• Proceedings of the Korean Radioactive Waste Society Conference
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• 2005.11a
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• pp.339-347
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• 2005

A type IP-2 transport package should prevent a loss or dispersal of the radioactive contents and a more than $20\%$ increase in the maximum radiation level at any external surface of the package when it were subjected to the drop test under the normal conditions of transport. If a shielding thickness of IP-2 transport package is thick, a bolted lid type may prevent a loss or dispersal of the radioactive contents than the door type of ISO containers which are generally used as a type IP-2 transport package. In this paper, to evaluate the effect of drop directions on the bolt tension and the coherence of a bolt, the drop tests of preliminary small model are tested and evaluated for seven directions before the drop test of a type IP-2 transport package with a bolted lid type under the normal conditions of transport. Seven drop directions which are a bottom-vertical drop, a lid-vortical drop. a horizontal drop and four corner drops have been carried out. Using a force sensor, the bolt tension during the drop impact is measured. The coherence of bolt is evaluated by the difference between the fastening torque of bolt before a drop test and the unfastening torque of bolt after a drop impact.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2007.04a
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• pp.37-47
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• 2007

Factor : Structure Metal pad & SMO size Board level TC test : - Large SMO size better Board level Drop test : - Large SMO size better Factor : Structure Substrate thickness Board level TC test : - Thick substrate better Board level Drop test : - Substrate thickness is not a significant factor for drop test Factor : Material Solder alloy Board level TC test : - Not so big differences over Pb-free solder and NiAu, OSP finish Board level Drop test : - Ni/Au+SAC105, CuOSP+LF35 are better Factor : Material Pad finish Board level TC test : - NiAu/NiAu is best Board livel Drop test : - CuOSP is best Factor : Material Underfill Board level TC test - Several underfills (reworkable) are passed TCG x500 cycles Board level Drop test : - Underfill lots have better performance than non-underfill lots Factor : Process Multiple reflow Board level TC test : - Multiple reflow is not a significant actor for TC test Board level Drop test : N/A Factor : Process Peak temp Board level TC test : - Higher peak temperature is worse than STD Board level Drop test : N/A Factor : Process Stack method Board level TC test : - No big difference between pre-stack and SMT stack Board level Drop test : - Flux dipping is better than paste dipping but failure rate is more faster

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2004.05a
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• pp.177-182
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• 2004

Electronic products are subjected to many different types of shock environment. As the Optical Disc Drive (ODD) market grows, the number of failures related to shock increases. Therefore, it is necessary to improve the performance of cushion package as well as the product design. Cushion materials such as expanded polystyrene are often used to protect electronic products from shock environment. In this paper, the drop analysis of the cushion package f3r optical disc drives was carried out with the explicit method of LS-DYNA and verified by the drop test. For the optimization of package, response surface approximation model was created using central composite design. As a result, cushioning performance was improved under the critical condition and practical design guidelines of cushion package were suggested.

• Journal of KSNVE
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• v.4 no.3
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• pp.345-352
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• 1994

Electronic products can be subjected to many different forms of shock. These shocks are usually experienced during transporting the electronic products from a manufacturer to customers. Drop tests are performed to test the product fragility before shipment. Package cushioning materials are often used to protect electronic products from severs shock environments. In the present paper, an algorithm to predict the shock responses of the main mechanical parts is developed by use of the shock analysis in which the modal parameters extracted from vibration test are used. These results are in good agreement with the results of drop test. By use of the shock response prediction algorithm developed herein, it is possible to predict the results of drop test at various drop directions and also to select the optimal package cushioning materials.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.35-41
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• 2011

Recently, board level solder joint reliability performance of IC packages during drop impact becomes a great concern to semiconductor and electronic product manufacturers. The handheld electronic products are prone to being dropped during their useful service life because of their size and weight. The IC packages are susceptible to solder joint failures, induced by a combination of printed circuit board (PCB) bending and mechanical shock during impact. The board level drop testing is an effective method to characterize the solder joint reliability performance of miniature handheld products. In this paper, applying the JEDEC (JESD22-B111) standard present a finite element modeling of the FBGA. The simulation results revealed that maximum stress was located at the outermost solder ball in the PCB or IC package side, which consisted well with the location of crack initiation observed in the failure analysis after drop reliability tests.

• Nuclear Engineering and Technology
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• v.53 no.6
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• pp.1878-1886
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• 2021

For industrial package (IP)-type transport containers for radioactive materials, a free drop test should be conducted under regulatory conditions. Owing to various uncertainties observed during the drop test, errors in drop angles inevitably occur. In IP-type metal transport containers in which the container directly impacts onto a rigid target without any shock absorbing materials, the error in the drop angle due to a slight misalignment makes a significant difference from the ideal drop. In particular, in a vertical drop, the error in the drop angle causes a strong secondary impact. In this paper, a numerical method is proposed to estimate the error in the drop angle occurring during the test. To determine this error, an optimization method accompanying a computational drop analysis is proposed, and a surrogate model is introduced to ensure calculation efficiency. Effectiveness of the proposed method is validated by performing the verification and comparison between the test and the analysis applied with the drop angle error.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.11
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• pp.1733-1740
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• 2010

The analysis of the dynamic behavior of the packaging of a drum washing machine has been carried out under the drop impact conditions. LS-DYNA software is used for performing the finite element analysis, and the validations are performed by comparing with the impact acceleration, effective stress and deformation of cushioned package with high-speed camera during free drop test. By analyzing the cushion characteristics and the design parameters of the original packaging, a packaging with an improved design is developed, and this design is validated on the basis of the results of the distribution test which consists of drop test, vibration test, stacking test, squeez test and so on. The drop impact simulation and analysis methods developed in this study can be adopted to successfully improve the cushioning provided by the packaging and to reduce the cost involved in developing new packaging for drum washing machines.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.10 no.1
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• pp.37-43
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• 2012

Radioactive waste transport package was developed to transport eight drums of low and intermediate level waste(LILW) in accordance with the IAEA and domestic related regulations. The package is classified with industrial package IP-2. IP-2 package is required to undergo a free drop test and a stacking test. After free drop and stacking tests, it should prevent the loss or dispersal of radioactive contents, and loss of shielding integrity which would result in more than 20 % increase in the radiation level at any external surface of the package. The objective of this study is to establish the safety test method and procedure for stacking test and to prove the structural integrities of the IP-2 package. Stacking test and analysis were performed with a compressive load equal to five times the weight of the package for a period of 24 hours using a full scale model. Strains and displacements were measured at the corner fitting of the package during the stacking test. The measured strains and displacements were compared with the analysis results, and there were good agreements. It is very difficult to measure the deflection at the container base, so the maximum deflection of the container base was calculated by the analysis method. The maximum displacement at the corner fitting and deflection at the container base were less than their allowable values. Dimensions of the test model, thickness of shielding material and bolt torque were measured before and after the stacking test. Throughout the stacking test, it was found that there were no loss or dispersal of radioactive contents and no loss of shielding integrity. Thus, the package was shown to comply with the requirements to maintain structural integrity under the stacking condition.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.12
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• pp.88-93
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• 2000

The reduction of the cushion material such as Expanded Polystyrene (EPS) is one of the urgent tasks of the package design process in home electrical appliances considering environmental protection. EPS reduction often causes the structural damage of products, which must be protected in the environment of transportation. CAE simulation can help the efficient package design with low material cost. The mechanical drop simulation of packaged product was performed with commercial FEM code and Taguchi approach was used partially to determine the dominant design parameters. As results of this study, about 20% reduction of EPS was accomplished in the monitor package design.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.5 no.3
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• pp.199-212
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• 2007

If a type IP-2 transport package were to be subjected to a free drop test and a penetration test under the normal conditions of transport, it should prevent a loss or dispersal of the radioactive contents and a more than 20% increase in the maximum radiation level at any external surface of the package. In this paper, we suggested the analytic method to evaluate the structural safety of a type IP-2 transport package using a thick steel plate for a structure part and a bolt for tying a bolt. Using an analysis a loss or dispersal of the radioactive contents and a loss of shielding integrity were confirmed for two kinds of type IP-2 transport packages to transport radioactive waste drums from a waste facility to a temporary storage site in a nuclear power plant. Under the free drop condition the maximum average stress at the bolts and the maximum opening displacement of a lid were compared with the tensile stress of a bolt and the steps in a lid, which were made to avoid a streaming radiation in the shielding path, to evaluate a loss or dispersal of radioactive waste contents. Also a loss of shielding integrity was evaluated using the maximum decrease in a shielding thickness. To verify the impact dynamic analysis for free drop test condition and evaluate experimentally the safety of two kinds of type IP-2 transport packages, free drop tests were conducted with various drop directions. For the tests we examined the failure of bolts and the deformation of flange to evaluate a loss or dispersal of radioactive material and measured the shielding thickness using a ultrasonic thickness gauge to assess a loss of shielding integrity. The strains and accelerations acquired from tests were compared with those by analyses to verify the impact dynamic analysis. The analytic results were larger than the those of test so that the analysis showed the conservative results. Finally, we evaluated the safety of the type IP-2 transport package under the stacking test condition using a finite element analysis. Under the stacking test condition, the maximum Tresca stress of the shielding material was 1/3 of the yielding stress. Two kinds of a type IP-2 transport package were safe for the free drop test condition and the stacking test condition.