the CTE is increased sharply depending on the temperature, and reaches to $15.0ppm/^{\circ}C$ at $130^{\circ}C$.

An Analysis of the Redistribution of Residual Stress Due to Crack Propagation Initially Through Residual Tensile Stress Field by Finite Element Method (인장잔류응력장으로부터 피로균열이 전파하는 경우 잔류응력의 재분포거동에 대한 해석적 검토)

  • 김응준;박응준;유승현
    • Journal of Welding and Joining
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    • v.21 no.7
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    • pp.71-77
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    • 2003
  • In this study, an investigation based on the superposition principle to predict residual stress redistribution caused by crack propagation itself initially through residual tensile stress field was performed by finite element method. The tendency in residual stress redistribution caused by crack propagation recognized both from the analytical results and experimental result was the residual stress concentration consecutively occurred in the vicinity of crack tip even the situation that the crack propagated to the region initially residual compressive stress existed. The software for the analysis is ABAQUS, which is a general purpose finite element package. The analytical method that attempt to take the plastic deformation at the crack tip due to tensile residual stress into the consideration of residual stress redistribution caused by crack propagation was proposed. The plastic zone size at the tip of fatigue crack and redistributed residual stresses were calculated by finite element method on the bases of the concept of Dugdale model. Comparing these analytical results with experimental results, it is verified that the residual stress redistribution caused by crack propagation can be predicted by finite element method with the proposed analytical method.

A Proposal of an Analytical Method for Estimating the Opening Behaviour of Tip-Closed Crack in Compressive Residual Stress by Finite Element Method (압축잔류응력에 의하여 선단부가 닫힌 균열의 개구거동에 대한 유한요소법에 의한 해석방법의 제안)

  • 김응준;박응준;유승현
    • Journal of Welding and Joining
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    • v.21 no.6
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    • pp.71-76
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    • 2003
  • For the purpose of clarifying the influence of welding residual stress to the fatigue crack propagations behaviour, an analytical investigation based on finite element method is performed to examine the opening behaviour of tip-closed crack in the compressive residual stress. A finite element model comprised of contact elements for the crack plane and plane stress elements for the base material is used to evaluate crack opening stress of the crack existing in the residual stress field. Also an analytical method based on the superposition principle to estimate the length of opened part of tip closed crack and the stress distribution adjacent to the crack during uploading is applied to the finite element model. The software for the analysis is ABAQUS, which is a general purpose finite element package. The results show that stresses distributed on the crack surfaces are reduced and approached to zero as the applied stresses are increased up to crack tip opening stress and no mechanical discontinuity is found at the boundary of contact elements and plane stress elements. It is verified that the opening behavior of the fatigue crack in the residual stress can be predicted by finite element method with the proposed analytical method.

Structural Safety Test and Analysis of Type IP-2 Transport Packages with Bolted Lid Type and Thick Steel Plate for Radioactive Waste Drums in a NPP (원자력발전소의 방사성폐기물 드럼 운반을 위한 볼트체결방식의 두꺼운 철판을 이용한 IP-2형 운반용기의 구조 안전성 해석 및 시험)

  • Lee, Sang-Jin;Kim, Dong-hak;Lee, Kyung-Ho;Kim, Jeong-Mook;Seo, Ki-Seog
    • Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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    • v.5 no.3
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    • pp.199-212
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    • 2007
  • If a type IP-2 transport package were to be subjected to a free drop test and a penetration test under the normal conditions of transport, it should prevent a loss or dispersal of the radioactive contents and a more than 20% increase in the maximum radiation level at any external surface of the package. In this paper, we suggested the analytic method to evaluate the structural safety of a type IP-2 transport package using a thick steel plate for a structure part and a bolt for tying a bolt. Using an analysis a loss or dispersal of the radioactive contents and a loss of shielding integrity were confirmed for two kinds of type IP-2 transport packages to transport radioactive waste drums from a waste facility to a temporary storage site in a nuclear power plant. Under the free drop condition the maximum average stress at the bolts and the maximum opening displacement of a lid were compared with the tensile stress of a bolt and the steps in a lid, which were made to avoid a streaming radiation in the shielding path, to evaluate a loss or dispersal of radioactive waste contents. Also a loss of shielding integrity was evaluated using the maximum decrease in a shielding thickness. To verify the impact dynamic analysis for free drop test condition and evaluate experimentally the safety of two kinds of type IP-2 transport packages, free drop tests were conducted with various drop directions. For the tests we examined the failure of bolts and the deformation of flange to evaluate a loss or dispersal of radioactive material and measured the shielding thickness using a ultrasonic thickness gauge to assess a loss of shielding integrity. The strains and accelerations acquired from tests were compared with those by analyses to verify the impact dynamic analysis. The analytic results were larger than the those of test so that the analysis showed the conservative results. Finally, we evaluated the safety of the type IP-2 transport package under the stacking test condition using a finite element analysis. Under the stacking test condition, the maximum Tresca stress of the shielding material was 1/3 of the yielding stress. Two kinds of a type IP-2 transport package were safe for the free drop test condition and the stacking test condition.

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A Study on the Development Strategy of the Foods Package Design (식품 패키지디자인 개발 전략에 관한 연구)

  • Choi, Jeong-Gye;Lee, Sang-Youn
    • The Korean Journal of Franchise Management
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    • v.2 no.2
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    • pp.45-69
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    • 2011
  • A basic function of packaging is preservability, delivery, subdivision, aesthetic and serviceability on packaging. Originally, the function and necessity of packaging is on preservability, but today it is expending before. then packaging is focusing on sales promotion. Although it is hard to say production itself, it could does when it is made. also, it is important for product to be goods when packaging and its materials are identification on matching each other. The role of packaging design is a core factor that satisfy consumer a various of needs and wants. In the past, the role of food packaging design is just preservability and delivery on product. but then, nawaday it is asked a various role. Not only present products have to get inherency but also have added value. That is, advanced technologies, information, and richness from materials which are diversity for coming a extention of choice. currently, food packaging design shouldn't have stayed on just packaging which cover beautiful. Packaging design is a symbolic sign. It is importance for manager to do R&D, producing, and distribution, also for consumer who use and buy the product whether manager and consumer think package design is a main mediation. This day, food design pay attention to be asking consumer's a number of sensitivity. It is the reason that the package is importance and exist. This article is to examine preservability, delivery, subdivision, aesthetic, serviceability, and environmental orientation in order to develop and show a method and theories to find package design in food industry the reason that why sales promotion and its profit increase. Consequently, draw on the function of package design effects the benefit on product is distribution. Green Design on the food packages by combining recycled and biodegradable food packages for the development of practices and long life to the look of the food package design practices.

Application of numerical simulation of submersed rock-berm structure under anchor collision for structural health monitoring of submarine power cables

  • Woo, Jinho;Kim, Dongha;Na, Won-Bae
    • Smart Structures and Systems
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    • v.15 no.2
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    • pp.299-314
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    • 2015
  • Submersed rock-berm structures are frequently used for protection of underwater lifelines such as pipelines and power cables. During the service life, the rock-berm structure can experience several accidental loads such as anchor collision. The consequences can be severe with a certain level of frequency; hence, the structural responses should be carefully understood for implementing a proper structural health monitoring method. However, no study has been made to quantify the structural responses because it is hard to deal with the individual behavior of each rock. Therefore, this study presents a collision analysis of the submersed rock-berm structure using a finite element software package by facilitating the smoothed-particle hydrodynamics (SPH) method. The analysis results were compared with those obtained from the Lagrange method. Moreover, two types of anchors (stock anchor and stockless anchor), three collision points and two different drop velocities (terminal velocity of each anchor and 5 m/s) were selected to investigate the changes in the responses. Finally, the effect of these parameters (analysis method, anchor type, collision point and drop velocity) on the analysis results was studied. Accordingly, the effectiveness of the SPH method is verified, a safe rock-berm height (over 1 m) is proposed, and a gauge point (0.5 m above the seabed) is suggested for a structural health monitoring implementation.

A Study on the Prediction of the Material Properties of Magnesium Alloys Using Density Functional Theory Method (밀도함수 이론법을 이용한 마그네슘 합금의 재료특성 예측에 관한 연구)

  • Baek, Min-Sook;Won, Dae-Hee;Kim, Byung-Il
    • Korean Journal of Materials Research
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    • v.17 no.12
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    • pp.637-641
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    • 2007
  • The total energy and strength of Mg alloy doped with Al, Ca and Zn, were calculated using the density functional theory. The calculations was performed by two programs; the discrete variational $X{\alpha}\;(DV-X{\alpha})$ method, which is a sort of molecular orbital full potential method; Vienna Ab-initio Simulation Package (VASP), which is a sort of pseudo potential method. The fundamental mixed orbital structure in each energy level near the Fermi level was investigated with simple model using $DV-X{\alpha}$. The optimized crystal structures calculated by VASP were compared to the measured structure. The density of state and the energy levels of dopant elements was discussed in association with properties. When the lattice parameter obtained from this study was compared, it was slightly different from the theoretical value but it was similar to Mk, and we obtained the reliability of data. A parameter Mk obtained by the $DV-X{\alpha}$ method was proportional to electronegativity and inversely proportional to ionic radii. We can predict the mechanical properties because $\Delta{\overline{Mk}}$is proportional to hardness.