• Korean Journal of Medicinal Crop Science
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• v.25 no.2
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• pp.89-94
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• 2017

Background: The purpose of improving the quality of oriental medicinal herbs is to contribute to the improvement of the income of farm. The present study investigated the effect of reasonable drying methods, different storage conditions and packageing materials on quality and stability of Scutellaria baicalensis Georgi and for developing GAP (good agricultural practice) guide book. Methods and Results: Three methods of drying Scutellaria baicalensis roots produced over two years were used to estimate loss rate owing to drying, storage, and packaging. The methods of drying were categorized into natural drying (36 - 60 h by sunshine), drying with heat dryer (2 - 10 h), or drying with gas bulk dryer (2 - 10 h). After cleaning, and initial drying for a few days under controlled temperature conditions, the second phase of drying was carried out at 35, 45 and $55^{\circ}C$. Changes in hunter color values and quality under the two studied storage treatments (at $20^{\circ}C$ indoors and at $4^{\circ}C$ in a refigerator) were evaluated. Storage period for 60, 120, and 180 days in three packaging materials, PE (polyethylene package), PP (polypropylene gunnysack), and WP (watertight packing paper) were studied. Conclusions: Initial cleaning, reasonable gas drying and hot air drying, and drying in an oven at 35 and $45^{\circ}C$ after cutting the roots resulted in the lowest loss rates in S. Baicalensis root. Hunter color valuse indicated that stroage of dry roots at room temperature was better than PP packaging, and that cold stroage was better than PE packaging for long-term stability.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.28 no.7
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• pp.1-12
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• 2014

This paper is proposed to design the new heat-sink apparatus for improving the heat transfer characteristics in the power LED chip, and results of the operation characteristics were discussed. The core design is that the soldering through-hole on the FR-4 PCB board is formed to the effective heat transfer. That is directly filled with Ag-nano materials, which shows the high thermal conductivity. The heat transfer medium consisting of Ag-nano materials is classified into two structures. Mediums are called as the heat slug and the multi-pin in this work. The heat of the high temperature generated from the LED chip was directly transferred to the heat slug of the one large size. And the accumulated heat from the heat slug was quickly dissipated by the medium of the multi-pin, which is the same body with the heat slug. This multi-pin was designed for the multi-dissipation of heat by increasing the surface areas with a little pins. Subsequently, the speed of the heat transfer with this new heat-sink apparatus is three times faster than the conventional heat-sink. Therefore, the efficiency of the illuminating light will be improved by adapting this new heat-sink apparatus in the large area's LED.